CMF01 TOSHIBA | Alldatasheet

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Technical content

TOSHIBA Fast Recovery Diode Silicon Diffused Type CMF01 Switching Mode Power Supply Applications DC/DC Converter Applications

  • Repetitive peak reverse voltage: VRRM = 600 V
  • Average forward current: IF (AV) = 2.0 A
  • Forward voltage: VFM = 2.0 V (max)
  • Very fast reverse-recovery time: trr = 100 ns (max.)
  • Suitable for compact assembly due to small surface-mount package “M −FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Repetitive peak reverse voltage VRRM 600 V Average forward current IF (AV) 2.0 (Note 1) A Peak one-cycle surge forward current (non-repetitive) IFSM 30 (50 Hz) A Junction temperature Tj −40~150 °C Storage temperature range Tstg −40~150 °C Note 1: T ℓ =100°C Device mounted on a ceramic board Board size: 50 mm × 50 mm, Soldering land size: 2 mm × 2 mm Board thickness: 0.64 t Rectangular waveform (α = 180°) Note 2: Using continuously under heavy loads (e.g. t he application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Unit: mm JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4E1A Weight: 0.023 g (typ.)

Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Peak forward voltage VFM I FM = 2.0 A (pulse test) ⎯ 1.4 2.0 V Repetitive peak reverse current IRRM V RRM = 600 V (pulse test) ⎯ ⎯ 50 μA Reverse recovery time trr I F = 1 A, di/dt ＝-30 A/μs ⎯ ⎯ 100 ns Forward recovery time tfr I F = 1 A ⎯ 270 ⎯ ns Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 t) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 t) ⎯ ⎯ 135 Thermal resistance Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ ⎯ 210 °C/W Thermal resistance (junction to lead) R th (j-ℓ) ⎯ ⎯ ⎯ 16 °C/W Marking Standard Soldering Pad Abbreviation Code Part No. F1 CMF01 Handling Precautions The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods we recommend for designing a circuit using this device. V RRM: We recommend that the worst-case voltage, including sur ge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit; and no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient (0.1%/ ℃). Be sure to take this temperature coefficient into account when designing a device for use at low temperature. I F(AV): We recommend that the worst case current be no greater than 80% of the abs olute maximum rating of I F(AV). Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by using an allowable Tamax-IF (AV) curve. This rating specifies the non-repetit ive peak current in one cycle of a 50 Hz sine wave, condition angle 180 °. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device. For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. 3.0 1.4 2.1 Unit: mm 1.4

Average forward current I F (AV) (A) Ta max – IF (AV) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm) Maximum allowable ambient temperature Ta max (°C) Average forward current I F (AV) (A) PF (AV) – IF (AV) Average forward power dissipation PF (AV) ( W ) 0.8 2.0 0.4 1.2 1.6 160 100 120 140 Instantaneous forward voltage V F (V) iF – vF Instantaneous forward current i F (A) 0.01 100 1.0 2.0 3.0 150°C Tj = 25°C 75°C 4.0 0.1 2.4 2.4 2.8 Pulse test 0.001 100010 Ta = 25°C f = 50 Hz Time t (s) rth (j-a) – t Transient thermal impedance rth (j-a) (°C/W) Peak surge forward current I FSM (A) Number of cycles Surge forward current (non-repetitive) 10 100 Average forward current I F (AV) (A) Tℓ max – IF (AV) Device mounted on a ceramic board (board size: 50 mm × 50 mm, land size: 2 mm × 2 mm) Maximum allowable lead temperature Tℓ max (°C) 160 100 120 140 100 1000

10 Device mounted on

(board size: 50 mm × 50 mm, land size: 2.1 mm × 1.4 mm, board thickness: 1.6 t Device mounted on a ceramic board (board size: 50 mm × 50 mm, land size: 2 mm × 2 mm, board thickness: 0.64 t) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm, board thickness: 1.6 t) α = 60° 120° 180° α = 60° 120° 180° α = 60° 120° 180° 0.01 0.1 1 100 360° 0° Rectangular waveform α Conduction angle α Rectangular waveform α 0° 360° Conduction angle: α Rectangular waveform α0° 360° Conduction angle: α

RESTRICTIONS ON PRODUCT USE 20070701-EN

  • The information contained herein is subject to change without notice.
  • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
  • The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
  • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
  • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
  • Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.