CMWX1ZZABZ-EVK-2

CMWX1ZZABZ-093 MURATA | Alldatasheet

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Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. LoRaWAN Modem Module Data Sheet Sample Part Number: CMWX1ZZABZ-TEMP-2 MP Part Number: CMWX1ZZABZ-093

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

Revision History

Code Date Description Comments A Dec 20, 2016 Initial Draft B Feb 23, 2017 Updated pin description according to MuRata LoRa modem command specification v0.5 C July 3, 2017 Added reference circuit D Sep 29, 2017 Updated reference circuit E Nov 23, 2017 Updated Electrical Characteristics and reference circuit F May 14, 2018 Revised Label info G July 4, 2019 Revised Label info by adding Anatel ID H Feb 18, 2020 Revised Label info by adding part number I Feb 23, 2021 Revised Operating Condition J Apr 21, 2021 Revised Operating Condition Label Picture K Sep 02,2021 Revised Label information L Oct 22,2021 Revised Label information M Mar 3,2023 Revised Label information in page8 JRL number

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. TABLE OF CONTENTS

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 1. Features Interfaces : UART Main ICs : STM32L, SX1276 Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm) and 32.768KHz clock (frequency error=±20 ppm) Supported Frequencies : 868 MHz, 915 MHz Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max.) Weight : 0.48g (Typ.) Package : Metal Shield can RoHS : This module is compliant with the RoHS directive 2. Part Number Ordering Part Number Description CMWX1ZZABZ-TEMP-2 Engineering sample CMWX1ZZABZ-EVK-2 Evaluation board CMWX1ZZABZ-093 MP P/N 3. Block Diagram

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 4. Dimensions, Marking and Terminal Configurations Top View Bottom View Side View Table 1 Dimension (Unit: mm) Mark Dimension Mark Dimension Mark Dimension e3 1.00±0.10 e4 1.00±0.10

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Terminal Configurations < Top View > Table 2 Terminal Configurations Pin NO. Terminal Name Type Connection to IC terminal

Description

1 PA12/USB_DP O STM32L072_PA12 Only power supply for TCXO

2 PA11/USB_DM I/O STM32L072_PA11 Unused

3 GND Ground - Ground

4 VDD_USB Power - Power supply for PA12/PA11

5 VDD_MCU Power - Power supply for MCU

6 VDD_RF Power - Power supply for RF IC

7 GND Ground - Ground

8 DBG_SX1276_DIO2 I/O SX1276_DIO2 Debug pin for SX1276, customer cannot use it

9 DBG_SX1276_DIO3 I/O SX1276_DIO3 Debug pin for SX1276, customer cannot use it

10 DBG_SX1276_DIO4 I/O SX1276_DIO4 SX1276 DIO4, customer cannot use it

11 DBG_SX1276_DIO5 I/O SX1276_DIO5 Debug pin for SX1276, customer cannot use it

12 DBG_SX1276_DIO1 I/O SX1276_DIO1 Debug pin for SX1276, customer cannot use it

13 DBG_SX1276_DIO0 I/O SX1276_DIO0 Debug pin for SX1276, customer cannot use it

14 PB15/SPI2_MOSI I STM32L072_PB15 Input for factory new. In normal work mode, this pin should be pulled up. If this pin is pulled down continuously more than 5 seconds and then pulled up, the module will be restored to factory new.

