CMF-SDP7A-XX-2

CMF-SDP07 BOURNS | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 3

Technical content

Features

■ Two resistance-matched PTCs in a plastic housing ■ Narrow resistance tolerance ■ RoHS compliant*

Applications

Used as a secondary overcurrent protection device in: ■ Customer Premise Equipment (CPE) ■ Central Office (CO) ■ Access equipment *RoHS COMPLIANT Operating Temperature Range: -40°C to +125 °C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Primary Test Protection Test Condition Requirements Ri = R initial Rf = R final Test Procedures And Requirements For Model CMF-SDP Series How to Order CMF - SD P 35 A -XX - 2 Product Designator Style SD = Surface Mount Dual Pkg. Housing P = Plastic Rated Resistance (RN) 7-75 (7-75 Ohms) Footprint and Height Option Blank = Standard Product A = Reduced Footprint and Height Resistance Tolerance Option Blank = Standard Packaging Options - 2 = Tape & Reel Typical Part Marking Represents total content. Layout may vary. 35P8G MANUFACTURER'S TRADEMARK PART IDENTIFICATION: 07P = CMF-SDP07 10P = CMF-SDP10 10PA = CMF-SDP10A 25P = CMF-SDP25 25PA = CMF-SDP25A 35P = CMF-SDP35 35PA = CMF-SDP35A 50P = CMF-SDP50 50PA = CMF-SDP50A 75P = CMF-SDP75 YEAR CODE: 8 = 2008 BI-WEEKLY DATE CODE: WEEK 13-14 = G Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com

Solder Reflow Recommendations 160–220 300 250 200 150 100 10–20 Temperature (°C) 120 Preheating Soldering Cooling Time (seconds) Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents. Note:
• If reflow temperatures exceed the recommended profile, devices may not meet the performance specifications. Rework
• A device should not be reworked. CMF-SDP SERIES, REV. C, 11/08 CMF-SDP Series - Telecom CPTC Resettable Fuses Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Product Dimensions Recommended Pad LayoutRecommended Pad Layout Packaging options: TAPE & REEL: 350 pcs. per reel Packaging options: TAPE & REEL: 400 pcs. per reel MM (INCHES)DIMENSIONS = 8.75 (.344) MAX. MAX. MAX. 7.2 (.283) 3.9 (.154) 0.5 (.020) 2 PLCS. 10.2 (402) 2.4 (.094) CMF-SDP10A, 25A, 35A & 50A 5.0 (.197) 11.0 (.433) MAX. 9.0 (.354) MAX. 11.5 (.453) MAX. 2.6 (.102) CMF-SDP07, 10, 25, 35, 50 & 75 7.2 (.283) MAX. 8.75 (.344) MAX. 3.2 (.126) 2.0 (.079) 2.4 (.094) 6.3 (.248) 3.9 (.154) 8.2 (.323) 9.0 (.354) 10.0 (.394) 3.2 (.126) 2.0 (.079) 2.6 (.102) 7.6 (.299) 11.0 (.433) 5.0 (.197)

CMF-SDP10-2, CMF-SDP25-2, CMF-SDP-35-2, CMF-SDP50-2, CMF-SDP10A-2, CMF-SDP25A-2, Tape Dimensions per EIA 481-2 CMF-SDP75-2 CMF-SDP35A-2, CMF-SDP50A-2 W P F Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CMF-SDP Series Tape and Reel Specifications DIMENSIONS = MM (INCHES) 24.0 ±0.5 (0.945 ±0.020 ) 4.0 (0.157) 2.0 (0.079) 9.1 ± 0.2 (0.358 ± 0.008) 11.20 ± 0.2 (0.441 ± 0.008) 1.75 (0.069) 11.7 ± 0.2 (0.433 ± 0.008) 11.5 (0.453) 1.5 (0.059) A0P P0 T F E W P2 -0.4 (-.016) D 13.2 +0.2/-0 (.520 +.008/-0 100 ± 1.5 (3.94 ± .059) DIA. 24.4 (.961) 30.4 (1.197) MAX. MIN. 330 -2/+0 (12.99 -.079/+0) DIA. 0.5 ± 0.15 (0.020 ± 0.006) 24.0 ±0.5 (0.945 ±0.020 ) 4.0 (0.157) 2.0 (0.079) 16.0 (0.630) 16.0 (0.630) 7.5 ± 0.2 (0.295 ± 0.008) 9.0 ± 0.2 (0.354 ± 0.008) 1.75 (0.069) 10.0 ± 0.2 (0.394 ± 0.008) 11.5 (0.453) 1.5 (0.059) 0.5 ± 0.15 (0.020 ± 0.006)