CM3003-18 CALMIRCO | Alldatasheet

Document overview

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Technical content

Features

  • Adjustable Output or Internally Fixed  375mV dropout at 1.5A load current  Operates from 2.2V to 5.5V input supply  Low Ground current (330 µA at 1.5A Load)  Minimal output capacitance required  Current Limit Protection  Thermal Overload Protection  Reverse Voltage Protection  Thermally enhanced 8-pin SOIC package  Lead-free versions available

Applications

 Low Voltage "Core" processors  Graphics Cards  Gigabit NIC Cards  PC Motherboards  Notebooks Product Description The CM3003 is a family of very low dropout regulators that offers dual mode operation. When the Adjust con- trol pin (ADJ) is grounded, these devices automatically enter a fixed voltage mode and deliver either a 1.8V or 2.5V output capable of supplying 1.5A, depending on the device utilized. When the Adjust pin is connected to an external resistor network the device automatically operates as an adjustable regulator. The Adjust pin can also be tied directly to the OUT pin which configures the CM3003 as a 1.2V regulator. An Enable control pin (EN) allows the device to be placed in a low current mode. The CM3003 devices are fully protected, offering both overload current limiting, short circuit protection and high temperature thermal shutdown. These devices also includes reverse voltage protection that minimizes any reverse current flow back into the output pin. The CM3003 devices are housed in a space saving, 8- pin power SOIC packages which has been thermally enhanced (integral leadframe) to ensure maximum junction to ambient power dissipation. The CM3003 devices are available with optional lead- free finishing. Simplified Electrical SchematicTypical Application Circuit IN EN OUT GND10µF 100nF VOUT GND CM3003 ADJ VIN 2.2V - 5.5V 10µF 1.8V/2.5V@1.5A EN 1.2V Reference Voltage IN GND EN ADJ Over Current Short Circuit Over Temp 2.2V-5.5V Controller 2.5V Output when ADJ = GND OUT Automatically selects Adjustable Output (when external resistors are present) Fixed Adj 130K 120K

1.5 AMP

© 2004 California Micro Devices Corp. All rights reserved. CM3003

Ordering Information

Note 1: Parts are shipped in T ape & Reel form unless otherwise specified. PIN DESCRIPTIONS PIN(S) NAME DESCRIPTION 1 EN Enable/shutdown input. When EN is asserted high (V EN ≥ 1.2V), the regulator is enabled. When EN is asserted low (VEN ≤ 0.4V), the regulator is shut down. 2 IN Positive input voltage for the regulator. If this input pin is greater than 2 inches from the main input filter, a 10µF ceramic capacitor is recommended for adequate filtering. 3 OUT The regulated voltage output. An output capacitor of 10 µF is recommended to minimize any tran- sient load disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response. 4 ADJ Feedback input. When ADJ is grounded, the device enters fixed voltage mode. When ADJ is con- nected to an external resistor network, the device operates as an adjustable regulator. The Adjust pin can also be tied directly to the OUT pin which configures the CM3003 as a 1.2V regulator. 5-8 GND The negative reference for all voltages. Also functions as a thermal path for heat dissipation. PACKAGE / PINOUT DIAGRAM Note: This drawing is not to scale. 8-pin Power SOIC EN IN OUT ADJ GND GND GND GND TOP VIEW PART NUMBERING INFORMATION Pins Output Voltage Package Standard Finish Lead-free Finish Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 8 2.5 SOIC-8 CM3003-25SA CM3003-25SA CM3003-25SF CM3003-25SF 8 1.8 SOIC-8 CM3003-18SA CM3003-18SA CM3003-18SF CM3003-18SF

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Specifications Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional ded- icated copper area. (Please consult with factory for thermal evaluation assistance) ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS ESD Protection (HBM) ±2000 V Pin Voltages IN, OUT, ADJ, EN [GND - 0.4] to +6.0 V Storage T emperature Range -40 to +150 °C Operating Temperature Range Ambient Junction -40 to +85 -40 to +150 Power Dissipation (See note 1) Internally Limited WSTANDARD OPERATING CONDITIONS PARAMETER VALUE UNITS VIN 2.2 to 5.5 V Ambient Operating T emperature Range 0 to +85 °C Load Current 0 to 1500 mA CEXT 10 +20% µF

