CM05X7R223K16AH KSS | Alldatasheet

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Technical content

Features

  • We have factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as one of the highest-volume producers in the industry.
  • All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes.
  • By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications.
  • Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and super quality.
  • Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. CM series DN/DR series CU series CT series CF series CA series General AutomotiveLow ESR Arrays High-VoltageLow Profile Multilayer Ceramic Chip Capacitors Multilayer Ceramic Chip Capacitors

Series Dieletric Options Typical Applications Features Terminations Available Size (EIA) CM CF CT ∗DN/DR CU CA C0G (NP0) X5R X7R 0201, 0402, 0603 X6S General Purpose Wide Cap Range Nickel Barrier 0805, 1206, 1210 X7S 1812, 2211, 2220 Y5V NTC∗ 0805, 1206, 1210 C0G (NP0) High Voltage High Voltage 1812, 2208, 1808& 250VDC, 630VDC Nickel BarrierX7R Power Circuits 1000VDC, 2000VDC 22203000VDC, 4000VDC C0G (NP0) X5R PLCC 0402, 0603, 0805 X7R (Decoupling) Low Profile Nickel Barrier 1206, 1210 Y5V C0G (NP0) Thermal shock U (750) Automotive Resistivity Nickel Barrier 0603, 0805, 1206 X7R High Reliability C0G (NP0) RF Circuit Low ESR Nickel Barrier 0402, 0603 C0G (NP0) Digital Signal Reduction in X5R Pass line Placing Costs Nickel Barrier 0405, 0508, 0612 Kyocera Ceramic Chip Capacitors are available for different applications as classified below: ∗ NTC: Negative Temperature coefficient types are available on request. ∗ DN Series: Silver Palladium termination is available on request. ∗ CA Series: X7R, Y5V are available on request. Multilayer Ceramic Chip Capacitors

Tape & Reel

  • CT21, CT316 : (L) 3.2±0.2mm and (W)1.6±0.2mm
  • T (Thickness) depends on capacitance value. Standard thickness is shown on the appropriate product pages.
  • DR series 105, 21 size (L)(W)(T) Tolerance ±0.15mm
  • CA series (please refer page 19) Bulk Cassette Size EIA CODE EIAJ CODE Dimensions (mm) LW P min P max P to P min T max 105 316 Size EIA CODE EIAJ CODE L W T PP to P min max min 105 Dimensions External Terminations Electrode External Dimensions P P T WL P~P Multilayer Ceramic Chip Capacitors

KYOCERA PART NUMBER: CM 21 X7R 104 K 50 A T SERIES CODE CM = General Purpose CA = Capacitor Arrays CF = High Voltage CU = Low ESR CT = Low Profile DN/DR = Automotive SIZE CODE SIZE EIA (EIAJ) SIZE EIA (EIAJ) SIZE EIA (EIAJ) 03 = 0201 (0603) 21 = 0805 (2012) 52 = 2208 (5720) 05 = 0402 (1005) 316 = 1206 (3216) 53 = 5728 (2211) 105 = 0603 (1608) 32 = 1210 (3225) 55 = 2220 (5750) F12 = 0508 (1220)/4cap 42 = 1808 (4520) D11 = 0405 (1012)/2cap F13 = 0612 (1632)/4cap 43 = 1812 (4532) D12 = 0508 (1220)/2cap CODE EIA CODE CG = C0G (NPO) X7S = X7S X5R = X5R X6S = X6S (Option) X7R = X7R Y5V = Y5V Negative dielectric types are available on request. DIELECTRIC CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, eg. 100000pF = 104 1.5pF = 1R5 0.1µF = 104 0.5pF = R50 4700pF = 472 100 µF = 107 CAPACITANCE CODE Thickness max value is indicated in CT series EX. 125 → 1.25mm max 095 → 0.95mm max OPTION B= ±0.1pF F = ±1pF K = ±10% TOLERANCE CODE 04 = 4VDC 100 = 100VDC 1000 = 1000VDC 06 = 6.3VDC 250 = 250VDC 2000 = 2000VDC 10 = 10VDC 400 = 400VDC 3000 = 3000VDC 16 = 16VDC 630 = 630VDC 4000 = 4000VDC 25 = 25VDC 35 = 35VDC 50 = 50VDC VOLTAGE CODE A= Nickel Barrier C = Silver ( ∗option) B= Silver Palladium (∗option) TERMINATION CODE B= Bulk L = 13" Reel Taping & 4mm Cavity pitch C= Bulk Cassette H = 7" Reel Taping & 2mm Cavity pitch T= 7" Reel Taping & 4mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch PACKAGING CODE Multilayer Ceramic Chip Capacitors

