CP329-MPSA29 CENTRAL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
NPN - Darlington Transistor Die
0.5 Amp, 100 Volt
MECHANICAL SPECIFICATIONS: Die Size 26.8 x 26.8 MILS Die Thickness 7.1 MILS Base Bonding Pad Size 4.2 x 4.2 MILS Emitter Bonding Pad Size 4.3 x 4.3 MILS Top Side Metalization Al – 13,000Å Back Side Metalization Au-As – 9,000Å Scribe Alley Width 2.0 MILS Wafer Diameter 5 INCHES Gross Die Per Wafer 23,674 R0 (23-August 2018) The CP329-MPSA29 die is a silicon NPN Darlington power transistor designed for high gain amplifi er applications. MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Collector-Base Voltage V CBO 100 V Collector-Emitter Voltage V CES 100 V Emitter-Base Voltage V EBO 12 V Continuous Collector Current I C 0.5 A Operating and Storage Junction Temperature T J, Tstg -65 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN MAX UNITS ICBO V CB=80V 100 nA ICES V CE=80V 500 nA IEBO V EB=10V 100 nA BVCBO I C=100µA 100 V BVCES I C=100µA 100 V BVEBO I E=10µA 12 V VCE(SAT) I C=10mA, IB=10µA 1.2 V VCE(SAT) I C=100mA, IB=100µA 1.5 V VBE(ON) V CE=5.0V, IC=100mA 2.0 V hFE V CE=5.0V, IC=10mA 10K hFE V CE=5.0V, IC=100mA 10K fT V CE=5.0V, IC=10mA, f=100MHz 125 MHz Cob V CB=10V, IE=0, f=1.0MHz 8.0 pF BACKSIDE COLLECTOR R0 E B www.centralsemi. com
Typical Electrical Characteristics R0 (23-August 2018) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time.
- Supply management (Customer portals) • Custom bar coding for shipments
- Inventory bonding • Custom product packing
- Consolidated shipping options CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask.
- Free quick ship samples (2nd day air) • Special wafer diffusions
- Online technical data and parametric search • PbSn plating options
- SPICE models • Package details
- Custom electrical curves • Application notes
- Environmental regulation compliance • Application and design sample kits
- Customer specific screening • Custom product and package development
- Up-screening capabilities (001) REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). www.centralsemi.com