CM3018 CALMIRCO | Alldatasheet
Document overview
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Technical content
Features
2.9V, 3.0V, 3.1V or 3.3V outputs Fast (60µs) VOUT response when enabled Ultra low noise (35µV rms typ.) Delivers up to 150mA output current Very low dropout (150mV at 150mA) Low quiescent operating current (110µA) Stable with low-ESR ceramic capacitors “Zero” disable mode current consumption Thermal overload protection Foldback overload current protection -40°C to +85°C temperature operation Available in a 5-pin SOT23 and 5-bump Chip Scale Packages (CSP) Lead-free versions available
Applications
Wireless handsets, PDAs, MP3 players, digital cameras PCs and notebooks Graphics cards, set-top boxes Compact Flash memory cards Battery-powered devices PC cards Product Description The CM3018 is a very low dropout, low noise regulator that delivers up to 150mA of load current at a fixed out- put voltage. A dedicated control input (EN, Active High) provides power-up sequencing flexibility. When this input is taken low, the regulator is disabled. In this state, the supply current will drop to near zero. An internal dis- charge MOSFET resistance (300Ω) will force the out- put to ground whenever the device is disabled. An optional bypass pin is provided for further improve- ment of noise performance and to maximize the power supply ripple rejection. The CM3018 is fully protected, offering both overload current limiting and high temperature thermal shut- down. The CM3018 is available in a tiny 5 lead SOT-23 pack- age or a 5-bump CSP and is ideal for space critical applications. The CSP version of the CM3018 incorpo- rates OptiGuardTM technology to provide increased reli- ability at assembly. All versions of the CM3018 are now available with optional lead-free finishing. Simplified Electrical Schematic Typical Application Circuit VIN EN VOUT GND 1µF 1µF OUT BYP 10nF COUT CIN GND CM3018 CBYP EN VIN GND VOUT BYP VREF
© 2004 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 07/29/04 CM3018 PRELIMINARY Pin / Bump Descriptions Package / Ordering Information PIN / BUMP DESCRIPTIONS SOT23-5 PIN CSP BUMP NAME
DESCRIPTION
The input power supply for the regulator. If this input is within a few inches of the main supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of approximately 1µF will ensure adequate filtering. GND The negative reference for all voltages. EN A logic input control to enable the regulator output. When EN is asserted (logic high), it allows output regulation to commence. When EN is deasserted (logic low), the regula- tor pass transistor is forced into a high impedance mode, and an internal discharge resistance (300Ω) is applied to the output. BYP This pin is connected to the internal voltage reference of the regulator. An external bypass capacitor CBYP of 10nF is recommended to improve the noise performance and to maximize the power supply ripple rejection. VOUT The regulator voltage output used to power the load. A nominal output capacitor of 1µF is sufficient to minimize any transient disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response. PACKAGE / PINOUT DIAGRAM Note: This drawing is not to scale. 5-pin SOT23 VIN GND EN VOUT BYP Top View ENxx SOT-23 PART NUMBERING INFORMATION SOT23-5 PKG. Pins Output Voltage Package Standard Finish Lead-free Finish Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 1.5V SOT23-5 CM3018-15ST EA15 CM3018-15SO EG15 1.8V SOT23-5 CM3018-18ST EA18 CM3018-18SO EG18 2.5V SOT23-5 CM3018-25ST EA25 CM3018-25SO EG25 2.8V SOT23-5 CM3018-28ST EA28 CM3018-28SO EG28 2.9V SOT23-5 CM3018-29ST EA29 CM3018-29SO EG29 3.0V SOT23-5 CM3018-30ST EA30 CM3018-30SO EG30 3.1V SOT23-5 CM3018-31ST EA31 CM3018-31SO EG31 3.3V SOT23-5 CM3018-33ST EA33 CM3018-33SO EG33