Ordering Information

Temperature Compensation Type K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C e.g. CG = 0±30ppm/°C, PH = −150±60ppm/°C Note: All parts will be marked as "CG" but will conform to the above table. Available Tolerances Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric Temperature Range ∆Cmax X5R −55 to 85°C X7R −55 to 125°C ±15% X7S −55 to 125°C ±22% X6S −55 to 105°C Y5V −30 to 85°C −82 to +22% Electric Code 1B/C0G P∆ R ∆ S∆ T∆ U ∆ SL Value (pF) N150 N220 N330 N470 N750 +350 to −1000 0.5-2.7 CK PK RK SK TK UK SL 3.0-3.9 CJ PJ RJ SJ TJ UJ SL 4.0-9.0 CH PH RH SH TH UJ SL ≥10 CG PH RH SH TH UJ SL Note: ∗1 NTC : Negative Temperature Compensation types are available on request as shown on product pages. ∗2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, ∗3 J = ±5% for X7R(X5R) is available on request. ∗4 option EIA Dielectric Standard Tolerance Capacitance COG NTC ∗1 X5R X6R X7R Y5V ∗4 A=±0.05pF ≤0.5pF ∗4 B=±0.1pF ≤5pF C =±0.25pF D =±0.50pF ∗2 <10pF F=±1pF G =±2% ≥10pF J=±5% K=±10% E12 Series ∗3 K=±10% E6 Series M =±20% Z=−20% to +80% E3 Series E Standard Number E3 E6 E12 E24 (Option) 1.0 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 1.0 1.0 1.5 2.2 2.2 3.3 4.7 4.7 6.8 Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance

R20 0.2 R50 0.5 1R0 1.0 1R5 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 100 10 120 12 101 100 121 120 150 180 220 270 330 390 470 560 680 820 102 1000 122 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 103 10000 123 12000 15000 18000 C B A A A A A A BBB H H D G E D G E F E E E D D D D D E B C We offer a diverse product line ranging from ultra-compact (0.6×0.3 mm) to large (5.7×5.0 mm) components configured for a variety of temperature characteristics, rated voltages, and packages. We offer the choice and flexibility for almost any applications. Application This standard type is ideal for use in a wide range of applications, from commercial to industrial equipment. Temperature Compensation Dielectrics Thickness and standard package quantity Note : P8 = 8mm width paper tape E8 = 8mm width plastic tape E12 = 12mm width plastic tape ∗ Carrier tape 2mm pitch from one capacitor to another. BA C C D E F K LJ G I J K LH Size Thickness (mm) Taping(180 dia reel) Taping(330 dia reel) 03 05 105 ∗105 21, 316, 32 15kp(P8) 10kp(P8) 4kp(P8) 8kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8) 1kp(E8) ——— 50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8) 5kp(E8) 5kp(E8) 5kp(E8) ——— M Size Thickness (mm) Taping(178 dia reel) Taping(330 dia reel) 43, 55 1kp(E12) 1kp(E12) 0.5kp(E12) 0.5kp(E12) Size (mm) Temperature Characteristics Rated Voltage (VDC) Capacitance (pF) CM03 (0603) CM05 (1005) CM105 (1608) CM21 (2012) CM316 (3216) CM32 (3225) 25 2516 25 16 25 50 50 50 50 100 16 25 50 100 25 50 100 501610 CM Series Nickel Barrier Terminations

(3216) CM32 (3225) CM43 (4532) A 6.3 B B B C C C GGG G F L L L 104 100000 220000 470000 105 1000000 2200000 4700000 106 10000000 22000000 47000000 107 100000000 J F L K H 50 K H B C G G D E K LL CM03 (0603) A A C CM05 (1005) CM105 (1608) CM21 (2012) I L B B G∗1 6.3 /;/; /;/; /;/; /;/; G C C 6.3 C /;/; /;/; C∗1 J∗2 6.3 6.3 L M∗2 J∗2 6.3 J∗2 X5R Dielectric ∗ Non standard specification, please contact us for further information. ∗1 Length(L, T) tolerance ±0.15 ∗2 Length(L, T) tolerance ±0.2 Size (mm) Size (mm) Rated Voltage (VDC) Capacitance (pF) Rated Voltage (VDC) Capacitance (pF) Optional Spec. CM Series Nickel Barrier Terminations

