CPC1218Y LITTELFUSE | Alldatasheet
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Security Passive Infrared Detectors (PIR) Data Signalling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Energy Meters Medical Equipment—Patient/Equipment Isolation Industrial Controls Voltage-Controlled Operation Designed for use in Security Systems Complying with EN50130-4 2500Vrms Input/Output Isolation 100% Solid State Matches Popular Reed Relay Pin-Out TTL/CMOS Compatible Input No EMI/RFI Generation Immune to Radiated EM Fields Small 4-Pin SIP Package The CPC1218Y is a miniature voltage-controlled, single-pole, normally open (1-Form-A) Solid State Relay in a 4-pin Single In-line Package (SIP) that employs optically coupled MOSFET technology to provide 2500V rms of input to output isolation. The super efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture. The optically-coupled output is controlled by the input's highly efficient infrared LED with a built- in series resistor to provide input voltage-controlled operation. Featuring a pin-out that matches many popular reed relays, CPC1218Y is a "drop-in" solid state replacement. Because the input is solid state there is no need for snubbers or "catch" diodes to suppress the inductive fly-back transient voltage normally associated with EMR coils. CPC1218Y Pinout Switching Characteristics of Normally Open Devices Approvals TUV EN 62368-1: Certificate # B 082667 0008 1234 – + Form-A VIN ILOAD 10% 90% ton toff
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R08 CPC1218Y Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 VP Reverse Input Voltage 5 V Input Control Voltage 15 V Input Power Dissipation 225 mW T otal Power Dissipation 1 800 mW Isolation Voltage, Input to Output 2500 V rms Operational T emperature, Ambient -40 to +85 ºC Storage T emperature -40 to +125 ºC 1 Derate output power linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage IL=1A, VDRM 60 - - V Load Current Continuous 1 VIN=5V IL - - 600 mA rms / mADC Peak t=10ms ILPK - - ±1 AP On-Resistance 2 IL=600mA RON - - 1.1 Off-State Leakage Current VL=60VP ILEAK --1 A Switching Speeds T urn-On V IN=5V , VL=10V ton --5 ms T urn-Off t off --5 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Voltage Recommended Operating Range I L=600mA VIN 5- 1 2 V Output Closed - - 3.75 Output Open 1 - - Reverse Input Current VR=5V IR -- 1 0 A Input Resistor - - 900 1000 1100 Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Load current derates linearly from 600mA @25oC to 480mA @85oC with VIN=10V. 2 Measurement taken within 1 second of on-time. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION CPC1218Y www.ixysic.com 3R08 Turn-On (ms) Device Count (N) Typical Turn-On Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Device Count (N) Typical On-Resistance Distribution (N=50, VIN=5V, IL=100mA, TA=25ºC) On-Resistance (:) Input Voltage (V) Device Count (N) Typical VIN for Switch Operation (N=50, IL=100mA, TA=25ºC) Input Voltage (V) Device Count (N) Typical VIN for Switch Dropout (N=50, IL=100mA, TA=25ºC) Device Count (N) Blocking Voltage (VP) Typical Blocking Voltage Distribution (N=50, TA=25ºC) VIN (V) Turn-Off (ms) 0 2 4 6 8 10 12 14 16 18 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-Off vs. VIN (IL=100mA) VIN (V) -40 1.45 1.40 1.35 1.30 1.25 1.20 1.15 -20 0 20 40 60 80 100 Temperature (ºC) Typical VIN for Switch Dropout vs. Temperature (IL=100mA) Turn-Off (ms) -40 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -20 0 20 40 60 80 100 VIN = 5V VIN = 10V Temperature (ºC) Typical Turn-Off vs. Temperature (IL=100mA) VIN (V) Turn-On (ms) 0 51 0 1 5 2 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-On vs. VIN (IL=100mA) VIN (V) -40 -20 0 20 40 60 80 100 1.45 1.40 1.35 1.30 1.25 1.20 1.15 Temperature (ºC) Typical VIN for Switch Operation vs. Temperature (IL=100mA) VIN = 5V VIN = 10V Turn-On (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-On vs. Temperature (IL=100mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R08 CPC1218Y -40 1.0 0.8 0.7 0.6 0.5 0.4 0.3 -20 0 20 40 60 80 100 Steady State VIN = 10V VIN = 5V Temperature (ºC) On-Resistance (:) 0.9 Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) Load Voltage (V) Load Current (mA) 600 400 200 -200 -400 -600 Typical Load Current vs. Load Voltage (VIN=5V, TA=25ºC) Load Current (A) 0.80 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40 0.35 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 VIN =5V VIN =10V Typical Maximum Load Current vs. Temperature -40 -20 0 20 40 60 80 100 Temperature (ºC) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 1&4 (VL=Max Rated) Time Load Current (A) 10Ps 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION CPC1218Y www.ixysic.com 5R08 Manufacturing Information ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles CPC1218Y 260ºC 245ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integ rated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION Specification: DS-CPC1218Y -R08 ©Copyright 2025 Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/20256 CPC1218Y For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. MECHANICAL DIMENSIONS DIMENSIONS mm (inches) 19.202 ± 0.381 (0.756 ± 0.015) 6.401 ± 0.127 (0.252 ± 0.005) 5.944 ± 0.127 (0.234 ± 0.005) 2.642 ± 0.127 (0.104 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 0.457 ± 0.076 (0.128 ± 0.004) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.013 (0.010 ± 0.0005) 5.08 (0.200) 10.16 (0.400) 15.24 (0.600) 1.30 (0.051) FINISHED HOLE
0.80 DIA x4
(0.031 DIA x4) Pin 1 Pin 7 PCB Hole Pattern CPC1218Y