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Enable Pin Input Adjust Pin Input (output set by external resistors) Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOUT Regulator Output Voltage CM3003-25 CM3003-18 0mA < I LOAD < 1.5A, VIN=3.3V , VADJ=0V 2.40 1.73 2.50 1.80 2.60 1.87 V V REF Internal Reference Voltage 1.15 1.20 1.25 V ILIM Overload Current Limit V OUT > 1.2V 2.2 3.0 3.8 A ISC Short Circuit Current Limit V OUT < 0.2V 0.5 1.2 1.8 A VR LOAD Load Regulation V IN=3.3V , 100mA < ILOAD < 1.5A 5 mV VR LINE Line Regulation xx ILOAD = 5mA; 3.0V < VIN < to 5.0V 20 mV VDROPOUT Dropout Voltage I LOAD = 100mA ILOAD = 1.0A ILOAD = 1.5A 250 330 450 670 mV mV mV I GND Ground Current Regulator Disabled (EN=GND); V IN=3.3V Regulator Enabled (EN=VIN=3.3V); ILOAD= 0mA Regulator Enabled (EN=VIN=3.3V); ILOAD= 1.5A 325 330 500 550 µA µA µA I ROUT Output Reverse Leakage V OUT=3.3V; VIN = 0V 30 100 µA TDISABLE THYST Shutdown Temperature Thermal Hysteresis 160 VEN_TH EN Input Threshold Voltage Regulator Enabled 0.4 0.8 1.2 V IEN Enable Input Leakage Current 0V < VEN < 5.5V 0.1 5 µA VADJ_TH ADJ Input Threshold Voltage 0.1 0.2 0.3 V IEN ADJ Input Leakage Current VADJ > 1.1V 0.1 1 µA

© 2004 California Micro Devices Corp. All rights reserved. CM3003

Application Information

Figure 1. Application Circuit for Adjustable Output Operation.

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Performance Information CM3003 Typical DC Characteristics (TA=25°C, EN=VIN=3.3V , CIN=COUT=10uF, unless specified otherwise) CM3003-25 Device Specfic Data Output Voltage (10mA Load) with Supply 0.0 1.0 2.0 3.0 4.0 SUPPLY VOLTAGE [V] OUTPUT VOLTAGE [V] Output versus Adjust pin (2.5V) ADJUST PIN VOLTAGE [V] OUTPUT VOLTAGE [V] VIN=EN=3.3V Feedback open Ground Current with Enable Voltage 100 150 200 250 300 350 400 0123 ENABLE VOLTAGE [V] GROUND CURRENT [uA] Ground Current with Supply (EN = VIN) 100 150 200 250 300 350 400 012345 SUPPLY VOLTAGE [V] GROUND CURRENT [uA] Ground Current with Output Load 300 320 340 360 380 400 LOAD CURRENT [Amps] GROUND CURRENT [uA] Internal Reference Voltage with Supply 1.17 1.18 1.19 1.20 1.21 1.22 1.23 SUPPLY VOLTAGE [V] REFERENCE VOLTAGE [v]

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Performance Information (cont’d) CM3003 Typical DC Characteristics (TA=25°C, EN=VIN=3.3V, CIN=COUT=10uF, unless specified otherwise) CM3003-25 Device Specfic Data Line Regulation (2.5V, 10mA Load) 2.40 2.42 2.44 2.46 2.48 2.50 2.52 2.54 2.56 2.58 2.60 SUPPLY VOLTAGE [V] OUTPUT VOLTAGE [V] Load Regulation 2.47 2.48 2.49 2.50 2.51 2.52 2.53 LOAD CURRENT [Amps] OUTPUT VOLTAGE [V] Dropout Voltage (0.5A) with Supply 100 150 200 250 300 SUPPLY VOLTAGE [V] DROPOUT VOLTAGE [mV] 0.5A Load Dropout Voltage with Load 100 150 200 250 300 350 400 LOAD CURRENT [Amps] DROPOUT VOLTAGE [mV] VIN=3.3V (Adjust Mode) Current limit protection 2.0 2.1 2.2 2.3 2.4 2.5 2.6 OUTPUT CURRENT [A] OUTPUT VOLTAGE [V] Vdd = 3.3V Current limit with input voltage 0.0 1.0 2.0 3.0 4.0 SUPPLY VOLTAGE [V] OVERLOAD CURRENTS [A] DROPOUT ADJ = 0V Vout=2.4V Vout=0.1V (Short Circuit)

