CM2020 CALMIRCO | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

Features

0.05pF matching capacitance between the TMDS intra-pair Overcurrent output protection Level shifting circuitry, including ±8kV ESD protec- tion on all TMDS lines Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection

Applications

Displays and Digital Television Product Description The CM2020 HDMI Transmitter Port Protection and Interface Device is specifically designed for next gen- eration HDMI Host interface protection. An integrated package provides all ESD, level shift, overcurrent output protection and backdrive protection for an HDMI port in a single 38-Pin TSSOP package. The CM2020 part is specifically designed to comple- ment the CM2021 protection part in HDMI receivers (Displays, CE devices, etc.) The CM2020 also incorporates a silicon overcurrent protection device for +5V supply voltage output to the connector. Electrical Schematic TMDS_CK+ TMDS_GND TMDS_CK- TMDS_D2+ TMDS_GND TMDS_D2- TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D0+ TMDS_GND TMDS_D0- TMDS_VDD CE_REMOTE_OUT CE_REMOTE_IN DDC_CLK_OUT DDC_CLK_IN DDC_DAT_OUT DDC_DAT_IN HOTPLUG_DET_OUT HOTPLUG_DET_IN 3.3V SUPPLY TMDS_VDD 3.3V SUPPLY TMDS_VDD 3.3V SUPPLY TMDS_VDD 3.3V SUPPLY TMDS_VDD 5V_OUT 5V_SUPPLY 75mA OVERCURRENT SWITCH 5V_SUPPLY

© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/07/05 CM2020 PIN DESCRIPTIONS PINS NAME

DESCRIPTION

TMDS_VDD TMDS ESD diodes biased from 5V_SUPPLY through internal diode. TMDS_D2+ TMDS 0.9pF ESD protection. TMDS_D2- TMDS 0.9pF ESD protection. TMDS_D1+ TMDS 0.9pF ESD protection. TMDS_D1- TMDS 0.9pF ESD protection. TMDS_D0+ TMDS 0.9pF ESD protection. TMDS_D0- TMDS 0.9pF ESD protection. TMDS_CK+ TMDS 0.9pF ESD protection. TMDS_CK- TMDS 1pF ESD protection. CE_REMOTE_IN 3.3V_SUPPLY referenced logic level in. CE_REMOTE_OUT 5V_SUPPLY referenced logic level out plus 4pF ESD. DDC_CLK_IN 3.3V_SUPPLY referenced logic level in. DDC_CLK_OUT 5V_SUPPLY referenced logic level out plus 4pF ESD. DDC_DAT_IN 3.3V_SUPPLY referenced logic level in. DDC_DAT_OUT 5V_SUPPLY referenced logic level out plus 4pF ESD. HOTPLUG_DET_IN 3.3V_SUPPLY referenced logic level in. HOTPLUG_DET_OUT 5V_SUPPLY referenced logic level out plus 4pF ESD. 3.3V_SUPPLY Bias for CE / DDC / HOTPLUG level shifters. 5V_SUPPLY Current source for 5V_OUT. 5V_OUT 75mA minimum overcurrent protected 5V output. 28, 31, 34, 36 GND / TMDS_GND GND reference. NC No Connect. PACKAGE / PINOUT DIAGRAM Note: This drawing is not to scale. 38-PIN TSSOP PACKAGE TMDS_GND NC TMDS_D1+ TMDS_GND NC TMDS_D0+ TMDS_GND NC 5V_SUPPLY 3.3V_SUPPLY GND TMDS_D2+ TMDS_VDD GND NC TMDS_GND TMDS_D2- NC TMDS_GND TMDS_D1- NC TMDS_GND TMDS_D0- 5V_OUT NC TMDS_GND TMDS_CK+ TMDS_GND TOP VIEW NC CE_REMOTE_IN DDC_CLK_IN TMDS_CK- CE_REMOTE_OUT DDC_CLK_OUT DDC_DAT_OUT HOTPLUG_DET_OUT DDC_DAT_IN HOTPLUG_DET_IN

© 2005 California Micro Devices Corp. All rights reserved. 02/07/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2020