15 PB14/SPI2_MISO I/O STM32L072_PB14 Unused

16 PB13/SPI2_SCK I/O STM32L072_PB13 Unused

17 PB12/SPI2_NSS I/O STM32L072_PB12 Unused

18 PA10/USART1_RX I/O STM32L072_PA10 Debug interface. 19 PA9/USART1_TX I/O STM32L072_PA9 Debug interface.

20 PA8/MCO I/O STM32L072_PA8 Unused

21 PA5/ADC5/DAC2 I/O STM32L072_PA5 Unused

22 PA4/ADC4/DAC1 I/O STM32L072_PA4 Unused

23 PA3/ADC3 I/O STM32L072_PA3 UART_RX for AT command interface

24 PA2/ADC2 I/O STM32L072_PA2 UART_TX for AT command interface

25 GND Ground - Ground

26 ANT A,I/O - Transmit / Receive antenna

27 GND Ground - Ground

28 DBG_CRF1 I/O STM32L072_PA1 Unused

29 DBG_CRF3 I/O STM32L072_PC1 Unused

30 DBG_CRF2 I/O STM32L072_PC2 Unused

31 STSAFE_nRST I - Unused

32 VREF+ Power - Reference Voltage for ADC and DAC

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 33 PA0/WKUP1 I/O STM32L072_PA0 Input for bootloader mode. In normal work mode, this pin should be pulled up. If this pin is pulled down during power on, the module will enter bootloader mode.

34 MCU_nRST I STM32L072_ nRST nRST

35 PB8/I2C1_SCL I/O STM32L072_ PB8 Unused

36 PB9/I2C1_SDA I/O STM32L072_ PB9 Unused

37 PB2/LPTIM1_OUT I/O STM32L072_PB2 Unused

38 PB7/LPTIM1_IN2 I/O STM32L072_PB7 Unused

39 PB6/LPTIM1_ETR I/O STM32L072_ PB6 Unused

40 PB5/LPTIM1_IN1 I/O STM32L072_ PB5 Unused

41 PA13/SWDIO I/O STM32L072_PA13 Unused

42 PA14/SWCLK I/O STM32L072_PA14 Unused

43 BOOT0 I STM32L072_BOOT0 Boot Option

44 GND Ground - Ground

45 PH1-OSC_OUT I/O STM32L072_PH1 Unused

46 PH0-OSC_IN I/O STM32L072_PH0 Unused

47 TCXO_OUT O - Internal TCXO output

48 VDD _TCXO Power - Power supply for the TCXO

49~57 GND Ground - Ground Notes: GPIO pins are to be left OPEN if not used.

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 5. Label Information One pin mark Model name FCC ID IC ID ANATEL ID Inspection number TELEC Logo TELEC number KCC Logo Murata mark Part number

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 6. Absolute Maximum Ratings Table 3 Maximum ratings Parameters Min Typ Max Unit Storage Temperature -40 25 +90 degC Input RF Level - - 10 dBm Supply Voltage VDD_USB -0.3 - 3.9 V VDD_MCU, VDD_RF, VDD_TCXO -0.3 - 3.9 V VREF+ -0.3 - VDD_MCU+0.4 V 7. Operating Condition Table 4 Operating specification Parameters Min Typ Max Unit Operating Temperature -40 25 +85 degC Supply Voltage VDD_USB (USB peripheral used) (1) 3.0 - 3.6 V VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max V VDD_MCU,VDD_RF, VDD_TCXO 2.2(3) - 3.6 V VREF+(2) 1.8 - VDD_MCU V (1) VDD_USB must respect the following conditions: - When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. - In operating mode, VDD_USB could be lower or higher than VDD_MCU. - If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os. (2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is on the STM32L072*** datasheet and user guider. (3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V. 8. Electrical Characteristics

8.1 FSK/OOK Transceiver Specification

Conditions: Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and TX path matching, unless otherwise specified. FSK/OOK Receiver Specification Symbol Description Conditions Min Typ Max Unit RFS_F_HF LnaBoost is turned on FDA = 5 kHz, BR = 4.8 kb/s -117.5 dBm FSK/OOK Transmitter Specification Symbol Description Conditions Min Typ Max Unit RF_OP RF output power in 50 ohms on RFO pin ( High efficiency PA) Programmable with steps Max 14 dBm Min -5 dBm RF_OPH RF output power in 50 ohms on PA_BOOST pin( Regulated PA) Programmable with 1dB steps Max 18.5 dBm Min 2 dBm ΔRF_ OPH_V RF output power stability on PA_BOOST pin versus voltage supply. VDD = 2.2 V to 3.6 V +/-1 dB ΔRF_T RF output power stability versus temperature on PA_BOOST pin. From T = -40 °C to +85 °C +/-1.5 dB IDDT Supply current in Transmit mode with impedance matching RFOP setting = 20 dBm, on PA_BOOST 125 mA RFOP setting = 17 dBm, on PA_BOOST 101 mA RFOP setting = 14 dBm, on 46 mA