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Performance Information (cont’d) CM3003 Transient Characteristics (TA=25°C, EN=VIN=3.3V , CIN=COUT=10uF, unless specified otherwise) CM3003-25 Device Specific Data Cold Start Power-Up/Down with 10mA Load Cold Start Power-Up/Down with 1.5A Load Enable Power-Up with 10mA Load Enable Power-Up with 1.5A Load Power Supply Rejection with 25mA Load 10 100 1000 10000 100000 1000000 FREQUENCY [Hz] SUPPLY REJECTION [dB] VOUT=2.5V 25mA Load COUT=10uF Power Supply Rejection with 1.5A Load 10 100 1000 10000 100000 1000000 FREQUENCY [Hz] SUPPLY REJECTION [dB] VOUT=2.5V 1.5A Load COUT=10uF

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Performance Information (cont’d) CM3003 Transient Characteristics (TA=25°C, EN=VIN=3.3V , CIN=COUT=10uF, unless specified otherwise) CM3003-25 Device Specific Data Line Transient Response with 25mA Load Line Transient Response with 1.5A Load Load Transient Response (25mA to 1A) Load Transient Response (100mA to 1.5A)

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Performance Information (cont’d) CM3003 Typical Thermal Characteristics The overall junction to ambient thermal resistance (θJA) for device power dissipation (PD) consists prima- rily of two paths in series. The first path is the junction to the case (θJC) which is defined by the package style, and the second path is case to ambient ( θCA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of con- ditions can be estimated by the following thermal equa- tion: T JUNC = T AMB + PD (θJC) + PD (θCA) = TAMB + PD (θJA) The CM3003 uses a thermally enhanced package where all the GND pins (5 through 8) are integral to the leadframe. When this package is mounted on a double sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting θJA is about 50°C/W. Based on a typical operating power dissipation of 1.0W (3.0V-2.5Vx 2.0A) with an ambient of 70°C, the result- ing junction temperature will be: T JUNC = TAMB + PD (θJA) Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pin for "heat spreading". Measurements showing performance up to junction temperature of 125°C were performed under light load conditions (5mA). This allows the ambient temperature to be representative of the internal junction tempera- ture. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction, using only the minimum size pad layout, will provide the CM3003 with an overall θJA of 70°C/W which allows up to 800mW to be safely dissipated for the maximum junction temperature. Internal Reference Voltage over Temperature 1.17 1.18 1.19 1.20 1.21 1.22 0 25 50 75 100 125 150 TEMPERATURE [oC] REFERENCE VOLTAGE [v] Output Voltage (2.5V) over Temperature 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 0 25 50 75 100 125 150 TEMPERATURE [ oC] OUTPUT VOLTAGE [v] 5mA Load Ground Current over Temperature 300 310 320 330 340 350 0 25 50 75 100 125 150 TEMPERATURE [oC] GROUND CURRENT [uA]

© 2004 California Micro Devices Corp. All rights reserved. CM3003 Mechanical Details SOIC-8 Mechanical Specifications Dimensions for CM3003 devices packaged in 8-pin SOIC packages are presented below. For complete information on the SOIC-8 package, see the California Micro Devices SOIC Package Informa- tion document. * This is an approximate number which may vary. Package Dimensions for SOIC-8 PACKAGE DIMENSIONS Package SOIC Pins 8 Dimensions Millimeters Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.19 0.150 0.165 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 # per tube 100 pieces* # per tape and reel 2500 pieces Controlling dimension: inches Mechanical Package Diagrams E D H TOP VIEW L END VIEW C eB A A1SEATING PLANE SIDE VIEW 1234 8765 Pin 1 Marking