CM2021 CALMIRCO | Alldatasheet
Document overview
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- PDF pages: 8
Technical content
Features
0.05pF matching capacitance between the TMDS intra-pair Level shifting circuitry, including ±8kV ESD protec- tion on all TMDS lines Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection
Applications
Displays and Digital Television Product Description The CM2021 HDMI Receiver Port Protection and Inter- face Device is specifically designed for next generation HDMI Host interface protection. An integrated package provides all ESD, level shift and backdrive protection for an HDMI port in a single 38- Pin TSSOP package. The CM2021 part is specifically designed to comple- ment the CM2020 protection part in HDMI receivers (Displays, CE devices, etc.) Electrical Schematic TMDS_CK+ TMDS_GND TMDS_CK- TMDS_D2+ TMDS_GND TMDS_D2- TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D0+ TMDS_GND TMDS_D0- TMDS_BYP CE_REMOTE_OUT CE_REMOTE_IN DDC_CLK_OUT DDC_CLK_IN DDC_DAT_OUT DDC_DAT_IN HOTPLUG_DET_OUT HOTPLUG_DET_IN 3.3V SUPPLY TMDS_BYP 3.3V SUPPLY TMDS_BYP 3.3V SUPPLY TMDS_BYP 3.3V SUPPLY TMDS_BYP 5V_SUPPLY
© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 03/22/05 CM2021 PIN DESCRIPTIONS PINS NAME
DESCRIPTION
TMDS_BYP This input pin is used to connect an optional external 0.1uF ceramic bypass capacitor only to enhance the ESD protection level. Note: Do not connect this pin to GND or any power rail. TMDS_D2+ TMDS 0.9pF ESD protection. TMDS_D2- TMDS 0.9pF ESD protection. TMDS_D1+ TMDS 0.9pF ESD protection. TMDS_D1- TMDS 0.9pF ESD protection. TMDS_D0+ TMDS 0.9pF ESD protection. TMDS_D0- TMDS 0.9pF ESD protection. TMDS_CK+ TMDS 0.9pF ESD protection. TMDS_CK- TMDS 0.9pF ESD protection. CE_REMOTE_IN 3.3V_SUPPLY referenced logic level in. CE_REMOTE_OUT 5V_SUPPLY referenced logic level out plus 3.5pF ESD. DDC_CLK_IN 3.3V_SUPPLY referenced logic level in. DDC_CLK_OUT 5V_SUPPLY referenced logic level out plus 3.5pF ESD. DDC_DAT_IN 3.3V_SUPPLY referenced logic level in. DDC_DAT_OUT 5V_SUPPLY referenced logic level out plus 3.5pF ESD. HOTPLUG_DET_IN 3.3V_SUPPLY referenced logic level in. HOTPLUG_DET_OUT 5V_SUPPLY referenced logic level out plus 3.5pF ESD. 3.3V_SUPPLY Bias for CE / DDC / HOTPLUG level shifters. 5V_SUPPLY Bias for CE / DDC / HOTPLUG level shifters plus current source for 5V_OUT. 32, 35, 38 NC No connect. 28, 31, 34, 36 GND / TDMS_GND GND reference. 38-PIN TSSOP PACKAGE TMDS_GND NC TMDS_D1+ TMDS_GND NC TMDS_D0+ TMDS_GND NC 5V_SUPPLY 3.3V_SUPPLY GND TMDS_D2+ TMDS_BYP GND NC TMDS_GND TMDS_D2- NC TMDS_GND TMDS_D1- NC TMDS_GND TMDS_D0- NC NC TMDS_GND TMDS_CK+ TMDS_GND TOP VIEW NC CE_REMOTE_IN DDC_CLK_IN TMDS_CK- CE_REMOTE_OUT DDC_CLK_OUT DDC_DAT_OUT HOTPLUG_DET_OUT DDC_DAT_IN HOTPLUG_DET_IN PACKAGE / PINOUT DIAGRAM Note: This drawing is not to scale.
