CM2020-00TR ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Features

  • HDMI 1.3 compliant
  • 0.05pF matching capacitance between the TMDS intra-pair
  • Overcurrent output protection
  • Level shifting/isolation circuitry
  • Provides ESD protection to IEC61000-4-2 Level 4 - 8kV contact discharge - 15kV air discharge
  • Matched 0.5mm trace spacing (TSSOP)
  • Simplified layout for HDMI connectors
  • Backdrive protection
  • RoHS-compliant, lead-free packaging

Applications

  • PC
  • Consumer Electronics
  • Set Top Box
  • DVDRW Players Product Description The CM2020-00TR HDMI Transmitter Port Protection and Interface device is specifically designed for n ext generation HDMI source interface protection. An integrated package provides all ESD, level shift , overcurrent output protection and backdrive protection for an HDMI port in a single 38-Pin TSSO P package. The CM2020-00TR part is specifically designed to complement the CM2021 protection part in HDMI receivers (Displays, DTV, CE devices, etc.) The CM2020-00TR also incorporates a silicon overcurrent protection device for +5V supply voltag e output to the connector.

Rev. 4 | Page 2 of 13 | www.onsemi.com Electrical Schematic

Rev. 4 | Page 3 of 13 | www.onsemi.com Pin Descriptions PIN DESCRIPTIONS PINS NAME ESD Level DESCRIPTION 4, 35 TMDS_D2+ 8kV TMDS 0.9pF ESD protection 6, 33 TMDS_D2- 8kV TMDS 0.9pF ESD protection 7, 32 TMDS_D1+ 8kV TMDS 0.9pF ESD protection 9, 30 TMDS_D1- 8kV TMDS 0.9pF ESD protection 10, 29 TMDS_D0+ 8kV TMDS 0.9pF ESD protection 12, 27 TMDS_D0- 8kV TMDS 0.9pF ESD protection 13, 26 TMDS_CK+ 8kV TMDS 0.9pF ESD protection 15, 24 TMDS_CK- 8kV TMDS 0.9pF ESD protection

16 CE_REMOTE_IN 2kV

LV_SUPPLY referenced logic level into ASIC.

23 CE_REMOTE_OUT 8kV

5V_SUPPLY referenced logic level out plus 3.5pF ES D to connector.

17 DDC_CLK_IN 2kV

LV_SUPPLY referenced logic level into ASIC.

22 DDC_CLK_OUT 8kV

5V_SUPPLY referenced logic level out plus 3.5pF ES D to connector.

18 DDC_DAT_IN 2kV

LV_SUPPLY referenced logic level into ASIC.

21 DDC_DAT_OUT 8kV

5V_SUPPLY referenced logic level out plus 3.5pF ES D to connector.

19 HOTPLUG_DET_IN 2kV

LV_SUPPLY referenced logic level into ASIC.

20 HOTPLUG_DET_OUT 8kV

5V_SUPPLY referenced logic level out plus 3.5pF ES D to connector

2 LV_SUPPLY 2kV

Bias for CE / DDC / HOTPLUG level shifters. 1 5V_SUPPLY 2kV Current source for 5V_OUT. 38 5V_OUT 8kV 55mA minimum overcurrent protected 5V output. This output must be bypassed with a 0.1 µ F ceramic capacitor.

37 ESD_BYP 2kV

This pin must be connected to a 0.1 µ F ceramic capacitor. 3, 36 GND N/A Supply GND reference. 5, 34, 8, 31, 11, 28, 14, TMDS_GND N/A TMDS ESD and Parasitic GND return. Note 1: These 2 pins need to be connected together in-line on the PCB. Note 2: This output can be connected to an external 0.1 µ F ceramic capacitor, resulting in an increased ESD withstand voltage rating. Note 3: Standard IEC 61000-4-2, C DISCHARGE =150pF, R DISCHARGE =330 Ω , 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1 µ F ceramic capacitor connected to GND. Note 4: Human Body Model per MIL-STD-883, Method 30 15, C DISCHARGE =100pF, R DISCHARGE =1.5k Ω , 5V_SUPPLYand LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1 µ F ceramic capacitor connected to GND. Note 5: These pins should be routed directly to the associated GND pins on the HDMI connector with sin gle point ground vias at the connector

Rev. 4 | Page 4 of 13 | www.onsemi.com

Ordering Information

PART NUMBERING INFORMATION Pins Package Ordering Part Number Part Marking

38 TSSOP-38 CM2020-00TR CM2020-00TR

Note 1: Parts are shipped in Tape and Reel form unl ess otherwise specified. Backdrive protection Below, two scenarios are discussed to illustrate what can happen when a powered device is connected to an unpowered device via a HDMI interface, substantiating the need for backdrive protection on this type of interface. In the first example a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when "off", if there may be very little parasitic shunt resistance, and even with as little as a few milliamps of "backdrive" current flowing into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-on- reset (POR) voltage level of some of the integrated circuits in the DVD player, these devices may not reset properly when the DVD player is turned back on. In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter and DRC diodes for ESD protection, there is even a risk for permanent damage. In this case, if there is a pullup resistor (such as with DDC) on the other end of the cable, then that resistance will pull the SOC chips "output" up to a high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar fashion as described in the first example. If this current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip's internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2020-00TR was designed to block backdrive current, guaranteeing no more than 5mA on any I/O pin when the I/O pin voltage is greater than the CM2020-00TR supply voltage. Figure 1. Backdrive Protection Diagram.