X7R, X7S Dielectric 101 100 151 150 220 330 470 680 102 1000 152 1500 2200 3300 4700 6800 103 10000 153 15000 22000 33000 47000 68000 104 100000 154 150000 220000 330000 470000 680000 105 1000000 155 1500000 2200000 3300000 4700000 16 16 6.3 25 50 10 6.3 16 25 50 100 10 41 6 2 55 0 100 103 10000 22000 47000 104 100000 220000 470000 105 1000000 2200000 4700000 106 10000000 22000000 106.3 16 25 50 100 10 6.3 16 25 50 100 16 100 100 50 J L L H K H KH K L I L L L L F E F F J JJ F B B B C G D E C C C C C A G G G G D E CM03 (0201) CM05 (0402) CM105 (0603) CM21 (0805) CM316 (1206) CM32 (1210) CM43 (1812) CM55 (2220) B G L ∗ Only X7S available ∗2 Length(W, T) Tolerance ±0.2, X7S available Y5V Dielectric 102 1000 2200 472 4700 103 10000 22000 473 47000 104 100000 220000 474 470000 105 1000000 2200000 475 4700000 106 10000000 22000000 476 47000000 A C C C C A B B B G E G D E G J J K F F H F E G 50251610502516105025161050251610502516106.3 CM03 (0201) CM05 (0402) CM105 (0603) CM21 (0805) CM316 (1206) CM32 (1210) J J H Thickness and standard package quantity Note : P8 = 8mm width paper tape E8 = 8mm width plastic tape E12 = 12mm width plastic tape ∗ Carrier tape 2mm pitch from one capacitor to another. BA C C D E F K LJ G I J K LH Size Thickness (mm) Taping(180 dia reel) Taping(330 dia reel) 03 05 105 ∗105 21, 316, 32 15kp(P8) 10kp(P8) 4kp(P8) 8kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8) 1kp(E8) ——— 50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8) 5kp(E8) 5kp(E8) 5kp(E8) ——— M Size Thickness (mm) Taping(178 dia reel) Taping(330 dia reel) 43, 55 1kp(E12) 1kp(E12) 0.5kp(E12) 0.5kp(E12) Size (mm) Rated Voltage (VDC) Capacitance (pF) Size (mm) Rated Voltage (VDC) Capacitance (pF) Size (mm) Rated Voltage (VDC) Capacitance (pF) J CM Series Nickel Barrier Terminations GG C C

-10 -60 -40 -20 0 20 40 60 80 100 120 DCapacitance(%) Temperature(°C) at 1MHz, 1Vrms C ∆ R ∆ U ∆ Aging (change of capacitance over time) Capacitance-Temperature (temperature compensation) Impedance-Frequency -3010 100 1,000 100,000 10,000 -20 -10 DCapacitance(%) Duration(hrs) For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms C ∆ X7R Y5V ∗Initial value should be after 48hr of Heat treatment. AC VoltageDC Bias For temperature compensation at 1MHz, 1Vrms For high dielectric constant at 1kHz, 1Vrms Rated at 25V : Y5U Rated at 25V : C∆, X7R, Y5V -10 12345 DCapacitance(%) AC Voltage(Vrms) For temperature compensation : 1MHz

1 Vrms/for high dielectric constant : 1kHz

Rated at 25V : Y5U Rated at 25V : C∆, X7R, Y5V Y5V X7R C ∆ Capacitance-Temperature (high dielectric constant) Please verify individual characteristics at the design stage to ensure total suitability −100 05 1 0 15 20 25 −60 −80 −40 −20 ∆C/C(%) VDC CH X7R(X5R) Y5V 100 0.0010.1 1 10 100 1,000 10,000 0.01 0.1 Impedance(Ω ) Frequency(MHz) at 1Vrms Y5V 10 µF Y5V 100 µF W5R(B)1Y5V 1 µF W 5R(B)/Y5V 0.1 µF W 5R(B)/Y5V 0.01 µF W 5R(B)1000pF CH 1000pF CH 100pF CH 10pF CH 1pF -100 -60 -40 -20 0 20 40 60 80 100 120 -60 -80 -40 -20 ∆Capacitance(%) at 1kHz, 1VrmsY5U, X7R, Y5V X7R(X5R) at RV/2 X7R(X5R) at 0VDC Y5V at 0VDC Y5V at RV/2 Temperature(˚C) Multilayer Ceramic Chip Capacitors

