CPC1219Y LITTELFUSE | Alldatasheet
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Security Passive Infrared Detectors (PIR) Data Signalling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Energy Meters Medical Equipment—Patient/Equipment Isolation Industrial Controls Designed for use in Security Systems Complying with EN50130-4 Voltage-Controlled Operation 2500V rms Input/Output Isolation 100% Solid State No EMI/RFI Generation Immune to Radiated EM Fields Small 4-Pin SIP Package The CPC1219Y is a voltage-controlled, single-pole, normally closed (1-Form-B) optically coupled solid state relay in a 4-pin Single In-line Package (SIP). IXYS Integrated Circuits Division's patented OptoMOS architecture makes available the optically coupled technology necessary to activate the output's efficient MOSFET switches while providing a 2500V rms input-to-output isolation barrier. Control of the isolated output is accomplished by means of a highly efficient infrared LED at the input. An internal resistor in series with the LED enables the voltage-controlled operation of the input. Because the input is solid state there is no need for snubbers or "catch" diodes to suppress the inductive fly-back transient voltage normally associated with EMR coils. CPC1219Y Pinout Switching Characteristics of Normally Closed Devices Approvals TUV EN 62368-1: Certificate # B 082667 0008 Load LoadIN + IN - 12 3 4 Form-B VIN ILOAD 10% 90% toff ton
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R08 CPC1219Y Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Voltage 15 V Input Power Dissipation 225 mW T otal Power Dissipation 1 800 mW Isolation Voltage, Input to Output 2500 V rms Operational T emperature, Ambient -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate output power linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage I L=1A, V DRM 60 - - V Load Current Continuous 1 -I L - - 200 mA rms / mADC Peak t ≤10ms I LPK - - ±400 mA P On-Resistance 2 VIN=0V , IL=200mA R ON -- 1 6 Off-State Leakage Current V IN=5V , VL=60VP ILEAK --1 A Switching Speeds T urn-On (Output Closed) VIN = 5V , VL = 10V ton --5m s T urn-Off (Output Open) t off --5m s Output Capacitance V IN=5V , VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Voltage Recommended Operating Range I L=200mA V IN 5- 1 2 V Output Open - - 3.75 Output Closed 1 - - Reverse Input Current V IN = -5V I R -- 1 0 A Input Resistor - - 900 1000 1100 Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Load current derates linearly from 200mA @ 25oC to 125mA @85oC. 2 Measurement taken within 1 second of on-time. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION CPC1219Y www.ixysic.com 3R08 Turn-On (ms) Device Count (N) Typical Turn-On Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Device Count (N) Typical On-Resistance Distribution (N=50, VIN=0V, IL=100mA, TA=25ºC) On-Resistance (:) VIN (V) Device Count (N) Typical VIN for Switch Operation (N=50, IL=100mA, TA=25ºC) V IN (V) Device Count (N) Typical VIN for Switch Dropout (N=50, IL=100mA, TA=25ºC) 89 91 93 9590 92 94 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, VIN=5V, TA=25ºC) VIN (V) Turn-Off (ms) 0 2468 1 0 1 2 1 4 1 6 1 8 2.1 1.8 1.5 1.2 0.9 0.6 0.3 Typical Turn-Off vs. VIN (IL=100mA, TA=25ºC) VIN (V) -40 1.30 1.28 1.26 1.24 1.22 1.20 1.18 -20 0 20 40 60 80 100 Temperature (ºC) Typical VIN for Switch Dropout vs. Temperature (IL=100mA) Turn-Off (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-Off vs. Temperature (VIN=5V, IL=100mA) VIN (V) Turn-On (ms) 0 51 0 1 5 2 0 0.54 0.53 0.52 0.51 0.50 0.49 0.48 0.47 0.46 0.45 0.44 Typical Turn-On vs. VIN (IL=100mA, TA=25ºC) VIN (V) -40 -20 0 20 40 60 80 100 1.32 1.30 1.28 1.26 1.24 1.22 1.20 Temperature (ºC) Typical VIN for Switch Operation vs. Temperature (IL=100mA) Turn-On (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-On vs. Temperature (VIN=5V, IL=100mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R08 CPC1219Y -40 -20 0 20 40 60 80 100 Steady State Temperature (ºC) On-Resistance (:) Typical On-Resistance vs. Temperature (VIN=0V, IL=Max Rated @ Temperature) Load Voltage (V) Load Current (mA) 200 -200 100 -150 150 -50 -100 0.75-0.25 Typical Load Current vs. Load Voltage (VIN=0V, TA=25ºC) Load Current (mA) 225 200 175 150 125 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 Typical Maximum Load Current vs. Temperature (VIN=0V) Blocking Voltage (VP) -40 104 102 100 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature (VIN=5V) Leakage (PA) -40 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 1&4 (VIN=5V, VL=60V) Time Load Current (mA) 10Ps 500 450 400 350 300 250 200 150 100 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION CPC1219Y www.ixysic.com 5R08 Manufacturing Information ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles CPC1219Y 260ºC 245ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION Specification: DS-CPC1219Y -R08 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/20256 CPC1219Y For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. MECHANICAL DIMENSIONS CPC1219Y DIMENSIONS mm (inches) 19.202 ± 0.381 (0.756 ± 0.015) 6.401 ± 0.127 (0.252 ± 0.005) 5.944 ± 0.127 (0.234 ± 0.005) 2.642 ± 0.127 (0.104 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 0.457 ± 0.076 (0.128 ± 0.004) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.013 (0.010 ± 0.0005) 5.08 (0.200) 10.16 (0.400) 15.24 (0.600) 1.30 (0.051) FINISHED HOLE
0.80 DIA x4
(0.031 DIA x4) Pin 1 Pin 7 PCB Hole Pattern