CMWX1ZZABZ-078_V01 MURATA | Alldatasheet

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Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Sub-G Module Data Sheet Sample Part Number: CMWX1ZZABZ-TEMP CMWX1ZZABZ-TEMP-1 MP Part Number: CMWX1ZZABZ-078 CMWX1ZZABZ-091

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

Revision History

Code Date Description Comments A June 8, 2016 Initial Draft B July 1, 2016 Updated height and package info C July 30, 2016 Revised some formats and ΔRF_OPH_V test cond ition Characteristics. Added the recommended land pattern. D Aug 29, 2016 Updated the RF performance, Electrical Characteristics and power up sequence. E Sep 28, 2016 Amended the pin description of PA0/WKUP1 F Oct 12, 2016 Amended the pin description of PA3 and PA2 Added label information G Oct 13, 2016 Amended the pin description of MCU_nRST and BOOT0. H Nov 7, 2016 Added Sample Part Number and MP Part Number I Dec 1, 2016 Added weight info J Dec 12, 2016 Added Sleep current info K Feb 14, 2017 Added FCC and IC statements L June 6, 2017 Updated Part number M Nov 7, 2017 Revised document title Added Sample Part Number and MP Part Number Added SIGFOX Transceiver Specification Added reference schematic for SigFox modem usage. N Dec 21, 2017 Added supplemental comments to Electrical Characterisitics. O Jan 12, 2018 Revised reference schematic for LoRa usage P May 14, 2018 Revised Label information R July 4, 2019 Revised Label information by adding Anatel ID S Feb 18,2020 Revised Label information by adding part number T Feb 23,2021 Revised operating condition U Apr 6,2021 Revised operating condition V Apr 21,2021 Label Picture W Sep 02,2021 Label Information X Oct 14, 2021 Label Information Y Mar 3 ,2023 Label information change in page 8 New JRL number

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. TABLE OF CONTENTS

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 1. Features Interfaces : I2C, UART, USB, SPI Main ICs : STM32L, SX1276 Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm) and 32.768KHz clock (frequency error=±20 ppm) Supported Frequencies : 868 MHz, 915 MHz Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max) Weight : 0.48g (Typ) Package : Metal Shield can RoHS : This module is compliant with the RoHS directive 2. Part Number Ordering Part Number MCU Secure element Description CMWX1ZZABZ-TEMP STM32L082 NA Engineering sample CMWX1ZZABZ-EVK STM32L082 NA Evaluation board CMWX1ZZABZ-078 STM32L082 NA MP P/N CMWX1ZZABZ-TEMP-1 STM32L072 NA Engineering sample CMWX1ZZABZ-EVK-1 STM32L072 NA Evaluation board CMWX1ZZABZ-091 STM32L072 NA MP P/N 3. Block Diagram

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 4. Dimensions, Marking and Terminal Configurations Top View Bottom View Side View Table 1 Dimension (Unit: mm) Mark Dimension Mark Dimension Mark Dimension e3 1.00±0.10 e4 1.00±0.10

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Terminal Configurations < Top View > Table 2 Terminal Configurations Pin NO. Terminal Name Type Connection to IC terminal

Description

1 PA12/USB_DP I/O STM32L082_PA12 GPIO Mode:PA12.(Power supplied by VDD_USB) USB_DP

2 PA11/USB_DM I/O STM32L082_PA11 GPIO Mode:PA11,( Power supplied by

VDD_USB) USB_DM

3 GND Ground - Ground

4 VDD_USB Power - Power supply for USB

5 VDD_MCU Power - Power supply for MCU

6 VDD_RF Power - Power supply for RF IC

7 GND Ground - Ground

8 DBG_SX1276_DIO2 I/O SX1276_DIO2 Debug pin for SX1276, customer cannot use it

9 DBG_SX1276_DIO3 I/O SX1276_DIO3 Debug pin for SX1276, customer cannot use it

10 SX1276_DIO4 I/O SX1276_DIO4 SX1276 DIO4. Possible to connect to Pin21 PA5 for future usage. Contact ST for further information 11 DBG_SX1276_DIO5 I/O SX1276_DIO5 Debug pin for SX1276. Possible to connect to Pin22 PA4 for future usage. Contact ST for further information