Electrical Characteristics

Test conditions and Specification for Temperature Compensation type(C∗ to U∗ • SL characteristics) Test Items Specification (C: nominal capacitance) Test Conditions Capacitance Value Within tolerance Q C ≥30pF: Q≥1000 C<30pF: Q≥400+20C Insulation resistance (IR)10,000MΩ or 500MΩ •µF min, whichever is less Dielectric Resistance No problem observed Appearance No problem observed Microscope(10 ×magnification) Termination strength No problem observed Bending strength No mechanical damage at 1mm bent Vibration Appearance No significant change is detected. test ∆C Within tolerance Q C ≥30pF: Q≥1000 C<30pF: Q≥400+20C Soldering Appearance No significant change is detected. heat ∆C ±2.5% or ±0.25pF max, whichever is larger.resistance Q C ≥30pF: Q≥1000 C<30pF: Q≥400+20C IR 10,000MΩ or 500MΩ •µF min, whichever is smaller Withstand voltage Resists without problem Solderability Ni/Br termination: 90% min Soaking Condition Temperature Appearance No significant change is detected. cycle ∆C ±2.5% or ±0.25pF max, whichever is larger. Q C ≥30pF: Q≥1000 C<30pF: Q≥400+20C IR 10,000MΩ or 500MΩ •µF min, whichever is samller Withstand voltage Resists without problem Humidity Appearance No significant change is detected. test ∆C ±7.5% or ±0.75pF max, whichever is larger. Q C ≥30pF: Q≥200 C<30pF: Q≥100+10C/3 IR 500M Ω or 25MΩ •µF min, whichever is smaller High- Appearance No significant change is detected. temperature ∆C ±3% or ±0.3pF max, whichever is larger.with C ≥30pF: Q≥350 Q 10pF≤C<30pF: Q≥275+5C/2 loading C<10pF: Q≥200+10C IR 1,000MΩ or 50MΩ •µF min, whichever is smaller C ≤1000pF 1MHz ±10% 0.5 to C>1000pF 1kHz ±10% 5Vrms Order Temperature Time 1 80 to 100°C 2minutes 2 150 to 200°C 2minutes Sn63 Solder 235±5°C2 ±0.5sec. Sn-3Ag-0.5Cu 245±5°C3 ±0.5sec. Measured after the rated voltage is applied for one minute at normal room temperature and humidity. (∗4) Apply a sideward force of 500g(5N) (∗7) to a PCB-mounted sample. Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 10→ 55→ 10Hz/min In X, Y and Z directions: 2 hours each Total 6 hours Soak the sample in 260°C ±5°C solder for 10±0.5seconds and place in a room at normal temperature and humidity; measure after 24±2hours. (Preheating Conditions) (Cycle) Normal room temperature (3min)→ Lowest operation temperature (30min)→ Normal room temperature (3min)→ Highest operation temperature (30min)→ After five cycles (∗3), measure after 24±2hours. Measure the test sample after storing it 24±2hours at a temperature of 40°C ±2°C and a relative humidity of 90-95% Rh. for 500+24/−0hours. After applying (∗1) twice of the rated voltage at a temperature of 125±3°C for 1000+48/−0hours, measure the sample after storing 24±2hours. (∗1) Apply 3 times of the rated voltage for 1 to 5 seconds. ∗1 For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when the rated voltage exceeds 630V. ∗2 Except CT series ∗3 Different specification for Nickel Barrier termination DN/DR series. (Alumina Substrate) ∗4 Apply 500V for 1minite in case the rated voltage is 1000V or higher. ∗5 Except CF series. ∗6 The charge and discharge current of the capacitor must not exceed 50mA. ∗7 2N at 0201 Size (∗3) (∗5) (∗6) (∗6) (∗2) (∗2) (∗6) (∗6) (∗6) (∗6) (∗6) (∗6) Multilayer Ceramic Chip Capacitors Test Conditions and Standards

