CMX CRYDOM | Alldatasheet

Document overview

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Technical content

Do not forget to visit us at: www.crydom.com Copyright © 2017 Crydom Inc. Specifications subject to change without notice. CMX Series

  • SIP SSR
  • Ratings to 20A @ 60 VDC, 10A @ 100 VDC, 10A @ 60 VDC and 3A @ 200 VDC
  • MOSFET output
  • DC control
  • Low on-state impedance
  • CE Compliant to EN60950-1 PRODUCT SELECTION Control Voltage 3-10 VDC OUTPUT SPECIFICATIONS (1)(5)

Description

Operating Voltage [VDC] 0-60 Maximum Off-State Leakage Current @ Rated Voltage [/uni03BCAdc] 100 Maximum Load Current [Arms] 20 Minimum Load Current [mArms] 2 Maximum On-State Resistence [Ohm] (2) .0033 Maximum Surge Current (10msec) [Apk] 200 Maximum On-State Voltage Drop @ Rated Current [VDC] 0.1 INPUT SPECIFICATIONS (1) CMXEDescription Control Voltage Range 20-28 VDC

20 VDC

12 mAdc @ 24 VDC Maximum Turn-Off Time [/uni03BCsec]

780 Ohm

Minimum Turn-Off Voltage 1 .0 VDC Maximum Turn-On Time [msec] 1.0 CMX 3.0-10.0 VDC

3.0 VDC

15 mAdc @ 5 VDC

300 Ohm

1 .0 VDC 1.0 GENERAL SPECIFICATIONS ParametersDescription Dielectric Strength, Input/Output (50/60Hz) (3) 2500 Vrms Minimum Insulation Resistance (@ 500 VDC) (3) 109 Ohms Maximum Capacitance, Input/Output 15 pF Ambient Operating Temperature Range (4) -30ºC to 80ºC Ambient Storage Temperature Range (4) -30ºC to 125ºC 0.4 oz. (11g)Weight (typical) Thermally Conductive EpoxyEncapsulation Meet the requirements of IEC60335-1Enclosure and PCB GENERAL NOTES 1) All parameters at 25°C unless otherwise specified. 2) @ rated current (RDS-ON) 3) Dielectric and insulation resistance are measured between input and output 5) Inductive loads should be diode suppressed 4) Low temperature range is limited to -10°C in 20Amps models 6) At 55 Vdc

20 A10 A 10 A

6 A3 A 5 A

CMX60D10 CMX60D20CMX100D10CMXE200D3 CMXE60D5 CMX100D6 0-60 100 .10 0.5 0-60 100(6) .018 100 0.18 0-100 100 .010 100 0.1 0-200 100 0.20 0.6 0-100 100 .040 100 0.24

Do not forget to visit us at: www.crydom.com Copyright © 2017 Crydom Inc. Specifications subject to change without notice. WIRING DIAGRAM THERMAL DERATE INFORMATION Load can be wired in location A or B A +VDC +VDC -VDC -VDC B LOAD LOAD2 CONTROL CIRCUIT AMBIENT TEMPERATURE (ºC) 20 40 60 80 LOAD CURRENT (AMPS) CMX100D6 CMX200D3 CMX60D5 AMBIENT TEMPERATURE (ºC) 20 40 60 80 LOAD CURRENT (AMPS) CMX60D10 CMX100D10 AMBIENT TEMPERATURE (ºC) 20 40 60 80 LOAD CURRENT (AMPS) CMX60D20

Do not forget to visit us at: www.crydom.com Copyright © 2017 Crydom Inc. Specifications subject to change without notice. Designed in accordance with the requirements of IEC 62314 IEC60335-1: Resistance to heat and fire meets the requirements of section 30, evaluated by TUV SUD. Glow Wire Test, per requirements of IEC/EN 60695-2-10 and IEC/EN 60695-2-11 Ball Pressure Test, per requirements of IEC/EN 60695-10-2 AGENCY APPROVALS Rev. 060117 Agency Approvals E116950 (3 Amps, 6 Amps and 10 Amps Models) MECHANICAL SPECIFICATIONS Tolerances: ±0.02 in / 0.5 mm All dimensions are in: inches [millimeters] 1.00 MAX (25.4) .300 TYP . (7.6) .050 TYP . (1.3) .300 (7.6) .100 (2.5) .040 (1.0) DIA. (4 PLACES) PIN 1: +DC LOAD PIN 2: -DC LOAD PIN 3: +DC CONTROL PIN 4: -DC CONTROL PIN 1: +DC LOAD PIN 2: -DC LOAD PIN 3: +DC CONTROL PIN 4: -DC CONTROL .200 (5.1) 4 3 2 1 1.70 (43.1) 1.100 (27.9) .700 (17.8) 1.00 MAX (25.4) .300 TYP . (7.6) .050 TYP . (1.3) .300 MAX (7.6) .100 (2.5) .080 (2.0) DIA. (4 PLACES) .200 (5.1) 4 3 2 1 1.70 MAX (43.1) 1.100 (27.9) .700 (17.8)

Do not forget to visit us at: www.crydom.com Copyright © 2017 Crydom Inc. Specifications subject to change without notice. Rev 073015 DANGER / PELIGRO / DANGER /GEFAHR / PERICOLO / 危险 HAZARD OF ELECTRIC SHOCK, EXPLOSION, OR ARC FLASH.

