CM3205 CALMIRCO | Alldatasheet

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Technical content

Features

5A continuous current from VDDQ 1.8V to 2.6V adjustable VDDQ output voltage 600-mV typical VDDQ dropout voltage at 5A VTT tracking at 50% of VDDQ Source and sink up to 2A VTT current Excellent load and line regulation, low noise Fast transient response Meets JEDEC DDR-I SDRAM power spec. Linear regulator design requires no inductors and has low external component count Integrated power MOSFETs Dual purpose ADJ/Shutdown pin Built-in over-current limit with short-circuit foldback and thermal shutdown for VDDQ and VTT 5mA quiescent current TO252 andTO263 packages for high performance thermal dissipation and easy PC board layout Optional RoHS Compliant Lead-free packaging

Applications

DDR memory and active termination buses Desktop Computers, Servers Residential and Enterprise Gateways DSL Modems Routers and Switchers DVD recorders 3D AGP cards LCD TV and STB Product Description The CM3205 is a dual-output, low noise linear regula- tor designed to meet SSTL-2 and SSTL-3 specifica- tions for DDR-SDRAM VDDQ supply and termination voltage VTT supply. With integrated power MOSFET’s, the CM3205 can source up to 5A of VDDQ current, and source or sink up to 2A VTT current. The typical drop- out voltage for VDDQ is 600-mV at 5A load current. The CM3205 provides fast response to transient load changes. Load regulation is excellent, less than 1%, from no load to full load. It also has built-in over-current limits and thermal shutdown at 170°C. The CM3205 is packaged in an easy-to-use 5-pin D2PAK (TO263-5) and DPAK (TO252-5). Low thermal resistance (48°C/W) allows it to withstand 1.7W (1) dis- sipation at 85°C ambient. It can operate over the indus- trial ambient temperature range of –40°C to 85°C. 2.50V, 5A DL0 VDDQ C hip S et DLn DDR Memory REF 845 887 VDDQ RT0 RTn 680u 680u 680u 3.3V 1.25V, 2.5A S/D 4.7u 4.7u 4.7u ADJSD GND VDDQ VTT VIN CM3205 VREF Typical Application DDR VDDQ and Termination Voltage Regulator

© 2006 California Micro Devices Corp. All rights reserved. 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 05/08/06 CM3205 PRELIMINARY

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications PACKAGE / PINOUT DIAGRAM Note: This drawing is not to scale. 5-Lead TO-252-5 Package Top View ADJSD VDDQ GND VIN VTT CM3205-00TP 5-Lead TO-263-5 Package Top View ADJSD VDDQ GND VIN VTT CM3205-00TN PART NUMBERING INFORMATION Pins Package Lead-free Finish Ordering Part Number1 Part Marking TO-263-5 CM3205-00TN TO-252-5 CM3205-00TP ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VIN to GND [GND - 0.3] to +6.0 V Pin Voltages VDDQ ,VTT to GND ADJSD to GND [GND - 0.3] to +6.0 [GND - 0.3] to +6.0 V V Storage Temperature Range -65 to +150 Operating Temperature Range -40 to +85 Lead Temperature (Soldering, 10s) 300 Package Pinout

© 2006 California Micro Devices Corp. All rights reserved. 05/08/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com CM3205 PRELIMINARY ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) VIN = 3.3V, typical values are at TA = 25°C (unless otherwise specified) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT S VIN VIN Supply Voltage Range 3.15 3.30 3.50 V VUVLO Under-voltage Lockout All outputs are no load 2.4 2.7 2.9 V UVLO Hysterisis 100 mV IQ Quiescent Current VDDQ = 0V, VTT = 0V, ADJSD = 3.3V (shutdown) mA VDDQ = 2.5V, VTT = 1.25V, (no load) mA VDDQ Regulator Output Current Limit VOUT = 2.5V 6.0 8.0 A VREF Reference Voltage 1.203 1.215 1.227 V IBIAS Input Bias Current (IADJ) VADJSD = VREF 200 nA VR LOAD Load Regulation IO = 10 mA to 5A VR LINE Line Regulation VIN = 3.15V to 3.5V, IO = 10 mA 0.5 VDROPOUT Dropout Voltage VIN = 3.15V, IO = 5A 600 mV VTT Regulator Output Current Limit (Source) VOUT = 1.25V 2.5 A Output Current Limit (Sink) VOUT = 1.25V 2.5 A VR VTTLOAD Load Regulation IO = 0A to 2A IO = 0A to -2A Over Temperature Protection Thermal Shutdown Temperature 170 Thermal Shutdown Hysteresis Specifications (cont’d)