X7R/X5R Y5V Test Condition Capacitance Value Within tolerance Do previous treatment (∗8, ∗14) Insulation resistance (IR)10,000MΩ or 500MΩ •µF min, whichever is less Dielectric Resistance No problem observed Appearance No problem observed Microscope(10 ×magnification) Termination strength No problem observed Bending strength test No problem observed at 1mm bent Vibration Appearance No significant change is detected. test ∆C Within tolerance tanδ(%) Satisfies the initial value. Soldering Appearance No significant change is detected. heat ∆C Within ±7.5% Within ±20%resistance tanδ(%) Satisfies the initial value. IR 10,000MΩ or 500MΩ •µF min, whichever is smaller Withstand voltage Resists without problem Solderability Ni/Br termination: 90% min Soaking Condition Temperature Appearance No significant change is detected. cycle ∆C Within ±7.5% Within ±20% tanδ(%) Satisfies the initial value. IR 10,000MΩ or 500MΩ •µF min, whichever is smaller Withstand voltage Resists without problem Humidity Appearance No significant change is detected. test ∆C Within ±12.5% Within ±30% tanδ(%) 200% max of 150% max of initial value initial value IR 500M Ω or 25MΩ •µF min, whichever is smaller High- Appearance No significant change is detected. temperature ∆C Within ±12.5% Within ±30%with tanδ(%) 200% max of 150% max of initial value initial value loading IR 1,000MΩ or 50MΩ •µF min, whichever is smaller Order Temperature Time 1 80 to 100°C 2minutes 2 150 to 200°C 2minutes Capacitance Fire Vol C ≤10µF 1kHz±10% 1.0 ±0.1Vrms C>10 µF 120Hz±10% 0.5±0.1Vrms Measured after the rated voltage is applied for 2minutes at normal room temperature and humidity. (∗10) Apply a sideward force of 500g(5N) (∗16) to a PCB-mounted sample. Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 10→ 55→ 10Hz/min In X, Y and Z directions: 2 hours each Total 6 hours Do previous treatment (∗8) Soak the sample in 260°C ±5°C solder for 10±0.5seconds and place in a room at normal temperature and humidity; measure after 48±4hours. (Preheating Conditions) Do previous treatment (∗8) (Cycle) Normal room temperature (3min)→ Lowest operation temperature (30min)→ Normal room temperature (3min)→ Highest operation temperature (30min)→ After five cycles (∗7), measure after 48±4hours. Do previous treatment (∗9) After storing it at a temperature of 40°C ±2°C and a relative humidity of 90-95% for 500+24/−0hours, measure the sample after storing 48±4hours. Do previous treatment (∗9) After applying twice (∗18) of the rated voltage at the highest operating temperature for 1000+48/−0hours, measure the sample after storing 48±4hours. (∗1) Apply 2.5 times of the rated voltage for 1 to 5 seconds. Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V) initial value *1 Use 1.5 times when the rated voltage is 250V or over. Use 1.2 times when the rated voltage is 630V or over. *2 Apply to X5R 35V type, X7R 16V/25V type. *3 Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type. *4 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). *5 Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226. *6 Exclude CT series with thickness of less than 0.66mm and CA series. *7 Different Specification for Nickel Barrier termination DN/DR series. (Alumina Substrate) *8 Keep specimen at 150°C +0/−10°C for one hour, leave specimen at room ambient for 48±4 hours. *9 Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours. *10 For the CF series over 1000V, apply 500V for 1 minutes at room ambient. *11 Except CF series. *12 Apply to X5R 10V type, X7S 4V type. *13 Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over. *14 Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type. *15 The charge/discharge current of the capacitor must not exceed 50mA. *16 2N at 0201 Size *17 Apply to X5R 4V and 6.3V type. *18 Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105). Use 1.2times when the rated voltage is 630V or over. (∗15) (∗15) (∗6) (∗6) (∗15) (∗15) (∗15) (∗15) (∗15) (∗15) (∗7) (∗11) Sn63 Solder 235±5°C2 ±0.5sec. Sn-3Ag-0.5Cu 245±5°C3 ±0.5sec. Multilayer Ceramic Chip Capacitors Test Conditions and Standards