© 2005 California Micro Devices Corp. All rights reserved. 03/22/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2021
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications PART NUMBERING INFORMATION Pins Package Standard Finish Lead-free Finish Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking TSSOP-38 CM2021-00TS CM2021-00TS CM2021-00TR CM2021-00TR ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VCC5, VCC3 6.0 V DC Voltage at any Channel Input [GND - 0.5] to [VCC + 0.5] V Storage Temperature Range -65 to +150 Operating Temperature Range -40 to +85 STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL PARAMETER MIN TYP MAX UNITS 5V_SUPPLY Operating Supply Voltage 5.5 V 3V_SUPPLY Bias Supply Voltage 3.3 5.5 V
© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 03/22/05 CM2021 Specifications (cont’d) ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ICC5 Operating Supply Current 5V_SUPPLY = 5.0V 110 130 µA ICC3 Bias Supply Current 3.3V_SUPPLY = 3.3V µA IOFF OFF state leakage current, level shifting NFET 3.3V_SUPPLY = 0V 0.1 µA IBACKDRIVE Current conducted from output pins to V_SUPPLY rails when powered down 5V_SUPPLY < VCH_OUT; Signal pins: TMDS_[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT Only 0.1 µA VON VOLTAGE drop across level shifting NFET when ON 3.3V_SUPPLY = 2.5V, VS = GND, IDS = 3mA 140 mV VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA, TA = 25°C, Note 2 0.6 0.6 0.85 0.85 0.95 0.95 V V VESD ESD Withstand Voltage (IEC) Pins 4, 7,10,13, 20, 21, 22, 23, 24, 27, 30, 33; Notes 2 and 3 kV VESD ESD Withstand Voltage (HBM) Pins 1, 2, 16, 17, 18, 19, 37; Notes 2 and 4 kV VCL Channel Clamp Voltage @ 8kV HBM ESD Positive Transients Negative Transients TA = 25°C, Notes 2 and 4 9.0 -9.0 V V RDYN Dynamic Resistance Positive Transients Negative Transients I = 1A, TA = 25°C, Note 5 3.0 1.5 Ω Ω ILEAK TMDS Channel Leakage Cur- rent TA = 25°C, Note 2 0.01 µA CIN, TMDS TMDS Channel Input Capacitance 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V, Note 2 0.9 1.2 pF ∆CIN, TMDS CIN Matching Capacitance 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V, Note 2, 6 0.05 pF CMUTUAL Mutual Capacitance between signal pin and NC pin 5V_SUPPLY= 0V, Measured at 1MHz, VBIAS=2.5V, Note 2 0.07 pF CIN, DDC Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY = 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 3.5 pF
© 2005 California Micro Devices Corp. All rights reserved. 03/22/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2021 Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note 2: This parameter is guaranteed by design and verified by device characterization. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω. Note 4: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ Note 5: These measurements performed with no external capacitor on TMDS_BYP. Note 6: Intra-pair matching, each TMDS pair (i.e. D+, D-) CIN, CEC Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY = 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 3.5 pF CIN, HP Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY = 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 3.5 pF ELECTRICAL OPERATING CHARACTERISTICS
© 2005 California Micro Devices Corp. All rights reserved. Figure 1. Insertion Loss vs. Frequency (TMDS_D1- to GND)
© 2005 California Micro Devices Corp. All rights reserved. 03/22/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2021
Application Information
Figure 2. Typical Application for CM2021
38 TSSOP
© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 03/22/05 CM2021 Mechanical Details TSSOP-38 Mechanical Specifications CM2021 devices are supplied in 38-pin TSSOP pack- ages. Dimensions are presented below. For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information document. Package Dimensions for TSSOP-38 PACKAGE DIMENSIONS Package TSSOP JEDEC No. MO-153 (Variation BD-1) Pins Dimensions Millimeters Inches Min Max Min Max A 1.20 0.047 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 c 0.09 0.20 0.004 0.008 D 9.60 9.80 0.378 0.386 E
6.40 BSC
0.252 BSC
4.30 4.50 0.169 0.177 e
0.50 BSC
0.020 BSC
L 0.45 0.75 0.018 0.030 # per tape and reel 2500 pieces Controlling dimension: millimeters Mechanical Package Diagrams D E TOP VIEW L END VIEW c e b A SEATING PLANE SIDE VIEW Pin 1 Marking