Rev. 4 | Page 5 of 13 | www.onsemi.com Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VCC5V , V CCLV 6.0 V DC Voltage at any Channel Input 6.0 V Storage Temperature Range -65 to +150 ° C STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL PARAMETER MIN TYP MAX UNITS 5V_SUPPLY Operating Supply Voltage GND 5 5.5 V LV_SUPPLY Bias Supply Voltage 1 3.3 5.5 V Operating Temperature Range -40 85 ° C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ICC5V Operating Supply Current 5V_SUPPLY = 5.0V 110 130 µ A ICCLV Bias Supply Current LV_SUPPLY = 3.3V 1 5 µ A VDROP 5V_OUT Overcurrent Output Drop 5V_SUPPLY= 5.0V, I OUT =55mA 65 100 mV ISC 5V_OUT Short Circuit Current Limit 5V_SUPPLY= 5.0V, 5V_OUT = GND 90 135 175 mA IOFF OFF state leakage current, level shifting NFET LV_SUPPLY 0V 0.1 5 µ A IBACKDRIVE Current conducted from output pins to V_SUPPLY rails when powered down 5V_SUPPLY V CH_OUT ; Signal pins: TMDS_D[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT, 5V_OUT Only 0.1 5 µ A IBACKDRIVE, CEC Current through CE-REMOTE_OUT when powered down CE-REMOTE_IN = LV_SUPPLY < CE_REMOTE_OUT 0.1 1 µ A

Rev. 4 | Page 6 of 13 | www.onsemi.com SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VON VOLTAGE drop across level shifting NFET when ON LV_SUPPLY = 2.5V, V S = GND, IDS = 3mA 75 95 140 mV VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA, T A = 25° C 0.6 0.6 0.85 0.85 0.95 0.95 V V VESD ESD Withstand Voltage, contact discharge per IEC 61000-4-2 standard (IEC) Pins 4, 7, 10, 13, 20, 21, 22, 23, 24, 27, 30, 33, 38; T A=25° C Note 2 ±8 kV VCL Channel Clamp Voltage Positive Transients Negative Transients T A=25° C, I PP = 1A, t P = 8/20uS; Note 3 10.8 -2.1 V V RDYN Dynamic Resistance Positive Transients Negative Transients IPP = 1A, t P = 8/20 µ S; T A = 25° C; Note 3 1.4 0.9 Ω Ω ILEAK TMDS Channel Leakage Current T A = 25° C 0.01 1 µ A CIN, TMDS TMDS Channel Input Capacitance 5V_SUPPLY= 5.0V, Measured at 1MHz, V BIAS =2.5V 0.9 1.2 pF ∆ CIN, TMDS TMDS Channel Input Capacitance Matching 5V_SUPPLY= 5.0V, Measured at 1MHz, V BIAS =2.5V; Note 4 0.05 pF CIN, DDC Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, V BIAS =2.5V; Note 2 3.5 4 pF CIN, CEC Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, V BIAS =2.5V 3.5 4 pF CIN, HP Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, V BIAS =2.5V 3.5 4 pF Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note2: Standard IEC 61000-4-2, C DISCHARGE =150pF, R DISCHARGE =330 Ω , 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1 µ F ceramic capacitor connected to GND. Note 3: These measurements performed with no extern al capacitor on ESD_BYP. Note 4: Intra-pair matching, each TMDS pair (i.e. D +, D-)

Figure 2. Insertion Loss vs. Frequency (TMDS_D1- t o GND)

Rev. 4 | Page 8 of 13 | www.onsemi.com

Application Information

Figure 3. Typical Application for CM2020-00TR

Rev. 4 | Page 9 of 13 | www.onsemi.com Application Information (cont’d) Design Considerations ESD Bypass Pin 37 (ESD_BYP) is provided for an optional external ESD bypass capacitor only (i.e. 0.1mF ceramic.) It should not be connected to any supply rail. 5V Overcurrent Output Maximum Overcurrent Protection output drop at 55mA on 5V_OUT is 100mV. To meet HDMI output bypass capacitor on this output is also recommended. Hotplug Detect Input To meet the requirements of HDMI CTS TID7-12, the f ollowing pullup/pulldown configuration is recommend ed for a 3.3V+/-10% internal VCC rail (See Figure 4 below). A 0.1 µ F ceramic capacitor is recommended for additional edge debounce and ESD bypass. DUT On vs. DUT Off Many HDMI CTS tests require a power off condition o n the System Under Test. Many Dual Rail Clamp (DRC) ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby exhibiting extremely high apparent capacitance meas urements, for example. The MediaGuard TM backdrive isolation circuitry limits this current to <5 µ A, and will help ensure compliance.

Figure 4. Design Example

Rev. 4 | Page 11 of 13 | www.onsemi.com Mechanical Details TSSOP-38 Mechanical Specifications CM2020-00TR devices are supplied in 38-pin TSSOP pa ckages. Dimensions are presented below. PACKAGE DIMENSIONS Package TSSOP JEDEC No. MO-153 (Variation BD-1) Pins 38 Millimeters Inches Dimensions Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 c 0.09 0.20 0.004 0.008 D 9.60 9.80 0.378 0.386 E 6.40 BSC 0.252 BSC E1 4.30 4.50 0.169 0.177 e 0.50 BSC 0.020 BSC L 0.45 0.75 0.018 0.030 # per tape and reel 2500 pieces Controlling dimension: millimeters Package Dimensions for TSSOP-38

Rev. 4 | Page 12 of 13 | www.onsemi.com Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A 0 X K 0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P 0 P 1

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