CMS2-5.6-4S2 FERROXCUBE | Alldatasheet

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Supersedes data of September 2004 2008 Sep 01 FERROXCUBE SMD common mode chokes EMI-suppression products

2008 Sep 01 1443

EMI-suppression products SMD common mode chokes SMD COMMON MODE CHOKES FOR EMI-SUPPRESSION General data Grades, parameters and type numbers Note 1. Typical values, Zmin is −20%. DC resistance <0.6 mΩ. ITEM SPECIFICATION Strip material copper (Cu), tin (Sn) plated Solderability “IEC 60068-2-58”, Part 2, Test Ta, method 1 Taping method “IEC 60286-3” , “EIA 481-1-A” and “EIA 481-2” GRADE |Ztyp|(1) (Ω) at f (MHz) TYPE NUMBER CMS2-5.6/3/4.8; mass ≈0.3 g 4S2 21 25 CMS2-5.6/3/4.8-4S2 35 100 50 300 CMS2-5.6/3/8.9; mass ≈0.6 g 4S2 38 25 CMS2-5.6/3/8.9-4S2 60 100 CMS4-11/3/4.8; mass ≈0.6 g 4S2 inner channel 12 25 CMS4-11/3/4.8-4S2 23 100 42 300 4S2 outer channel 15 25 30 100 50 300 CMS4-11/3/8.9; mass ≈1.1 g 4S2 inner channel 23 25 CMS4-11/3/8.9-4S2 45 100 82 300 4S2 outer channel 27 25 58 100 97 300 GRADE |Z typ|(1) (Ω) at f (MHz) TYPE NUMBER Mechanical data Dimensions in mm. handbook, halfpage 4.75 ±0.3 3.04 max. >1.2 5.6 ±0.2 >1.1 0.2 1.33 ±0.2 1.27 ±0.07 handbook, halfpage 8.9 −0.5 3.04 max. >1.2>5 0.2CBW180

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EMI-suppression products SMD common mode chokes Fig.2 CMS4-11/3/4.8 and CMS4-11/3/8.9. Dimensions in mm. handbook, full pagewidth 10.8 ±0.3 1.33 ±0.2 1.27 ±0.07 handbook, halfpage 8.9 −0.5 3.04 max. >1.2>5 0.2CBW181 4.75 ±0.3 3.04 max. >1.2>1.1 0.2 Recommended dimensions of solder lands Fig.3 Solder lands for reflow soldering of CMS2-5.6/3/4.8. Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm 2). handbook, halfpage 2.81.8 1.9 2.5 6.4 MBG063 /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; Fig.4 Solder lands for wave soldering of CMS2-5.6/3/4.8. handbook, halfpage 2.0 0.8 1.8 1.9 2.5 6.4 MBG064 /;/; /;/; /;/; /;/; /;/;/; /;/;/; /;/;/; /;/;/; /;/; /;/; /;/; /;/; Dimensions in mm.

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EMI-suppression products SMD common mode chokes handbook, halfpage 7.01.8 1.9 2.5 10.8 /;/; /;/; /;/; /;/; CBW291 Fig.5 Solder lands for reflow soldering of CMS2-5.6/3/8.9. Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm 2). Fig.6 Solder lands for wave soldering of CMS2-5.6/3/8.9. Dimensions in mm. handbook, halfpage 6.0 2.5 1.8 1.9 2.5 10.8 /;/; /;/; /;/; /;/; CBW292 /;/; /;/; /;/; handbook, halfpage 2.81.8 1.9 2.5 6.4 MBG065 /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; Fig.7 Solder lands for reflow soldering of CMS4-11/3/4.8. Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm 2). handbook, halfpage 2.0 0.8 1.8 1.9 2.5 6.4 /;/; /;/; /;/; /;/; /;/;/; /;/;/; /;/;/; /;/;/; /;/; /;/; /;/; /;/;/; /; /; /; /;/;/; MBG066 /;/; /;/; /;/;/; /;/;/; /;/; /;/; /;/; /;/; /;/; /;/; /;/; Fig.8 Solder lands for wave soldering of CMS4-11/3/4.8. Dimensions in mm.

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EMI-suppression products SMD common mode chokes Fig.9 Solder lands for reflow soldering of CMS4-11/3/8.9. Dimensions in mm. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm 2). handbook, halfpage 7.01.8 1.9 2.5 10.8 /;/; /;/; /;/; /;/; /;/; /;/; CBW289 /;/; /;/; Fig.10 Solder lands for wave soldering of CMS4-11/3/8.9. Dimensions in mm. handbook, halfpage 6.0 2.5 1.8 1.9 2.5 10.8 /;/; /;/; /;/; /;/; /;/; /;/; CBW290 /;/; /;/; /;/; /;/; /;/; /;/; /;/;

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EMI-suppression products SMD common mode chokes Soldering profiles Fig.11 Reflow soldering. Preheat 480 sec max Soldering 20 - 40 sec 60 - 180 sec 255 - 260 oC 217 oC min 150 oC 60 - 150 sec MFP129 3 oC/s max max 200 oC 6 oC/s max Temp in oC Time in sec25 oC Fig.12 Double wave soldering. Typical values (solid line). Process limits (dotted lines). 0 50 100 150 200 250 300 250 200 150 100 10 s 235 °C to 260 °C second wave

5 K/s

2 K/s

200 K/s

100 °C to 130 °C forced cooling (°C) t (s) T MLA861

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EMI-suppression products SMD common mode chokes BLISTER TAPE AND REEL DIMENSIONS Table 1 Physical dimensions of blister tape; see Fig.13 SIZE DIMENSIONS (mm) A0 5.26 5.99 5.23 10.13 B0 6.07 9.09 11.18 11.56 K0 3.18 3.18 4.5 4.5 T 0.3 0.33 0.34 0.36 W 1 21 62 42 4 E 1.75 1.75 1.75 1.75 F 5.5 7.5 11.75 11.5 D0 1.5 1.5 1.5 1.5 P0 4.0 4.0 4.0 4.0 P1 8.0 8.0 8.0 16.0 P2 2.0 2.0 2.0 2.0 Fig.13 Blister tape. For dimensions see Table 1. handbook, full pagewidth MEA613 - 1 E F W P2D0 A0 D 1 direction of unreeling K T cover tape

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EMI-suppression products SMD common mode chokes Table 2 Reel dimensions; see Fig.14 SIZE DIMENSIONS (mm) AN W 1 W2 12 330 100 ±5 12.4 ≤16.4 16 330 100 ±5 16.4 ≤20.4 24 330 100 ±5 24.4 ≤28.4 handbook, full pagewidth 12.75 0.15 020.5 NA W 1 MSA284 Fig.14 Reel. Dimensions in mm. For dimensions see Table 2.

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EMI-suppression products SMD common mode chokes DATA SHEET STATUS DEFINITIONS DISCLAIMER Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube for any damages resulting from such application. PRODUCT STATUS DEFINITIONS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS Preliminary specification Development This data sheet contains prelimin ary data. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. STATUS INDICATION DEFINITION Prototype These are products that have been made as development samples for the purposes of technical evaluation only. The data for these types is provisional and is subject to change. Design-in These products are recommended for new designs. Preferred These products are recommended for use in current designs and are available via our sales channels. Support These products are not recommended for new designs and may not be available through all of our sales channels. Customers are advised to check for availability.