12 DBG_SX1276_DIO1 I/O SX1276_DIO1 Debug pin for SX1276, customer cannot use it

13 DBG_SX1276_DIO0 I/O SX1276_DIO0 Debug pin for SX1276, customer cannot use it

14 PB15/SPI2_MOSI I/O STM32L082_PB15 GPIO Mode:PB15

SPI2_MOSI

15 PB14/SPI2_MISO I/O STM32L082_PB14 GPIO Mode:PB14

SPI2_ MISO

16 PB13/SPI2_SCK I/O STM32L082_PB13 GPIO Mode:PB13

SPI2_SCK

17 PB12/SPI2_NSS I/O STM32L082_PB12 GPIO Mode:PB12

SPI2_NSS

18 PA10/USART1_RX I/O STM32L082_PA10 GPIO Mode:PA10

USART1_RX

19 PA9/USART1_TX I/O STM32L082_PA9 GPIO Mode:PA9

USART1_TX

20 PA8/MCO I/O STM32L082_PA8 GPIO Mode:PA8

21 PA5/ADC5/DAC2 I/O STM32L082_PA5 GPIO Mode:PA5

COMP2_INM ADC_IN5

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. DAC_OUT2 Possible to connect to Pin10 for future usage. Contact ST for more information

22 PA4/ADC4/DAC1 I/O STM32L082_PA4 GPIO Mode:PA4

COMP2_INM ADC_IN4 DAC_OUT1 Possible to connect to Pin11 for future usage. Contact ST for more information

23 PA3/ADC3 I/O STM32L082_PA3 GPIO Mode:PA3

COMP2_ INP ADC_IN3 USART2_RX

24 PA2/ADC2 I/O STM32L082_PA2 GPIO Mode:PA2

COMP2_OUT ADC_IN2 USART2_TX

25 GND Ground - Ground

26 ANT A,I/O - Transmit / Receive Antenna

27 GND Ground - Ground

28 DBG_CRF1 I/O STM32L082_PA1 Debug pin. Cannot be used as GPIO 29 DBG_CRF3 I/O STM32L082_PC1 Debug pin. Cannot be used as GPIO 30 DBG_CRF2 I/O STM32L082_PC2 Debug pin. Cannot be used as GPIO

31 STSAFE_nRST I - Reset for Security IC

32 VREF+ Power - Reference Voltage For ADC and DAC

33 PA0/WKUP1 I/O STM32L082_PA0 GPIO Mode:PA0

COMP1_OUT ADC_IN0

34 MCU_nRST I STM32L082_ nRST NRST

35 PB8/I2C1_SCL I/O STM32L082_ PB8 GPIO Mode:PB8

I2C mode: SCL

36 PB9/I2C1_SDA I/O STM32L082_ PB9 GPIO Mode: PB9

I2C mode: SDA

37 PB2/LPTIM1_OUT I/O STM32L082_PB2 GPIO Mode:PB2

LPTIM1_OUT

38 PB7/LPTIM1_IN2 I/O STM32L082_PB7 GPIO Mode:PB7

LPTIM1_IN2

39 PB6/LPTIM1_ETR I/O STM32L082_ PB6 GPIO Mode:PB6

LPTIM1_ETR

40 PB5/LPTIM1_IN1 I/O STM32L082_ PB5 GPIO Mode:PB5

LPTIM1_IN1

41 PA13/SWDIO I/O STM32L082_PA13 GPIO Mode:PA13

LPUART1_RX

42 PA14/SWCLK I/O STM32L082_PA14 GPIO Mode:PA14

LPUART1_TX

43 BOOT0 I STM32L082_BOOT0 Boot Option

44 GND Ground - -

45 PH1-OSC_OUT I/O STM32L082_PH1 GPIO Mode:PH1

High-speed external clock OSC output

46 PH0-OSC_IN I/O STM32L082_PH0 GPIO Mode:PH0

High-speed external clock OSC input

47 TCXO_OUT O - Internal TCXO output

48 VDD _TCXO Power - Power supply for the TCXO IC

49~57 GND Ground - Ground Notes: GPIO pins are to be left OPEN if not used. 5. Label Information