  • Disconnect all power before installing or working with this equipment.
  • Verify all connections and replace all covers before turning on power. Failure to follow these instructions will result in death or serious injury. RIESGO DE DESCARGA ELECTRICA O EXPLOSION.
  • Desconectar todos los suministros de energia a este equipo antes de trabajar con este equipo.
  • Verificar todas las conexiones y colocar todas las tapas antes de energizer el equipo. El incumplimiento de estas instrucciones puede provocar la muerte o lesiones serias. RISQUE DE DESCHARGE ELECTRIQUE OU EXPLOSION
  • Eteindre toutes les sources d'énergie de cet appareil avant de travailler dessus de cet appareil
  • Vérifier tous connections, et remettre tous couverts en olace avant de mettre sous De non-suivi de ces instructions provoquera la mort ou des lésions sérieuses sérieuses. GEFAHR EINES ELEKTRISCHE N SCHLAGES ODER EINER EXPLOSION.
  • Stellen Sie jeglichen Strom ab, der dieses Gerät versorgt, bevor Sie an dem Gerät Arbeiten durchführen
  • Vor dem Drehen auf Energie alle Anschlüsse überprüfen und alle Abdeckungen ersetzen. Unterlassung dieser Anweisungen können zum Tode oder zu schweren Verletzungen führen. 存在电击、 爆炸或电弧 闪烁危险
  • 在操作此设 备之前请先 关闭电源。 若不遵守这些说明， 可能会导致严重的 人身伤害甚至死亡。 WARNING / AVERTISSEMENT / WARNUNG /ADVERTENCIA / AVVERTENZA / 警告 RISK OF MATERIAL DAMAGE AND HOT ENCLOSURE
  • The product's side panels may be hot, allow the product to cool before touching.
  • Follow proper mounting instructions including torque values.
  • Do not allow liquids or foreign objects to enter this product. Failure to follow these instructions can result in serious injury, or equipment damage. RISQUE DE DOMMAGE MATERIEL ET DE SURCHAUFFE DU BOITIER
  • Les panneaux latéraux du produit peuvent être chauds. Laisser le produit refroidir avant de le toucher.
  • Respecter les consignes de montage, et notamment les couples de serrage.
  • Ne pas laisser pénétrer de liquide ni de corps étrangers à l'intérieur du produit. Le non-respect de cette directive peut entraîner, des lésions corporelles graves ou des dommages matériels. Die Nichtbeachtung dieser Anweisung kann Körperverletzung oder Materialschäden zur Folge haben. GEFAHR VON MATERIALSCHÄDEN UND GEHÄUSEERHITZUNG
  • Die Seitenwände können heiß sein. Lassen Sie das Produkt abkühlen, bevor Sie es berühren.
  • Beachten Sie die Montageanweisungen,
  • Führen Sie keine Flüssigkeiten oder Fremdkörper in das Produkt ein. Si no se respetan estas precauciones pueden producirse graves lesiones, daños materiales. RIESGO DE DAÑOS MATERIALES Y DE SOBRECALENTAMIENTO DE LA UNIDAD
  • Los paneles laterales del producto pueden estar calientes. Esperar que el producto se enfríe antes de tocarlo.
  • Respetar las instrucciones de montaje, y en particular los pares de apretado.
  • No dejar que penetren líquidos o cuerpos extraños en el producto. 如不能正确执行这些操作说明， 极有可能造成严重人体伤害或者设备的损坏。 材料损坏和高温外壳的危险性
  • 产品的一侧面板可能很热，在其冷却前请 不要触碰。
  • 遵照正确的安装说明，包括扭矩值。
  • 请勿让液体及其他异物进入本产品。 RISCHIO DI SCOSSA ELETTRICA O DELL’ESPLOSIONE.
  • Spenga tutta l'alimentazione che fornisce questa apparecchiatura prima di lavorare a questa apparecchiatura
  • Verificare tutti i collegamenti e sostituire tutte le coperture prima dell’accensione L'omissione di queste istruzioni provocherà la morte o lesioni serie La mancata osservanza di questa precauzione può causare gravi rischi per l'incolumità personale o danni alle apparecchiature. RISCHIO DI DANNI MATERIALI E D'INVOLUCRO CALDO
  • I pannelli laterali dell'apparecchio possono scottare; lasciar quindi raffreddare il prodotto prima di toccarlo.
  • Seguire le istruzioni di montaggio corrette.
  • Non far entrare liquidi o oggetti estranei in questo apparecchio.

Do not forget to visit us at: www.crydom.com Copyright © 2017 Crydom Inc. Specifications subject to change without notice. ANNEX - ENVIROMENTAL INFORMATION The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products. Part Name Toxic or hazardous Substance and Elements Lead Mercury Cadmium Hexavalent Polybrominated Polybrominated (Pb) (Hg) (Cd) Chromium (Cr (VI)) biphenyls (PBB) diphenyl ethers (PBDE) Semiconductor die Solder 附件 - 环保信息 此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和国电子行业标准 SJ/T11364 - 2006, 电子信息产品污染控制标识要求。 有毒有害物质或元素件部 名称 铅 汞 镉 六价铬 多溴联苯 多溴二苯醚 (Pb) (Hg) (Cd) (Cr (VI)) (PBB) (PBDE) 半导体芯片 焊接点