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. RFO_HF pin RFOP setting = 7 dBm, on RFO_HF pin 34 mA

8.2 LoRa Transceiver Specification

Conditions: The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances LoRa Receiver Specification Symbol Description Conditions Min Typ Max Unit IDDR_L Current in receiver 868 band 12.5 mA 915 band 14.5 mA RFS_L125_HF RF sensitivity, Long-Range Mode, LnaBoost for Band1, using split Rx/Tx path 125 kHz bandwidth SF = 7 -122.5 dBm SF = 8 -125.5 dBm SF = 9 -128.5 dBm SF = 10 -131.0 dBm SF = 11 -133.5 dBm SF = 12 -135.5 dBm RFS_L250_HF RF sensitivity, Long-Range Mode, LnaBoost for Band1, using split Rx/Tx path 250 kHz bandwidth SF = 7 -119.0 dBm SF = 8 -122.0 dBm SF = 9 -125.0 dBm SF = 10 -127.5 dBm SF = 11 -130.0 dBm SF = 12 -133.0 dBm LoRa Transmitter Specification Symbol Description Conditions Min Typ Max Unit IDDT_L Supply current in transmitter mode RFOP setting = 14 dBm 36 mA RFOP setting = 10 dBm 27.5 mA IDDT_H_L Supply current in transmitter mode Using PA_BOOST pin RFOP setting = 20 dBm 118 mA

8.3 Low power mode current

Conditions: Power supply: 3.3V, T emp: Room, Description Min Typ Max Unit STM32L0 in stop mode with RTC (Real Time Clock) SX1276 in sleep mode 1.65 uA

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 9. Power Sequences

9.1 Power Up Sequence

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 10. Recommend Land Pattern

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 11. Reference circuit CMWX1ZZABZ-093 PA12/USB_DP PA11/USB_DM GND VDD_USB VDD_MCU VDD_RF GND DBG_SX1276_DIO2 DBG_SX1276_DIO3 SX1276_DIO4 DBG_SX1276_DIO5 DBG_SX1276_DIO1 DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3/USART2_RX/LPUART1_RX PA2/ADC2/USART2_TX/LPUART1_TX GND 25ANT 26GND 27DBG_CRF1 28DBG_CRF3 29DBG_CRF2 30STSAFE_nRST 31VREF+ 32PA0/WKUP1 33MCU_nRST 34PB8/I2C1_SCL 35PB9/I2C1_SDA PB2/LPTIM1_OUT 37PB7/LPTIM1_IN2 38PB6/LPTIM1_ETR PA13/SWDIO/LPUART1_RX 41PA14/SWCLK/LPUART1_TX 42BOOT0 43GND PB5/LPTIM1_IN1 PH1-OSC_OUT 45PH0-OSC_IN 46TCXO_OUT 47VDD_TCXO GND 49GND 50GND 51GND 52GND GND GND GND GND 10uF 0.1uF Module reset do not need external pull up resistor. Because there is an about 45K permanent pull up resistor inside of module. Notes for VREF+: 1. VREF+ should be connected to GND or floating if module is powered by external power supply. 2. VREF+ should be connected to VDD if module is battery powered and reports battery level. 10K VDDVDD_TCXO 1uF module reset VDD Button1 1 2 C1 0.1uF SMA connector 1uF SWCLK f actory new VDD C8 C9 SWD connectorSWDIO 10K VDD Host Interf ace USART_TX Host Interf ace USART_RX VDD Button2 1 2 C2 0.1uF Debug USART_TX Debug USART_RX 10K bootload mode selection Button3 0.1uF Pin 33 is as an input of bootload mode selection.For the detail information, please refer to the Murata LoRa modem command specification. Pin14 is as an input of factory new. For the detail information, please refer to the Murata LoRa modem command specification. The VDD_USB is must.Because it is the power supply for PA11 and PA12. VREF+