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 6. Absolute Maximum Ratings Table 3 Maximum ratings Parameters Min Typ Max Unit Storage Temperature -40 25 +90 degC Input RF Level - - 10 dBm Supply Voltage VDD_USB -0.3 - 3.9 V VDD_MCU, VDD_RF, VDD_TCXO -0.3 - 3.9 V VREF+ -0.3 - VDD_MCU+0.4 V 7. Operating Condition Table 4 Operating specification Parameters Min Typ Max Unit Operating Temperature -40 25 +85 degC Supply Voltage VDD_USB (USB peripheral used) (1) 3.0 - 3.6 V VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max V VDD_MCU,VDD_RF, VDD_TCXO 2.2(3) - 3.6 V VREF+(2) 1.8 - VDD_MCU V (1) VDD_USB must respect the following conditions: - When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - In operating mode, VDD_USB could be lower or higher than VDD_MCU. - If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os. (2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is on the STM32L082*** datasheet and user guider. (3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V. 8. Electrical Characteristics 8.1. FSK/OOK Transceiver Specification Conditions: Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified. Part Number 078 or 091 _091 One pin mark Model name FCC ID IC ID ANATEL ID Inspection number TELEC Logo TELEC number KCC Logo Murata mark

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. FSK/OOK Receiver Specification Symbol Description Conditions Min. Typ Max Unit RFS_F_HF LnaBoost is turned on FDA = 5 kHz, BR = 4.8 kb/s -117.5 dBm IDDR (*) Supply current in Receive mode LnaBoost Off, band 1 22 mA LnaBoost On, band 1 23 mA FSK/OOK Transmitter Specification Symbol Description Conditions Min. Typ Max Unit RF_OP RF output power in 50 ohms on RFO pin ( High efficiency PA) Programmable with steps Max 14 dBm Min -5 dBm RF_OPH RF output power in 50 ohms on PA_BOOST pin( Regulated PA) Programmable with 1dB steps Max 18.5 dBm Min 2 dBm ΔRF_ OPH_V RF output power stability on PA_BOOST pin versus voltage supply. VDD = 2.2 V to 3.6 V +/-1 dB ΔRF_T RF output power stability versus temperature on PA_BOOST pin. From T = -40 °C to +85 °C +/-1.5 dB IDDT (*) Supply current in Transmit mode with impedance matching RFOP = +20 dBm, on PA_BOOST 128 mA RFOP = +17 dBm, on PA_BOOST 106 mA RFOP = +14 dBm, on RFO_HF pin 47 mA RFOP = + 7 dBm, on RFO_HF pin 34 mA (*) IDDR and IDDT are total current consumption including MCU in active. 8.2. LoRa Transceiver Specification Conditions: The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances LoRa Receiver Specification Symbol Description Conditions Min. Typ Max Unit IDDR_L (*) Supply current in receiver LoRa mode, LnaBoost off Band 1, BW = 125 kHz 21.5 mA Band 1, BW = 250 kHz 22.2 mA Band 1, BW = 500 kHz 23.6 mA RFS_L125_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 125 kHz bandwidth SF = 6 -117.5 dBm SF = 7 -122.5 dBm SF = 8 -125.5 dBm SF = 9 -128.5 dBm SF = 10 -131.0 dBm SF = 11 -133.5 dBm SF = 12 -135.5 dBm RFS_L250_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 250 kHz bandwidth SF = 6 -114.0 dBm SF = 7 -119.0 dBm SF = 8 -122.0 dBm SF = 9 -125.0 dBm SF = 10 -127.5 dBm SF = 11 -130.0 dBm SF = 12 -133.0 dBm LoRa Transmitter Specification Symbol Description Conditions Min. Typ Max Unit IDDT_L (*) Supply current in transmitter mode RFOP setting = 14 dBm 47 mA RFOP setting = 10 dBm 36 mA