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications Note 1: Only one diode conducting at a time. PART NUMBERING INFORMATION Pins Package Standard Finish Lead-free Finish Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking TSSOP-38 CM2020-00TS CM2020-00TS CM2020-00TR CM2020-00TR ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VCC5, VCC3 6.0 V ESD Clamp Diode Forward DC Current (Note 1) mA DC Voltage at any Channel Input [GND - 0.5] to [VCC + 0.5] V Storage Temperature Range -65 to +150 Operating Temperature Range -40 to +85 STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL PARAMETER MIN TYP MAX UNITS 5V_SUPPLY Operating Supply Voltage 5.5 V 3.3V_SUPPLY Bias Supply Voltage 3.3 5.5 V

© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/07/05 CM2020 Specifications (cont’d) ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ICC5 Operating Supply Current 5V_SUPPLY = 5.0V 100 110 130 µA ICC3 Bias Supply Current 3.3V_SUPPLY = 3.3V µA VDROP 5V_OUT Overcurrent Output Drop 5V_SUPPLY= 5.0V, IOUT=55mA 100 mV ISC 5V_OUT Short Circuit Current Limit 5V_SUPPLY= 5.0V, 5V_OUT = GND 135 175 mA IOFF OFF state leakage current, level shifting NFET 3.3V_SUPPLY = 0V 0.1 µA IBACKDRIVE Current conducted from output pins to V_SUPPLY rails when powered down 5V_SUPPLY < VCH_OUT; Signal pins: TMDS_[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT, 5V_OUT Only 0.1 µA VON VOLTAGE drop across level shifting NFET when ON 3.3V_SUPPLY = 2.5V, VS = GND, IDS = 3mA 140 mV VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA, TA = 25°C, Note 2 0.6 0.6 0.85 0.85 0.95 0.95 V V VESD ESD Withstand Voltage (IEC) Pins 4, 7, 10, 13, 20, 21, 22, 23, 24, 27, 30, 33; Notes 2 and 3 kV VESD ESD Withstand Voltage (HBM) Pins 1, 2, 16, 17, 18, 19, 37, 38; Notes 2 and 4 kV VCL Channel Clamp Voltage @ 8kV HBM ESD Positive Transients Negative Transients TA = 25°C, Notes 2 and 4 9.0 -9.0 V V RDYN Dynamic Resistance Positive Transients Negative Transients I = 1A, TA = 25°C, Note 5 3.0 1.5 Ω Ω ILEAK TMDS Channel Leakage Cur- rent TA = 25°C, Note 2 0.01 µA CIN, TMDS TMDS Channel Input Capacitance 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V, Note 2 0.9 1.2 pF ∆CIN, TMDS CIN Matching Capacitance 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V, Note 2, 6 0.05 pF CMUTUAL Mutual Capacitance between signal pin and NC pin 5V_SUPPLY= 0V, Measured at 1MHz, VBIAS=2.5V, Note 2 0.07 pF

© 2005 California Micro Devices Corp. All rights reserved. 02/07/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2020 Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note 2: This parameter is guaranteed by design and verified by device characterization. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω. Note 4: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ Note 5: These measurements performed with no external capacitor on TMDS_VDD. Note 6: Intra-pair matching, each TMDS pair (i.e. D+, D-) CIN, DDC Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY= 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 pF CIN, CEC Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY= 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 pF CIN, HP Level Shifting Input Capaci- tance, Capacitance to GND 5V_SUPPLY= 0V, Measured at 100KHz, VBIAS=2.5V, Note 2 pF ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)

© 2005 California Micro Devices Corp. All rights reserved. Figure 1. Insertion Loss vs. Frequency (TMDS_D1- to GND)

© 2005 California Micro Devices Corp. All rights reserved. 02/07/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com CM2020

Application Information

Figure 2. Typical Application for CM2020

38 TSSOP

© 2005 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/07/05 CM2020 Mechanical Details TSSOP-38 Mechanical Specifications CM2020 devices are supplied in 38-pin TSSOP pack- ages. Dimensions are presented below. For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information document. Package Dimensions for TSSOP-38 PACKAGE DIMENSIONS Package TSSOP JEDEC No. MO-153 (Variation BD-1) Pins Dimensions Millimeters Inches Min Max Min Max A 1.20 0.047 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 c 0.09 0.20 0.004 0.008 D 9.60 9.80 0.378 0.386 E

6.40 BSC

0.252 BSC

4.30 4.50 0.169 0.177 e

0.50 BSC

0.020 BSC

L 0.45 0.75 0.018 0.030 # per tape and reel 2500 pieces Controlling dimension: millimeters Mechanical Package Diagrams D E TOP VIEW L END VIEW c e b A SEATING PLANE SIDE VIEW Pin 1 Marking