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 12. Tape and Reel packing

12.1 Dimension of Tape (Plastic tape)

(unit : mm)

12.2 Dimensions of Reel

2.0±0.1 1.75±0.10 0.30±0.05 24.0±0.1 11.5±0.1 13±0.1 1.5+0.1/-0.0 24.0±0.3 feeding direction 4.0±0.1 *1 2±0.15 R80 R135 5 22 φ 120 φ330±2 φ 80±1 φ13±0.2 Label Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.0 Unit: mm

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.

12.3 Taping Diagrams

[1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μMin thickness [4] Base tape : As specified in (1)

12.4 Leader and Tail tape

(No components) Component s No components Feeding direction Leader tape (Cover tape alone) 150mm min. 250mm min. Tail tape Feeding Hole Chip Feeding Direction [2] [3] [4] [3] [1]

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. - The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. - The cover tape and base tape are not adhered at no components area for 250mm Min. - Tear off strength against pulling of cover tape : 5N Min. - Packaging unit : 1000 pcs/ reel - Material ➢ Base tape : Plastic ➢ Reel : Plastic ➢ Cover tape, cavity tape and reel are made the anti-static processing. - Peeling of force: 1.3N max. in the direction of peeling as shown below. - Packaging (HumidiTyproof Packing) Tape and reel must be sealed with the anti-humidiTyplastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 0.7 N max. Base tape Cover tape 1.3 N max. 湿度 インジケ－タ 乾燥剤 表示ラべル 防湿梱包袋 表示ラベル Label Label Desiccant Humidity Indicator Anti-humidity Plastic Bag

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 13. Notice

13.1 Storage Conditions

Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. (Packing materials, in particular, may be deformed at the temperature over 40 °C) - The product left more than 6months after reception, it needs t o be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) - After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125 +5/-0 °C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (Base T ape, Reel T ape and Cover T ape) are not heat-resistant.

13.2 Handling Conditions

Be careful in handling or tra nsporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their ter Minals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability.

13.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground ter Minals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT ter Minals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land for Ming method of t he NC ter Minals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

13.4 Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

13.5 Soldering Conditions：

The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. Reflow Soldering Standard Conditions (Example) Please use the reflow within 2 times. Use rosin Type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

13.6 Cleaning :

Since this Product is Moisture Sensitive, any cleaning is not permitted.

13.7 Operational Environment Conditions :

Products are designed to work for electronic products under normal environmental cond itions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - DusTyplace. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to produ cts, do not apply static electricity or excessive voltage while assembling and measuring.

13.8 Input Power Capacity :

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the compon ents are used beyond such input power capacity range. Within 120 s Pre-heatin g time(s) 220 °C Within 60 s Cooling down Slowly 180 °C 150 °C 240 ~ 250 °C Within 3 s

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. CAUTION PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to t he specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT -FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, Reverse -Engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do n ot warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or servi ces are used. Information provided by us regarding third-parTyproducts or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export adMinistration regulations", etc. Please note that we may discontinue the manufacture of our produ cts, due to reasons such as end of supply of materials and/or components from our suppliers. Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for co nsumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). By signing on specificatio n sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent

Preliminary Specification Number : SP -ABZ-093-M Preliminary & Confidential < Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specification s and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by ・the use of the engineering sample other than for evaluation purposes , particularly the installation or integration in the product to be sold by you, ・deviation or lapse in function of engineering sample, ・improper use of engineering samples. We disclaims any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.