CMWX1ZZABZ-TEMP-1

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Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. LoRa Module Data Sheet Sample Part Number: CMWX1ZZABZ-TEMP CMWX1ZZABZ-TEMP-1 MP Part Number: CMWX1ZZABZ-078 CMWX1ZZABZ-091 For LoRaTM

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

Revision History

Code Date Description Comments A Dec 1, 2016 Initial release B Jan 19, 2017 Revise template

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. TABLE OF CONTENTS

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 1. Features Interfaces : I2C, UART, USB, SPI Main ICs : STM32L, SX1276 Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm) and 32.768KHz clock (frequency error=±20 ppm) Supported Frequencies : 868 MHz, 915 MHz Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max) Weight : 0.48g (Typ) Package : Metal Shield can RoHS : This module is compliant with the RoHS directive 2. Part Number Ordering Part Number MCU Description CMWX1ZZABZ-TEMP STM32L082 Engineering sample CMWX1ZZABZ-EVK STM32L082 Evaluation board CMWX1ZZABZ-078 STM32L082 MP P/N CMWX1ZZABZ-TEMP-1 STM32L072 Engineering sample CMWX1ZZABZ-EVK-1 STM32L072 Evaluation board CMWX1ZZABZ-091 STM32L072 MP P/N 3. Block Diagram

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 4. Label Information 5. Absolute Maximum Ratings Table 1 Maximum ratings Parameters Min Typ Max Unit Storage Temperature -40 25 +90 degC Input RF Level - - 10 dBm Supply Voltage VDD_USB -0.3 - 3.9 V VDD_MCU, VDD_RF, VDD_TCXO -0.3 - 3.9 V VREF+ -0.3 - VDD_MCU+0.4 V 6. Operating Condition Table 2 Operating specification Parameters Min Typ Max Unit Operating Temperature -40 25 +85 degC Supply Voltage VDD_USB (USB peripheral used) (1) 3.0 - 3.6 V VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max V VDD_MCU,VDD_RF,VDD_TCXO 2.2(3) - 3.6 V VREF+(2) 1.8 - VDD_MCU V (1) VDD_USB must respect the following conditions: - When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - In operating mode, VDD_USB could be lower or higher than VDD_MCU. - If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os. (2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is on the STM32L082*** datasheet and user guider. (3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V. 1 pin mark Product name FCC ID number IC ID number Inspection number Murata Logo

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 7. Electrical Characteristics

7.1 FSK/OOK Transceiver Specification

Conditions: Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified. FSK/OOK Receiver Specification Symbol Description Conditions Min. Typ Max Unit RFS_F_HF LnaBoost is turned on FDA = 5 kHz, BR = 4.8 kb/s -117.5 dBm IDDR Supply current in Receive mode LnaBoost Off, band 1 22 mA LnaBoost On, band 1 23 mA FSK/OOK Transmitter Specification Symbol Description Conditions Min. Typ Max Unit RF_OP RF output power in 50 ohms on RFO pin ( High efficiency PA) Programmable with steps Max 14 dBm Min -5 dBm RF_OPH RF output power in 50 ohms on PA_BOOST pin( Regulated PA) Programmable with 1dB steps Max 18.5 dBm Min 2 dBm ΔRF_ OPH_V RF output power stability on PA_BOOST pin versus voltage supply. VDD = 2.2 V to 3.6 V +/-1 dB ΔRF_T RF output power stability versus temperature on PA_BOOST pin. From T = -40 °C to +85 °C +/-1.5 dB IDDT Supply current in Transmit mode with impedance matching RFOP = +20 dBm, on PA_BOOST 128 mA RFOP = +17 dBm, on PA_BOOST 106 mA RFOP = +14 dBm, on RFO_HF pin 47 mA RFOP = + 7 dBm, on RFO_HF pin 34 mA

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

7.2 LoRa Transceiver Specification

Conditions: The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances LoRa Receiver Specification Symbol Description Conditions Min. Typ Max Unit IDDR_L Supply current in receiver LoRa mode, LnaBoost off Band 1, BW = 125 kHz 21.5 mA Band 1, BW = 250 kHz 22.2 mA Band 1, BW = 500 kHz 23.6 mA RFS_L125_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 125 kHz bandwidth SF = 6 -117.5 dBm SF = 7 -122.5 dBm SF = 8 -125.5 dBm SF = 9 -128.5 dBm SF = 10 -131.0 dBm SF = 11 -133.5 dBm SF = 12 -135.5 dBm RFS_L250_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 250 kHz bandwidth SF = 6 -114.0 dBm SF = 7 -119.0 dBm SF = 8 -122.0 dBm SF = 9 -125.0 dBm SF = 10 -127.5 dBm SF = 11 -130.0 dBm SF = 12 -133.0 dBm LoRa Transmitter Specification Symbol Description Conditions Min. Typ Max Unit IDDT_L Supply current in transmitter mode RFOP setting = 14 dBm 47 mA RFOP setting = 10 dBm 36 mA IDDT_H_L Supply current in transmitter mode Using PA_BOOST pin RFOP setting = 20 dBm 128 mA 8. Power Sequences