© 2006 California Micro Devices Corp. All rights reserved. 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 05/08/06 CM3205 PRELIMINARY VDDQ vs. Temperature 2.49 2.495 2.5 2.505 2.51 -40 -20 100 120 140 Temperature oC VDDQ (V) VDDQ vs. Load Current 0.5 1.5 2.5 IDDQ (A) VDDQ (V) Ta=25oC Vin=3.3V VDDQ Dropout vs. IDDQ 100 200 300 400 500 600 IDDQ (A) Dropout Voltage (mV) VTT vs. Load Current 0.0 0.5 1.0 1.5 2.0 2.5 ITT (A) VTT (V) Source VTT vs. VDDQ 0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65 1.5 1.75 2.25 2.5 2.75 3.25 VDDQ (V) VTT (V) Sink Vin VDDQ VTT 1ms/div 1V/div UVLO Startup into Full Load VDDQ=2.5V Ta = 25 oC Typical Operating Curves

© 2006 California Micro Devices Corp. All rights reserved. 05/08/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com CM3205 PRELIMINARY Pin Descriptions VDDQ Transient Response VTT Transient Response VIN = 3.3V IOUT Step: 10mA ~ 3A VTT VDDQ IOUT IOUT VIN = 3.3V IOUT Step: -2.5A ~ +2.5A PIN DESCRIPTIONS PIN(S) NAME

DESCRIPTION

This pin is for VDDQ output voltage adjustment. The VDDQ output voltage is set using an external resistor divider connected to ADJSD. The output voltage is determined by the following formula: where R1 is the ground-side resistor and R2 is the upper resistor of the divider. Connect these resistors to the VDDQ output at the point of regulation. In addition, this input functions as a shutdown pin. Apply a voltage higher than VIN-1.2V to this pin to simultaneously shutdown both VDDQ and VTT outputs. The outputs are restored when the voltage on this pin falls below VIN-1.2V. A low-leakage diode in series with the shutdown input signal is recommended to avoid interference with the voltage adjustment setting. VDDQ VDDQ regulator output voltage pin. GND GROUND reference pin. The back tab is also ground and serves as the package heatsink. It should be soldered to the circuit board copper to remove excess heat from the IC. VIN Input voltage pin, typically 3.3V from the power supply. VTT VTT regulator output voltage pin, which is preset to 50% of VDDQ. VDDQ 1.215V Typical Operating Characteristics

© 2006 California Micro Devices Corp. All rights reserved. 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 05/08/06 CM3205 PRELIMINARY

Application Information

Double-Data-Rate (DDR) memory has provided a huge step in performance for personal computers, servers and graphic systems. As is apparent in its name, DDR operates at double the data rate of earlier RAM, with two memory accesses per cycle versus one. DDR SDRAM's transmit data at both the rising falling edges of the memory bus clock. DDR’s use of Stub Series Terminated Logic (SSTL) topology improves noise immunity and power-supply rejection, while reducing power dissipation. To achieve this performance improvement, DDR requires more complex power management architecture than previ- ous RAM technology. Unlike the conventional DRAM technology, DDR SDRAM uses differential inputs and a reference volt- age for all interface signals. This increases the data bus bandwidth, and lowers the system power con- sumption. Power consumption is reduced by lower operating voltage, a lower signal voltage swing associ- ated with Stub Series Terminated Logic (SSTL_2) and by the use of a termination voltage, VTT. SSTL_2 is an industry standard, defined in JEDEC document JESD8-9. SSTL_2 maintains high-speed data bus sig- nal integrity by reducing transmission reflections. JEDEC further defines the DDR SDRAM specification in JESD79C. DDR memory requires three tightly regulated voltages: VDDQ, VTT, and VREF (see Figure 1). In a typical SSTL_2 receiver, the higher current VDDQ supply volt- age is normally 2.5V with a tolerance of ±200-mV. The active bus termination voltage, VTT, is half of VDDQ. VREF is a reference voltage that tracks half of VDDQ, ± 1%, and is compared with the VTT terminated signal at the receiver. VTT must be within ±40-mV of VREF. Figure 1. Typical DDR terminations, Class II