© 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM3018 PRELIMINARY Package / Ordering Information (Cont’d) Chip Scale Package Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. EN BYP VOUT VIN GND Pin "A1" Marking nn 2 3 C B A Orientation Marking (see note 2) PACKAGE / PINOUT DIAGRAM Notes: CM3018 TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. 1) These drawings are not to scale. PART NUMBERING INFORMATION CSP BUMPS Output Voltage Package Standard Finish Lead-free Finish2 Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 1.5V CSP CM3018-15CS MA CM3018-15CP MA 1.8V CSP CM3018-18CS MB CM3018-18CP MB 2.5V CSP CM3018-25CS MC CM3018-25CP MC 2.6V CSP CM3018-26CS MD CM3018-26CP MD 2.8V CSP CM3018-28CS ME CM3018-28CP ME 2.85V CSP CM3018-2JCS MF CM3018-2JCP MF 2.9V CSP CM3018-29CS MG CM3018-29CP MG 3.0V CSP CM3018-30CS MH CM3018-30CP MH 3.1V CSP CM3018-31CS MJ CM3018-31CP MJ 3.3V CSP CM3018-33CS MK CM3018-33CP MK
© 2004 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 07/29/04 CM3018 PRELIMINARY Specifications Note 1: The CM3018 contains a thermal overload circuit that automatically disables the device thereby preventing excessive junc- tion temperature. For example, a SOT23-5 packaged device mounted on a typical multi-layer board with a moderate heat spreading copper area (2 square inches) will allow up to 0.315W to be safely dissipated, maintaining a safe operating tem- perature. Please consult with factory for thermal evaluation assistance. Note 2: Consult CAMD Technical Support to obtain detailed power dissipation information for the CM3018 packaged in the SOT23 and CSP packages. ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS ESD Protection (HBM) +2000 V Pin Voltages VIN (pin 1) EN (pin 3) VOUT (pin 5) [GND - 0.6] to [VIN + 0.6] [GND - 0.6] to [VIN + 0.6] V V V Storage Temperature Range -65 to +150 Operating Temperature Range Ambient Junction -40 to +85 0 to +130 Power Dissipation (Notes 1,2) Internally Limited W STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS VIN 2.7 to 5.5 V Ambient Operating Temperature Range -40 to +85 Load Current 0 to +150 mA COUT 1 ±20% µF
© 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM3018 PRELIMINARY Specifications (continued) Note 1: Electrical operating characteristics are guaranteed over standard operating conditions unless otherwise noted. ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOUT Regulator Output Voltage TA = 25°C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -1% +1% V 0°C < TA < 125°C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -2% +2% V 0mA < ILOAD < 150mA; VIN-VOUT = 1V -3% +3% V VOUTRT Regulator Response Time No Load; COUT = 1µf Ceramic Cap µs RDROPOUT Dropout Resistance 0mA < ILOAD < 150mA 1.3 Ω VR LOAD Load Regulation VIN-VOUT = 1V; 10mA < ILOAD < 150mA .25 VR LINE Line Regulation 3.3V < VIN < 4.3V; ILOAD = 5mA 0.15 %/V ILIM Overload Current Limit 400 mA ISC Short Circuit Current Limit VOUT < 1V 200 mA RDISCH Discharge Resistance EN tied to ground; VIN = 3.0V 300 Ω IGND Ground Current with EN tied to VIN; ILOAD = 0mA: 100 200 µA with EN tied to VIN; ILOAD = 150mA: 110 250 µA with EN tied to GND (Disable Mode): 0.1 µA VIH Enable High Threshold Regulator enabled 0.8 1.2 V VIL Enable Low Threshold Regulator shutdown 0.4 0.7 V IEN Enable Input Current VEN > 0.8V .01 µA TDISABLE Shutdown Temperature 150 THYST Thermal Hysteresis PSRR Ripple Rejection ƒ = 120Hz; VIN − VOUT = 1V; ILOAD= 100µA; COUT = 1µF Ceramic; CBYP = 10nF dB eN Output Noise 300Hz-100kHz; COUT = 10µF Ceramic; CBYP = 10nF µVrms
© 2004 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 07/29/04 CM3018 PRELIMINARY Performance Information Typical Noise Characteristics Curves shown for CM3018-33, 3.3V output unless noted otherwise Power Supply Ripple Rejection 100 1000 10000 100000 Frequency [Hz] Ripple Rejecttion [dB] 10mA Vin = 4.3V, Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF 150mA 1mA 100uA Power Supply Ripple Rejection 100 1000 10000 100000 Frequency [Hz] Ripple Rejecttion [dB] 10mA Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 150mA 1mA 100uA Power Supply Ripple Rejection 100 1000 10000 100000 Frequency [Hz] Ripple Rejecttion [dB] 10mA 1mA 100uA 150mA Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. NO Byp cap Noise Performance 1.E-08 1.E-07 1.E-06 1.E-05 100 1000 10000 100000 frequency [Hz] Voltage [V] Vin = 4.8V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 100uA load Noise Performance 1.E-08 1.E-07 1.E-06 1.E-05 100 1000 10000 100000 frequency [Hz] Voltage [V] Vin = 4.8V Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF 100uA load
