CMF01 TAYCHIPST | Alldatasheet

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Technical content

(CMF04) Note 2: This rating specifies the non-repetitive peak cu (CMF03) 102°C 127°C (CMF02) 108°C 100°C (Note 1)(Note 1) - 40 to + 125

16 Maximum Thermal Resistance (Junction to Lead)

th (j-l) V 10(50HZ) (Non-repetitive Maximum Peak One Cycle Surge Forward Current 2.0 1.0 0.5 0.5 A 600 600 900 800 V SYMBOL CMF01 CMF02 CMF03 CMF04 UNIT Suitable for compact assembly due to small surface-mount 600V-900V 0.5A-2.0A CMF01 THRU CMF04 Web Site: www.taychipst.com1 of 2

FEATURES

E-mail: sales@taychipst.com MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Maximum Repetitive Peak Reverse Voltage V RRM Maximum Average Forward Current Ta = 65 °C I F Maximum Forward Voltage at I F F R °C/W Junction Temperature Range T J Storage Temperature Range T STG - 40 to + 150 °C RATING I FSM A Switching Mode Power Supply Applications

  • Repetitive peak reverse voltage: V RRM
  • Average forward current: I F (AV)
  • Forward voltage: V FM = 2.0 V (max)
  • Very fast reverse-recovery time: t rr = 100 ns (max.) “M −FLAT TM ” (Toshiba package name) Package SOD-123 30(50HZ) V 2.0 2.5 Note 1: T ℓ = Rectangular waveform (α = 180°) (Note 1)(Note 1) ℓ = T(CMF01) ℓ = T ℓ = T rrent in one cycle of a 50 Hz sine wave, condition angle 180 °. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.

RATINGS AND CHARACTERISTIC CURVES CMF01 THRU CMF04 E-mail: sales@taychipst.com Web Site: www.taychipst.com 2 of 2 600V-900V 0.5A-2.0A CMF01 THRU CMF04 Switching Mode Power Supply Applications 100 1000 0.001 10001 0.01 0.1 10 100 1 100 10 3 5 30 50 160 0.4 0.6 1.2 120 100 0.2 0.8 140 α = 60° 120° 180° 1.0 160 0.4 1.2 120 100 0.2 0.6 140 α = 60° 120° 180° 0.8 1.0 1.0 2.0 0 0.2 0.8 1.20.6 α = 60° 120° 180° 3.0 0.4 1.0 0 1.0 0.01 0.1 2.0 3.0 4.0 5.0 25°C 75°C Tj = 150°C Average forward current I F (AV) (A) Ta max – I F (AV) Device mounted on a glass-epoxy board board size: 50 mm × 50 mm, land size: 6 mm × 6 mm Maximum allowable ambient temperature Ta max (°C) Average forward current I F (AV) (A) P F (AV) – I F (AV) Average forward power dissipation P F (AV) ( W ) Instantaneous forward voltage V F (V) i F – v F Instantaneous forward current i F (A) Pulse test Ta = 25°C f = 50 Hz Time t (s) r th (j-a) – t Transient thermal impedance r th (j-a) (°C/W) Peak surge forward current I FSM (A) Number of cycles Surge forward current (non-repetitive) Average forward current I F (AV) (A) T ℓmax – I F (AV) Maximum allowable lead temperature T ℓ max (°C) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 2.1 mm × 1.4 mm, board thickness: 1.6 t) Device mounted on a ceramic board (board size: 50 mm × 50 mm, land size: 2 mm × 2 mm, board thickness: 0.64 t) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm, board thickness: 1.6 t) 360° 0° Rectangular waveform α Conduction angle α Rectangular waveform α0° 360° Conduction angle: α Rectangular waveform α0° 360° Conduction angle: α