CMF-SD BOURNS | Alldatasheet
Document overview
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Technical content
Features
■ Two resistance-matched PTCs in a ceramic housing ■ Aids compliance with: - ITU-T K.20/21/45 - Telcordia GR-1089-CORE - UL 60950, 3rd Ed. ■ Narrow resistance tolerance ■ RoHS compliant*
Applications
Used as a secondary overcurrent protection device in: ■ Customer Premise Equipment (CPE) ■ Central Office (CO) ■ Access equipment *RoHS COMPLIANT How to Order CMF - SD 35 A -10 - 2 Product Designator Style SD = Surface Mount Dual Pkg. Rated Resistance (RN) 25, 35, 50 (25, 35, 50 Ohms) Reduced Footprint and Height Option Resistance Tolerance Option Blank = Standard (20 %) -10 = 10 % Packaging Options - 2 = Tape & Reel Typical Part Marking Represents total content. Layout may vary. Product Dimensions Recommended Pad Layout Packaging options: TAPE & REEL: CMF-SD25, CMF-SD35 & CMF-SD50 = 400 pcs. per reel; CMF-SD35A & CMF-SD50A = 500 pcs. per reel MM (INCHES)DIMENSIONS = A B F E D C B A F EDC H G 356G MANUFACTURER'S TRADEMARK PART IDENTIFICATION: 25 = CMF-SD25 35 = CMF-SD35 50 = CMF-SD50 35A = CMF-SD35A 50A = CMF-SD50A 25K = CMF-SD25-10 35K = CMF-SD35-10 50K = CMF-SD50-10 35AK = CMF-SD35A-10 50AK = CMF-SD50A-10 YEAR CODE: 6 = 2006 BI-WEEKLY DATE CODE: WEEK 13-14 = G CMF-SD25 CMF-SD35 CMFSD35A Dim. CMF-SD50 CMF-SD50A A B C D E F 9.00 (.354) MAX. 10.80 (.425) MAX. 10.20 (.402) MAX. 4.88 - 5.28 (.192 - .208) 2.41 - 2.61 (.095 - .103) 7.15 (.281) MAX. 8.50 (.335) MAX. 8.10 (.319) MAX. 3.25 - 3.65 (.128 - .144) 2.41 - 2.61 (.095 - .103) 0.5 (.020) CMF-SD25/ CMF-SD35/ CMF-SD35A/ Dim. CMF-SD50 CMF-SD50A A B C D E F G H 10.0 (.394) 8.80 (.346) 3.20 (.126) 2.00 (.079) 2.60 (.102) 8.00 (.315) 7.05 (.278) 2.75 (.108) 2.00 (.079) 2.51 (.099) 5.00 (.197) 7.60 (.299) 3.45 (.136) 5.95 (.234) 10.0 (.394) 8.15 (.321) 1 2 3 4 MAX. 0.5 (.020) MAX.
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Solder Reflow Recommendations 160–220 300 250 200 150 100 10–20 Temperature (°C) 120 Preheating Soldering Cooling Time (seconds) Solder reflow
- Recommended reflow methods: IR, vapor phase oven, hot air oven.
- Devices are not designed to be wave soldered to the bottom side of the board.
- Gluing the devices is not recommended.
- Recommended maximum paste thickness is 0.25 mm (.010 inch).
- Devices can be cleaned using standard industry methods and solvents. Note:
- If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework
- A device should not be reworked. CMF-SD Series - Telecom CPTC Resettable Fuses Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.comReliable Electronic Solutions CMF-SD SERIES, REV. F, 08/07
Tape Dimensions per EIA 481-2 CMF-SD50-2 CMF-SD50A-2 W F T max.1 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CMF-SD Series Tape and Reel Specifications UNIT = MM (INCHES) 24.0 +0.30/-0.10 4.00 ± 0.10 (0.157 ± 0.004) 16.0 ± 0.10 (0.630 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 10.2 ± 0.10 (0.402 ± 0.004) 9.0 ± 0.10 (0.354 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 11.0 ± 0.10 (0.433 ± 0.004) 11.5 ± 0.10 (0.453 + 0.004) 1.5 +0.10/-0.0 T K 0A0P F P2 P0 E W 0.50 (.020) P F D P2 P0 E W 4.5 (.177) 9.1 (.358) 8 ° 20 ° 13.2 +0.2/-0 (.520 +.008/-0 16.4 +2.0/-0 (.646 +.079/-0) 16.4 +2.0/-0 (.646 +.079/-0) 22.4 (.882) MAX. 22.4 (.882) MAX. 330 -2/+0 (12.99 -.079/+0) DIA. 100 ± 1.5 (3.94 ± .059) DIA. 13.2 +0.2/-0 (.520 +.008/-0 330 -2/+0 (12.99 -.079/+0) DIA. 100 ± 1.5 (3.94 ± .059) DIA. D 0.50 (0.020) 16.0 ± 0.10 (0.630 ± 0.004 ) 4.00 ± 0.10 (0.157 ± 0.004) 12.0 ± 0.10 (0.472 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 8.35 ± 0.10 (0.329 ± 0.004) 8.30 ± 0.10 (0.327 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 8.80 ± 0.10 (0.346 ± 0.004) 7.5 ± 0.10 (0.295 + 0.004) 1.5 +0.10/-0.0 0.50 (0.020) CMF-SD25-2 CMF-SD35-2 CMF-SD50-2 CMF-SD35A-2 CMF-SD50A-2