© 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM3018 PRELIMINARY Performance Information (cont’d) Typical DC Characteristics (nominal conditions unless otherwise specified) Curves shown for CM3018-33, 3.3V output unless noted otherwise Ground Current vs. Input (5mA Load) 100 150 INPUT VOLTAGE [V] GROUND CURRENT [uA] Ground Current vs. Load (VIN = 5V) 100 125 150 100 150 200 Load Current [mA] Ground Current [uA] Load Regulation (VIN = 5V) Dropout Voltage vs. Load Current (VOUT = 3.25V) 100 150 200 100 150 200 LOAD CURRENT [mA] DROPOUT VOLTAGE [mV] Line Regulation (5mA Load) 2.5 2.7 2.9 3.1 3.3 3.5 3.7 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 INPUT VOLTAGE [V] OOUTPUT VOLTAGE [V] Foldback Current Limiting (VIN = 3.8V) 3.20 3.25 3.30 3.35 3.40 100 200 300 LOAD CURRENT [mA] OUTPUT VOLTAGE [V 0.0 1.0 2.0 3.0 4.0 100 200 300 400 500 LOAD CURRENT [mA] OUTPUT VOLTAGE [V]
© 2004 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 07/29/04 CM3018 PRELIMINARY Performance Information (cont’d) Typical Transient Characteristics (nominal conditions unless specified otherwise) Curves shown for CM3018-33, 3.3V output unless noted otherwise Load transient (10% to 100%) Step Response Line Transient (1Vpp) Step Response Enable Response (CBYP = 10nF) Disable Response (CBYP = 10nF) EN VOUT NO Load COUT = 1uF Cer. EN VOUT NO Load COUT = 1uF Cer.
© 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM3018 PRELIMINARY Performance Information (cont’d) Typical Thermal Characteristics The overall junction to ambient thermal resistance (θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case (θJC) which is defined by the package style, and the second path is case to ambient (θCA) thermal resis- tance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA) = TAMB + PD ∗ (θJA) When the SOT23 version of the CM3018 is mounted on a double-sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting θJA is 175°C/W. Based on a maximum power dissipation of 320mW (Load x VIN-VOUT = 150mA x 2.2V) with an ambient of 70°C the resulting junction temperature will be: TJUNC = TAMB + PD ∗ (θJA) Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for “heat spreading”. Measurements showing performance up to a junction temperature of 125°C were performed under light load conditions (1mA). This allows the ambient temperature to be representative of the internal junction tempera- ture. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction using only the minimum size pad layout will typically provide the CM3018 in a SOT23 package with an overall θJA of 175°C/W, which allows up to 450mW to be dissipated safely. Please consult CAMD Technical Support for assistance with thermal analysis of the CM3018 with respect to a specific application. Ground Current vs. Temperature (VIN=5V) 100 100 125 TEMPERATURE [oC] GROUND CURRENT [uA] Output Voltage Change vs. Temperature (VIN=5V, 1mA Load) -50 -40 -30 -20 -10 -50 -25 100 125 TEMPERATURE [oC] OUTPUT CHANGE [mV]
© 2004 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 07/29/04 CM3018 PRELIMINARY Mechanical Details SOT23 Mechanical Specifications Dimensions for CM3018 devices packaged in 5-pin SOT23 packages are presented below. For complete information on the SOT23 package, see the California Micro Devices SOT23 Package Informa- tion document. PACKAGE DIMENSIONS Package SOT23 (JEDEC name is MO-178) Pins Dimensions Millimeters Inches Min Max Min Max A 1.45 0.057 0.00 0.15 0.000 0.006 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.75 3.05 0.108 0.120 E 2.60 3.00 0.102 0.118 1.45 1.75 0.057 0.069 e
0.95 BSC
0.0374 BSC
1.90 BSC
0.0748 BSC
L
0.60 REF
0.0236 REF
# per tape and reel 3000 pieces Controlling dimension: inches TOP VIEW e E1 E b A SIDE VIEW END VIEW D c Mechanical Package Diagrams
© 2004 California Micro Devices Corp. All rights reserved. Chip Scale Package (CSP) with OptiGuardTM coating. Devices CSP Package Information document. Figure 1. Tape and Reel Mechanical Data