CMZB47

CMZB27 TOSHIBA | Alldatasheet

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CMZB12~CMZB53 2013-11-01 1 TOSHIBA Zener Diode Silicon Diffused Type CMZB12~CMZB53 ○ Communication, Control and Measurement Equipment ○ Constant Voltage Regulation ○ Transient Suppressors

• Average power dissipation: P = 1.0 W
• Zener voltage: VZ = 12 to 53 V
• Suitable for high-density board assembly due to the use of a small surface-mount package, M−FLATTM Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power dissipation P 1.0 (Note 1) W Junction temperature Tj −40 to 150 °C Storage temperature range Tstg −40 to 150 °C Note 1: Ta = 40°C Device mounted on a glass-epoxy board Board size: 50 mm × 50 mm Soldering size: 6 mm × 6 mm Board thickness: 1.6 mm Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature / current / voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Unit: mm ① ANODE ② CATHODE 0.16 4.7 ± 0.2 3.8 ± 0.1 0 ~ 0.1 0.98 ± 0.1 1.75 ± 0.1 + 0.2 − 0.1 2.4 JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Start of commercial production 2005-09

CMZB12~CMZB53 2013-11-01 2 Electrical Characteristics (Ta = 25°C) Zener Voltage Vz (V) Zener Impedance rd (Ω) Temperature Coefficient Of Zener Forward Voltage VF (V) Reverse Current IR (μA) αT (mV/°C) Type Min Typ. Max Measure- ment Current IZ (mA) Max Measure- ment Current IZ (mA) Typ. Max Max Measure- ment Current IF (A) Max Measure- ment Voltage VR (V) CMZB12 10.8 12 13.2 10 30 10 8 13 1.2 0.2 10 8 CMZB13 11.7 13 14.3 10 30 10 9 14 1.2 0.2 10 9 CMZB15 13.5 15 16.5 10 30 10 11 17 1.2 0.2 10 10 CMZB16 14.4 16 17.6 10 30 10 12 19 1.2 0.2 10 11 CMZB18 16.2 18 19.8 10 30 10 14 23 1.2 0.2 10 13 CMZB20 18.0 20 22.0 10 30 10 16 26 1.2 0.2 10 14 CMZB22 19.8 22 24.2 10 30 10 18 28 1.2 0.2 10 16 CMZB24 21.6 24 26.4 10 30 10 20 32 1.2 0.2 10 17 CMZB27 24.3 27 29.7 10 30 10 23 36 1.2 0.2 10 19 CMZB30 27.0 30 33.0 10 30 10 25 40 1.2 0.2 10 21

CMZB12~CMZB53 2013-11-01 3 Marking Abbreviation Code Part No. Abbreviation Code Part No. B12 CMZB12 B30 CMZB30 B13 CMZB13 B33 CMZB33 B15 CMZB15 B36 CMZB36 B16 CMZB16 B39 CMZB39 B18 CMZB18 B43 CMZB43 B20 CMZB20 B47 CMZB47 B22 CMZB22 B51 CMZB51 B24 CMZB24 B53 CMZB53 B27 CMZB27 Standard Soldering Pad Handling Precaution 1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a moment. Do not exceed any of these ratings. Th e following are the general derating methods that we recommend when you design a circuit with a device. P: We recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipation. Carry out adequate heat design. PRSM: We recommend that a device be used within the recommended area in the figure, PRSM-tw. T j: Derate this rating when using a devi ce in order to ensure high reliability. We recommend that the device be used at Tj of below 120°C. 2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a so ldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. 3.0 1.4 2.1 Unit: mm 1.4

CMZB12~CMZB53 2013-11-01 4 0.001 100010 0.1 100 1000 0.01 0.1 1 100 26 58 42 30 34 38 46 CMZB30 to CMZB53 50 54 15 20 25 30 CMZB12 to CMZB27 100 1000 0.1 1 100 0.2 160 120 Ta max – P Maximum allowable temperature Ta max (°C) Power dissipation P (W) P RSM – tW (reference value) Non-repetitive peak reverse Power dissipation P RSM (W) Pulse width t W ( m s ) αT – VZ (typ.) Temperature coefficient of Zener voltage αT ( m V / ° C ) Zener voltage V Z (V) αT – VZ (typ.) Temperature coefficient of Zener voltage αT (mV/°C) Zener voltage V Z ( V ) Recommended Ta = 25°C Rectangular pulse PRSM tW Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 mm rth (j-a) – t Transient thermal impedance r th (j-a) (°C/W) Time t (s) Device mounted on a ceramic board: Board size: 50 mm × 50 mm Soldering land: 2.0 mm × 2.0 mm Board thickness: 0.64 mm Device mounted on a glass-epoxy board: Board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm Board thickness: 1.6 mm Device mounted on a glass-epoxy board: Board size: 50 mm × 50 mm Soldering land: 2.1 mm × 1.4 mm Board thickness: 1.6 mm

CMZB12~CMZB53 2013-11-01 5 RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collect ively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduc ed without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
• The information contained herein is pres ented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WH ATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.