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. IDDT_H_L (*) Supply current in transmitter mode Using PA_BOOST pin RFOP setting = 20 dBm 128 mA (*) IDDR_L, IDDT_L and IDDT_H_L are total current consumption including MCU in active. 8.3. SIGFOX Transceiver Specification Conditions: The table below gives the electrical specifications for the transceiver operating with SIGFOX modulation. Following conditions ap ply unless ot herwise specified: Supply voltage = 3.3 V , Temperature = 25° C . With matched impedances. Notes: To operate as SIGFOX mode, the following configuration is required. - TCXO_OUT (Pin 47) must be connected to PH0-OSC_IN (Pin46). - PA12 (Pin 1) must be connected to TXCO_VCC (Pin48). - SX1276_DIO4 (Pin10) must be connected to PA5 (Pin21). SIGFOX Receiver Specification Symbol Description Conditions Min. Typ Max Unit RFS_F_HF AT$SB=x,1, AT$SF=x,1, AT$SR PER<0.1 TBD dBm IDDR_S Supply current in Receive mode AT$TM=3,10 mA SIGFOX Transmitter Specification Symbol Description Conditions Min. Typ Max Unit RF_OP_S RF output power in 50 ohms on RF pin Programmable with steps AT$SF Max 18.5 dBm Min 4.5 dBm IDDT_S Supply current in Transmit mode with impedance matching Output power setting 20 dBm AT$SF 128 mA Output power setting 14 dBm AT$SF 44 mA 8.4. Low power mode current Conditions: Power supply: 3.3V, T emp: Room, TCXO_VDD (pin 48 of the module) is connected to PA12 (Pin1 of the module) Mode Description Min. Typ Max Unit Mode0 STM32L0 in Stop mode with RTC (Real Time Clock) (*1) (*3) SX1276 in Sleep mode 1.65 uA Mode1 STM32L0 in Standby mode with RTC (Real Time Clock) (*2) SX1276 in Sleep mode 1.40 uA (*1) The Stop mode achieves the lowest power consumption while retaining the RAM and register contents and real time clock. All clocks in the V CORE domain are stopped, the PLL, MSI RC, HSE crystal and HSI RC oscillators are disabled. The LSE or LSI is still running. The voltage regulator is in the low-power mode. Some peripherals featuring wakeup capability can enable the HSI RC during Stop mode to detect their wakeup condition. The device can be woken up from Stop mode by any of the EXTI line, in 3.5us, the processor can serve the interrupt or resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the comparator 1 event or comparator 2 event (if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup events, the USB/USART/I2C/LPUART/LPTIMER wakeup events. (*2) The Standby mode is used to achieve the lowest power consumption and real time clock. The internal voltage regulator is switched off so that the entire VCORE domain is powered off. The PLL, MSI RC, HSE crystal and HSI RC oscillators are also switched off. The LSE or LSI is still running. After entering Standby mode, the RAM and register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32 KHz oscillator, RCC_CSR register). The device exits Standby mode in 60 μs when an external reset (NRST pin), an IWDG reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B), RTC tamper event, RTC timestamp event or RTC Wakeup event occurs. (*3) STM SigFox Firmware is always in stop mode by default, it wakes up automatically when receiving one character. Else it wakes up automatically when an interrupt is to be processed and returns in stop mode when finished. 9. Power Sequences

