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Technical content
GROSS DIE PER 5 INCH WAFER 35,100 PROCESS CP704V Small Signal Transistors PNP - High Current Transistor Chip Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 4.2 x 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å www.centralsemi.com R1 (22-March 2010)
Typical Electrical Characteristics www.centralsemi.com R1 (22-March 2010)