8.1 Power Up Sequence

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 9. Reference circuit LoRa module PA12/USB_DP PA11/USB_DM GND VDD_USB VDD_MCU VDD_RF GND DBG_SX1276_DIO2 DBG_SX1276_DIO3 SX1276_DIO4 DBG_SX1276_DIO5 DBG_SX1276_DIO1 DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3 PA2/ADC2 GND 25ANT 26GND 27DBG_CRF1 28DBG_CRF3 29DBG_CRF2 30STSAFE_nRST 31VREF+ 32PA0/WKUP1 33MCU_nRST 34PB8/I2C1_SCL 35PB9/I2C1_SDA PB2/LPTIM1_OUT 37PB7/LPTIM1_IN2 38PB6/LPTIM1_ETR PA13/SWDIO 41PA14/SWCLK 42BOOT0 43GND PB5/LPTIM1_IN1 PH1-OSC_OUT 45PH0-OSC_IN 46TCXO_OUT 47VDD_TCXO GND 49GND 50GND 51GND 52GND GND GND GND GND 10uF 0.1uF Notes for VREF+ 1. VREF+ can be grounded when ADC and DAC are not active. 2. VREF+ can be connected to a separate voltage which is between 1.8V and VDD for better accuracy on low-voltage inputs and outputs of ADC and DAC. 1uF VDD_TCXO Button 1 2 C7 0.1uF VDD 10K SMA connector to 868MHz/915MHz Antenna 1uF VDD VDD_USB C8 C9 SWD connector VDD 10Kfor VDD_TCXO connection Option1: Connect VDD_TCXO to VDD Option2: Connect VDD_TCXO to PA12 to make sure MCU can control TCXO on/off VREF+ 10uF 0.1uF Optional

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 10. Tape and Reel packing

10.1 Dimension of Tape (Plastic tape)

(unit : mm)

10.2 Dimensions of Reel

2.0±0.1 1.75±0.10 0.30±0.05 24.0±0.1 11.5±0.1 13±0.1 1.5+0.1/-0.0 24.0±0.3 feeding direction 4.0±0.1 *1 2±0.15 R80 R135 5 22 φ 120 φ330±2 φ 80±1 φ13±0.2 Label Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.0 Unit: mm

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

10.3 Taping Diagrams

[1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μm in thickness [4] Base tape : As specified in (1)

10.4 Leader and Tail tape

(No components) Components No components Feeding direction Leader tape (Cover tape alone) 150mm min. 250mm min. Tail tape Feeding Hole Chip Feeding Direction [2] [3] [4] [3] [1]

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. - The tape for chips are wound clockwise, the fee ding holes to the right side as the tape is pulled toward the user. - The cover tape and base tape are not adhered at no components area for 250mm min. - Tear off strength against pulling of cover tape : 5N min. - Packaging unit : 1000 pcs/ reel - Material  Base tape : Plastic  Reel : Plastic  Cover tape, cavity tape and reel are made the anti-static processing. - Peeling of force: 1.3N max. in the direction of peeling as shown below. - Packaging (Humidity proof Packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 0.7 N max. Base tape Cover tape 1.3 N max. 湿度 インジケ－タ 乾燥剤 表示ラべル 防湿梱包袋 表示ラベル Label Label Desiccant Humidity Indicator Anti-humidity Plastic Bag

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 11. Notice

11.1 Storage Conditions

Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. (Packing materials, in particular, may be deformed at the temperature over 40 °C) - The product left more than 6months after reception, it needs t o be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) - After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125 +5/-0 °C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant.

11.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability.

11.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing meth od, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

11.4 Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

11.5 Soldering Conditions：

The recommendation conditions of soldering are as in the following figure. When products are immerse d in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Reflow Soldering Standard Conditions (Example) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

11.6 Cleaning :

Since this Product is Moisture Sensitive, any cleaning is not permitted.

11.7 Operational Environment Conditions :

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.

11.8 Input Power Capacity :

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Within 120 s Pre-heatin g time(s) 220 °C Within 60 s Cooling down Slowly 180 °C 150 °C 240 ~ 250 °C Within 3 s

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. CAUTION PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warrant y that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other th an those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT -FREE, OR AGAINST INFRINGEMEN T OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPEN SES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, Reverse -Engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical inf ormation and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. Customer acknowledges that Murata will, if reque sted by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent

Specification Number : BP-ABZ-B < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by ・the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, ・deviation or lapse in function of engineering sample, ・improper use of engineering samples. We disclaims any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.