© 2006 California Micro Devices Corp. All rights reserved. 05/08/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com CM3205 PRELIMINARY The VTT power requirement is proportional to the num- ber of data lines and the resistance of the termination resistor, but does not vary with memory size. In a typi- cal DDR data bus system each data line termination may momentarily consume 16.2-mA to achieve the 405-mV minimum over VTT needed at the receiver: A typical 128 Mbyte SSTL-2 memory system, with 192 terminated lines, has a worst-case maximum VTT sup- ply current up to ±3.11A. However, a DDR memory system is dynamic, and the theoretical peak currents only occur for short durations, if they ever occur at all. These high current peaks can be handled by the VTT external capacitor. In a real memory system, the con- tinuous average VTT current level in normal operation is less than ±200 mA. The VDDQ power supply, in addition to supplying cur- rent to the memory banks, could also supply current to controllers and other circuitry. The current level typi- cally stays within a range of 2.0A to 3.0A, with peaks up to 4.0A or more, depending on memory size and the computing operations being performed. The tight tracking requirements and the need for VTT to sink, as well as source, current provide unique chal- lenges for powering DDR SDRAM. CM3205 Regulator The CM3205 dual output linear regulator provides all of the power requirements of DDR memory by combining two linear regulators into a single TO-263 or TO-252 5- lead package. The VDDQ regulator can supply up to 5A continuous current, and the two-quadrant VTT termina- tion regulator has current sink and source capability to ±2A. The VDDQ linear regulator uses a PMOS pass element for a very low dropout voltage, typically 600mV at a 5A output. The output voltage of the VDDQ regula- tor can be set by an external voltage divider. The sec- ond output, VTT, is regulated at VDDQ/2 by an internal resistor divider. The VTT regulator can source, as well as sink, up to 2A continuous current. The CM3205 is designed for optimal operation from a nominal 3.3VDC bus, but can work with VIN as high as 5V. When operat- ing at higher VIN voltages, attention must be given to the increased package power dissipation and propor- tionally increased heat generation. VREF is typically routed to inputs with high impedance, such as a comparator, with little current draw. An ade- quate VREF can be created with a simple voltage divider of precision, matched resistors from VDDQ to ground. A small ceramic bypass capacitor can also be added for improved noise performance. Input and Output Capacitors The CM3205 requires that at least a 680μF electrolytic capacitor be located near the VIN pin for stability and to maintain the input bus voltage during load transients. An additional 4.7μF ceramic capacitor between the VIN (pin 4) and the GND (pin 5), located as close as possi- ble to those pins, is recommended to ensure stability. A minimum of a 680μF electrolytic capacitor is recom- mended for the VDDQ output. An additional 4.7μF ceramic capacitor between the VDDQ (pin 2) and GND, located very close to those pins, is recommended. A minimum of a 680μF, electrolytic capacitor is recom- mended for the VTT output. This capacitor should have low ESR to achieve best output transient response. SP or OSCON capacitors provide low ESR at high fre- quency, and thus are a good choice. In addition, place a 4.7μF ceramic capacitor between the VTT pin (pin 5) and GND, located very close to those pins. The total ESR must be low enough to keep the transient within the VTT window of 40-mV during the transition for source to sink. An average current step of ±0.5A requires: Both outputs will remain stable and in regulation even during light or no load conditions. Adjusting VDDQ Output Voltage The CM3205 internal bandgap reference is set at 1.215V. The VDDQ voltage is adjustable by using a resistor divider, R1 and R2: Iterminaton 405mV Rt 25Ω 16.2mA ESR 40mV 40mΩ VOUT VADJ Application Information (cont’d)

© 2006 California Micro Devices Corp. All rights reserved. 05/08/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com CM3205 PRELIMINARY TO-263-5 Mechanical Specifications Dimensions for CM3205-00TN devices packaged in 5- lead, standard TO-263 packages are presented below. * This is an approximate amount which may vary. Package Dimensions for Standard TO-263 PACKAGE DIMENSIONS Package TO-263 Pins Dimensions Millimeters Inches Min Max Min Max A 4.34 4.60 0.171 0.181 b 0.74 0.89 0.029 0.035 c 0.33 0.43 0.013 0.017 D 8.92 9.17 0.351 0.361 E 10.16 10.67 0.400 0.420 e

1.70 REF

0.067 REF

L 14.61 15.88 0.575 0.625 2.29 2.79 0.090 0.110 1.14 1.40 0.045 0.055 M 0.23 0.30 0.009 0.012 P 1.14 1.40 0.045 0.055 S 1.40 1.91 0.055 0.075 # per tape and reel 750 pieces Controlling dimension: inches Mechanical Package Diagrams TOP VIEW e D L b A SIDE VIEW E P LEADFORM 18-22° S c M SEATING PLANE 0°-8° Pin 1 Marking Mechanical Details

© 2006 California Micro Devices Corp. All rights reserved. 05/08/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com CM3205 PRELIMINARY TO-252-5 Mechanical Specifications Dimensions for CM3205-00TP devices packaged in 5- pin TO-252 packages are presented below. PACKAGE DIMENSIONS Package TO-252 Pins Dimensions Millimeters Inches Min Max Min Max A 6.40 6.80 0.252 0.268 B 5.20 5.50 0.205 0.217 C 6.80 7.20 0.268 0.283 D 2.20 2.80 0.087 0.110 G 0.40 0.60 0.016 0.024 H 2.20 2.40 0.087 0.094 J 0.45 0.55 0.018 0.022 K 0.15 0.006 L 0.90 1.50 0.035 0.059 M 5.40 5.80 0.213 0.228 P

1.27 REF

0.05 REF

S 0.50 0.80 0.020 0.031 # per tape and reel 750 pieces Controlling dimension: inches Mechanical Package Diagrams FRONT VIEW P M C G H SIDE VIEW A J LEADFORM c 0°-15° L K SEATING PLANE 0°-10° Pin 1 Marking BACK VIEW B D S Mechanical Details (cont’d)