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

9.1 Power Up Sequence

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 10. Recommend Land Pattern

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 11. Reference circuit In case of using the module as LoRa CMWX1ZZABZ-078/091 PA12/USB_DP PA11/USB_DM GND VDD_USB VDD_MCU VDD_RF GND DBG_SX1276_DIO2 DBG_SX1276_DIO3 SX1276_DIO4 DBG_SX1276_DIO5 DBG_SX1276_DIO1 DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3/USART2_RX/LPUART1_RX PA2/ADC2/USART2_TX/LPUART1_TX GND 25ANT 26GND 27DBG_CRF1 28DBG_CRF3 29DBG_CRF2 30STSAFE_nRST 31VREF+ 32PA0/WKUP1 33MCU_nRST 34PB8/I2C1_SCL 35PB9/I2C1_SDA PB2/LPTIM1_OUT 37PB7/LPTIM1_IN2 38PB6/LPTIM1_ETR PA13/SWDIO/LPUART1_RX 41PA14/SWCLK/LPUART1_TX 42BOOT0 43GND PB5/LPTIM1_IN1 PH1-OSC_OUT 45PH0-OSC_IN 46TCXO_OUT 47VDD_TCXO GND 49GND 50GND 51GND 52GND GND GND GND GND 10uF 0.1uF Module reset do not need external pull up resistor. Because there is an about 45K permanent pull up resistor inside of module. Notes for VREF+: 1. VREF+ can be grounded or floating when DAC and ADC function are not active. 2. VREF+ should be connected to VDD if module is battery powered and need to monitor the battery voltage VDD_TCXO 1uF module reset VDD Button1 1 2 C6 0.1uF SMA connector 1uF SWCLK For VDD_TCXO connection Option1:Connect VDD_TCXO to VDD Option2:Connect VDD_TCXO to PA12 so that MCU can control TCXO on/off VDD C8 C9 SWD connectorSWDIO 10uF 0.1uF VDD_USB USART2_TX USART2_RX VDD USART1_TX USART1_RX 10K Optional The VDD_USB is the power supply for PA11 and PA12. VREF+

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. In case of using the module as SigFox modem with STM SigFox firmware CMWX1ZZABZ-099 PA12/USB_DP PA11/USB_DM GND VDD_USB VDD_MCU VDD_RF GND DBG_SX1276_DIO2 DBG_SX1276_DIO3 SX1276_DIO4 DBG_SX1276_DIO5 DBG_SX1276_DIO1 DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3/USART2_RX/LPUART1_RX PA2/ADC2/USART2_TX/LPUART1_TX GND 25ANT 26GND 27DBG_CRF1 28DBG_CRF3 29DBG_CRF2 30STSAFE_nRST 31VREF+ 32PA0/WKUP1 33MCU_nRST 34PB8/I2C1_SCL 35PB9/I2C1_SDA PB2/LPTIM1_OUT 37PB7/LPTIM1_IN2 38PB6/LPTIM1_ETR PA13/SWDIO/LPUART1_RX 41PA14/SWCLK/LPUART1_TX 42BOOT0 43GND PB5/LPTIM1_IN1 PH1-OSC_OUT 45PH0-OSC_IN 46TCXO_OUT 47VDD_TCXO GND 49GND 50GND 51GND 52GND GND GND GND GND 10uF 0.1uF Module reset do not need external pull up resistor. Because there is an about 45K permanent pull up resistor inside of module. VDD_TCXO 1uF module reset VDD Button1 1 2 C1 0.1uF SMA connector 1uF SWCLK VDD C8 C9 SWD connectorSWDIO Host Interf ace USART_TX Host Interf ace USART_RX VDD 10K The VDD_USB is must. Because it is the power supply for PA11 and PA12. VREF+

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 12. Tape and Reel packing

12.1 Dimension of Tape (Plastic tape)

(unit : mm)