  • Reel Reel (code : T) Carrier Tape Bulk Cassette A R E C D W 1 W 2 B (Unit : mm) (Unit : mm) ∗Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 14±1.5, W2 : 18.4mm max Slider Shutter Connection Area 110 (Unit : mm) Code Reel 7-inch Reel (CODE : T, H) 13-inch Reel (CODE : L, N) Code Reel 7-inch Reel (CODE : T, H) 13-inch Reel (CODE : L, N) ABCD 178±2.0 φ60min 13±0.5 21 ±0.8 330±2.0 φ100±1.0 EW 1 W 2 R 10.0±1.5 9.5±1.0 (Unit : mm) Type ABF F=2mm(03, 05, 105 Type) F=4mm(105, D11, D12, F12, F13, 21, 316, 32, 42, 52 Type) F=8mm(43, 53, 55 Type) Feed Hole Punched rectangular hole to hold capacitorJ F H 03 Type: 0.5MAX 05 Type: 0.75MAX (Paper) (Paper)(Plastic) 0.6MAX φ1.0+0.2 0.6MAX φ1.0+0.2 1.1MAX F H G GHF F A B A B 2.8MAX (Plastic) 2.8MAX A B C E D C E D C E D Feed Hole Punched rectangular hole to hold capacitor Holes only for plastic carrier tape. J Feed Hole Punched rectangular hole to hold capacitorJ CF Carrier Tape DEGHJ 8.0 3.5 8mm Paper 8mm Plastic 12mm Plastic 12.0 ±0.3 5.5 ±0.05 2.0 ±0.05 4.0 ±0.1 8.0 ±0.1 Multilayer Ceramic Chip Capacitors Packaging Options
  1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20ºC. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. Storage 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H 2) gas while sealed or if coated with silicon, which generates hydrogen gas. Multilayer Ceramic Chip Capacitors Precautions

Dimensions for recommended typical land Typical mounting problems Ideal Solder Thickness DN/DR Automotive Series (Unit : mm) When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) In the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist Land Pattern Sample capacitor Soldering resist ba c Size L ×W abc /;/; /;/; Chip Capacitor PCB Solder T/3 to T/2 T Item Not recommended example Recommended example/Separated by solder resist Multiple parts mount Mount with leaded parts Wire soldering after mounting Overview Solder resist Leaded parts Leaded parts Solder resist Soldering iron Wire Solder resist Solder resist Solder resist ∗ CA series : Please refer Page 19. Size L ×W abc (Unit : mm) Standard Multilayer Ceramic Chip Capacitors Surface Mounting Information

Recommended chip position on PCB to minimize stress from PCB warpage The chip could crack if the PCB warps during processing after the chip has been soldered. Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. 4) When the positioning hook begins to wear, unstable mechanical shock may be applied to the chip capacitor, resulting in cracking. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. (Not recommended) (Ideal) Crack Support pin Multilayer Ceramic Chip Capacitors Surface Mounting Information

1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 130 degree Celsius. capacitor arrays can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) Please see our recommended soldering conditions. Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free. Sodering iron 1) Temperature of iron chip 350°C max 2) Wattage 30W max 3) Tip shape of soldering ironφ3.0mm max 4) Soldering Time 3sec. max 5) Cautions a) Pre-heating is necessary Rapid heating must be avoided. Delta T≤130˚C. b) Avoid direct touching to capacitors. c) Avoid rapid cooling after soldering. Natural cooling is recommended. Recommendable Temperature Profile(62Sn Solder) Reflow Wave 300 250 200 150 100 60 to 120sec. 3sec. max Cool at normal room temperature 300 250 200 150 100 Preheat 60seconds TemperatureTemperature Peak temperature 230°C ±5°C 15seconds maximum 60seconds More than180°C, 40seconds maximum Cool at normal room temperature after removing from furnace. Preheat 230°C to 260°C q Ensure that the chip capacitor is preheated adequately. w Ensure that the temperature difference (∆T) does not exceed 150°C. e Cool naturally after soldering. r Stop wave in more than CM32. Recommendable Temperature Profile(Sn-3Ag-0.5Cu) Reflow Wave 300 250 200 150 100 Preheat Temperature 250°C ±5°C 5 to 10sec. Max. 90±30sec. 220°C Max. 170 to 180°C1 to 3°C/sec. q Ensure that the chip capacitor is preheated adequately. w Ensure that the temperature difference (∆T) does not exceed 150°C. e Cool naturally after soldering. q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 130˚C. q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 130˚C. Preheat /;/;/;/;/;/;/; /;/;/;/;/;/;/; /;/;/;/;/;/;/; /;/;/;/;/;/;/; 300 250 200 150 100 Temperature 90±30sec. 245 to 260˚C Multilayer Ceramic Chip Capacitors Surface Mounting Information