CM901-B DFI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

Features

DDR3_2 SODIMM PGA (FS1r2) socket AMD A70M DDR3_1 SODIMM PCIe GEN2 x16 CMOS Backup EEPROM USB 2.0 8x SATA 3.0 4x VGA USB_SS 0,1,2,3USB 3.0 CORE Processor Graphics CORE Memory Controller SM Bus HD Audio LPC Bus A / B SM Bus Embedded Controller IT8518E 8-bit DIO WDT I2C Bus AMD Embedded R-Series APUs UMI-Link x4 AMD A70M FCH CORE CORE CORE UNBUFFERED DDR3 SODIMM 2x DP2 DDI Port 1 DP1 DISPLAY Port SWITCH PI3VDP12412 GPP 3PCIe GEN2 x1 PCIe GEN2 (1x4 or 4x1) GPP 0,1,2,3 DISPLAY Port SWITCH PI3VDP12412 DP0 DP to LVDS TRANSLATOR CH7511B DDI Port 2LVDS (Dual Channel) LPC TPM 1.2 SLB9635 (option)Serial Port1,

2 Tx/Rx

(Optional) SATA 4 GPP 1,2 Intel GbE LAN82574L GPP 0 PCIe GEN2 x1 LAN SPI I/F SPI ROM SPI Bus SD Card I/F (Optional) C / D DDI Port 3 800~1600MT/s A B A B Ø2.70(*7 pcs) Bottom View Top View Heat sink with fan Module PCB Carrier BoardStandoff 0.00 0.00 2.00 14.00 12.5070.20 0.00 0.00 76.00 117.00 0.00 4.00 121.00 4.00 4.00 87.00 91.00 4.000.00 87.00 87.00 121.00117.00 91.00 125.00 95.00 50.80 45.34 2.00 Module PCB The height of the highest parts 3.50 1.60 24.20 34.20 8.00 4.00 87.00 95.00 4.00 87.00 4.00 76.00 95.00 83.00 34.20 SATA 3.0 USB 3.0 RAID SSD Optional R2.1 Type6 MEMORY 2 DDR3 SODIMM up to 16GB EXPANSION

1 PCIe x16, 7 PCIe x1

1 LPC, 1 SMBus, 1 I

C, 2 serial

3 Independent Displays

DP, DP/LVDS, DP/VGA 8 USB: 4 USB 3.0/2.0, 4 USB 2.0 4 SATA 3.0 8-bit DIO LAN 1 LAN DIMENSIONS COM Express R2.1 Basic, Type 6 95mm x 125mm (3.74" x 4.9") R-Series

  • AMD Embedded R-Series APUs : R-464L Quad-core 2.3GHz, 35W : R-460H Quad-core 1.9GHZ, 35W : R-272F Dual-core 2.7GHz, 35W : R-268D Dual-core 2.5GHz, 35W
  • PGA (FS1r2) socket
  • 32nm process technology CHIPSET
  • AMD A70M Fusion Controller Hub SYSTEM MEMORY
  • Two 204-pin DDR3 SODIMM sockets
  • Supports DDR3 (1.5V), LVDDR3(1.35V), ULVDDR3 (1.25V) up to 1600MHz
  • Supports dual channel memory interface
  • Supports up to 16GB system memory
  • DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM technologies are supported for x8 and x16 devices, unbuffered, non-ECC ONBOARD GRAPHICS FEATURES
  • Supports DP, DP/LVDS and DP/VGA interfaces
  • VGA: resolution up to 1920x1600 @ 60Hz
  • LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution up to 1920x1200 @ 60 Hz
  • DP: resolution up to 4096x2160 @ 30Hz ONBOARD AUDIO FEATURES
  • Supports High Definition Audio interface ONBOARD LAN FEATURES
  • Intel 82574L Gigabit Ethernet controller
  • Integrated 10/100/1000 transceiver
  • Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab SERIAL ATA (SATA) INTERFACE
  • Supports 4 Serial ATA interfaces
  • 4 SATA 3.0 with data transfer rate up to 6Gb/s
  • Integrated Advanced Host Controller Interface (AHCI) controller
  • Supports RAID 0/1 SSD*
  • 4GB/8GB/16GB/32GB
  • Write: 30MB/sec (max), Read: 70MB/sec (max)
  • SATA to SSD onboard USB INTERFACE
  • XHCI Host Controller supports up to 4 super speed USB 3.0 ports WATCHDOG TIMER
  • Watchdog timeout programmable via software from 1 to 255 seconds TRUSTED PLATFORM MODULE (TPM)*
  • Provides a Trusted PC for secure transactions
  • Provides software license protection, enforcement and password protection EXPANSION INTERFACES
  • Supports 8 USB 2.0 ports (first 4 USB ports support up to USB 3.0)
  • Supports 1 PCIe x16 interface
  • Supports 7 PCIe x1 interfaces (the first 4 PCIe x1 can be configured to support PCIe x4)
  • Supports LPC interface
  • Supports SMBus interface
  • Supports I C interface
  • Supports 2 serial interfaces (TX/RX)
  • Supports 8-bit Digital I/O (4 In, 4 Out) DAMAGE FREE INTELLIGENCE
  • Monitors APU temperature
  • Monitors APU fan speed
  • Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V2/1V1 voltages
  • Watchdog timer function BIOS
  • 32Mbit SPI BIOS POWER CONSUMPTION
  • 31.12 W with R-464L at 2.3GHz and 2x 1GB DDR3 SODIMM OS SUPPORT
  • Windows XP Professional x86 & SP3 (32-bit)
  • Windows 7 Ultimate x86 & SP1 (32-bit)
  • Windows 7 Ultimate x64 & SP1 (64-bit)
  • Windows 8 Enterprise x86 (32-bit)
  • Windows 8 Enterprise x64 (64-bit) TEMPERATURE
  • Operating: 0 o C to 60 o C
  • Storage: -40 o C to 85 o C HUMIDITY
  • 10% to 90% POWER
  • Input: 12V, 5VSB (optional), VCC_RTC PCB
  • Dimensions - COM Express Basic
  • Compliance - PICMG COM Express R2.1, Type 6 CERTIFICATION
  • CE
  • FCC Class B
  • RoHS AMD® Embedded R-Series COM Express® Basic Specifications CM901-B Packing List Optional Items

Ordering Information

  • Optional and is not supported in standard model. Please contact your sales representative for more information. www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © December 20, 2019 DFI Inc.
  • 1 CM901-B board • COM331-B carrier board kit
  • COM101-BAT carrier board kit
  • Heat spreader: TBD
  • Heat spreader with heat sink and fan: TBD
  • Heat sink with fan: TBD Model Name Part Number Description CM901-B 777-CM9011-000G AMD Embedded R-Series APUs