12.2 Dimensions of Reel

2.0±0.1 1.75±0.10 0.30±0.05 24.0±0.1 11.5±0.1 13±0.1 1.5+0.1/-0.0 24.0±0.3 feeding direction 4.0±0.1 *1 2±0.15 R80 R135 5 22 φ 120 φ330±2 φ 80±1 φ13±0.2 Label Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.0 Unit: mm

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

12.3 Taping Diagrams

[1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μm in thickness [4] Base tape : As specified in (1)

12.4 Leader and Tail tape

(No components) Component s No components Feeding direction Leader tape (Cover tape alone) 150mm min. 250mm min. Tail tape Feeding Hole Chip Feeding Direction [2] [3] [4] [3] [1]

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. - The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. - The cover tape and base tape are not adhered at no components area for 250mm min. - Tear off strength against pulling of cover tape : 5N min. - Packaging unit : 1000 pcs/ reel - Material ➢ Base tape : Plastic ➢ Reel : Plastic ➢ Cover tape, cavity tape and reel are made the anti-static processing. - Peeling of force: 1.3N max. in the direction of peeling as shown below. - Packaging (Humidity proof Packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 0.7 N max. Base tape Cover tape 1.3 N max. 湿度 インジケ－タ 乾燥剤 表示ラべル 防湿梱包袋 表示ラベル Label Label Desiccant Humidity Indicator Anti-humidity Plastic Bag

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 13. Notice

13.1 Storage Conditions

Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. (Packing materials, in particular, may be deformed at the temperature over 40 °C) - The product left more than 6months after reception, it needs t o be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) - After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125 +5/-0 °C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (Base T ape, Reel T ape and Cover T ape) are not heat-resistant.

13.2 Handling Conditions

Be careful in handling or tr ansporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability.

13.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

13.4 Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

13.5 Soldering Conditions：

The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Reflow Soldering Standard Conditions (Example) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

13.6 Cleaning :

Since this Product is Moisture Sensitive, any cleaning is not permitted.

13.7 Operational Environment Conditions :

Products are designed to work for electronic products under normal environmental con ditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to pro ducts, do not apply static electricity or excessive voltage while assembling and measuring.

13.8 Input Power Capacity :

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the comp onents are used beyond such input power capacity range. Within 120 s Pre-heating time(s) 220 °C Within 60 s Cooling down Slowly 180 °C 150 °C 240 ~ 250 °C Within 3 s

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 14. Regulatory Statements

14.1 FCC Statements

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme à la section 15 des réglementations de la FCC. Le fonctionnement de l’appareil est sujetaux deux conditions suivantes : (1) cet appareil ne doit pas provoquer d’interférences néfastes, et (2) cet appareil doit tolérer les interférences reçues, y compris celles qui risquent de provoquer un fonctionnement indésirable. Note: This product has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This product generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this product does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This equipment should be installed and operated with a minimum distance 20cm between the radiator and your body Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre corps When the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module FCC ID: VPYCMABZ” or “Contains FCC ID: VPYCMABZ”.

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

14.2 IC Statements

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. When the Industry Canada certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module IC: 772C-CMABZ”or “Contains IC: 772C-CMABZ”.

14.3 General Statements

The module is limited to OEM installation ONLY . The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. Therefore, the final host product must be submitted to [SyChip] for confirmation that the installation for the module into the host is in compliance with regula tions of FCC and IC Canada. Specially, if an antenna other than the model documented in the Filing is used, a Class 2 Permissive Change must be filed with the FCC. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. The LoRa module is for use with external antenna ONLY . The antenna is Monopole Antenna and maximum gain is 1.04dBi. This module has been approved by FCC to operate with the antenna types with the maximum permissible gai n indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. CAUTION PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT -FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, Reverse -Engineering, remodeling altering, and reproducing our product. Our product cannot be used for th e product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade la w", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. Customer acknowledges that Murata will, i f requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent

Preliminary Specification Number : SP -ABZ-Y Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by ・the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, ・deviation or lapse in function of engineering sample, ・improper use of engineering samples. We disclaims any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.