CLS4D11

NCP1511 ONSEMI | Alldatasheet

Document overview

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• PDF pages: 16

Technical content

Features

• High Efficiency: 93% for 1.89 V Output at 3.6 V Input and 150 mA Load Current 92% for 1.89 V Output at 3.6 V Input and 300 mA Load Current
• Digital Programmable Output V oltages: 1.0, 1.3, 1.5 or 1.89 V
• Output Current up to 500 mA at Vin = 3.6 V
• Low Quiescent Current of 14 A in Pulsed Switching Mode
• Low 0.1 A Shutdown Current
• −30°C to 85°C Operation Temperature
• Ceramic Input/Output Capacitor
• 9 Pin Chip Scale Package
• Pb−Free Package is Available

Applications

• Cellular Phones, Smart Phones and PDAs
• Digital Still Cameras
• MP3 Players and Portable Audio Systems
• Wireless and DSL Modems
• Portable Equipment DAL AYWW http://onsemi.com Device Package Shipping †

ORDERING INFORMATION

NCP1511FCT1 3000 T ape & Reel

9 PIN

XX = Device Code A = Assembly Location Y = Year WW = Work Week Pin: A1. − GNDP A2. − LX A3. − VCC B1. − SYNC B2. − GNDA B3. − FB C1. − SHD C2. − CB1 C3. − CB0 (Bottom View) PIN CONNECTIONS NCP1511FCT1G 3000 Tape & ReelMicro Bump (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Figure 1. Typical Application Circuit Figure 2. Efficiency vs. Output Current

Figure 3. Simplified Block Diagram A1 GNDP Power Ground Ground Connection for the NFET Power Stage. A2 LX Analog Output Connection from Power Pass Elements to the Inductor. A3 VCC Analog Input Power Supply Input for Power and Analog VCC . uses the rising edge for the turn on. If this pin is low, the converter is in the Pulsed mode. contains an internal pull down resistor. B3 FB Analog Input Feedback Voltage from the Output of the Power Supply. C2 CB1 Analog Input Selects Vout. This pin contains an internal pull up resistor. C3 CB0 Analog Input Selects Vout. This pin contains an internal pull down resistor.

http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Maximum Voltage All Pins Vmax 5.5 V Maximum Operating Voltage All Pins Vmax 5.2 V Thermal Resistance, Junction−to−Air (Note 1) R JA 159 °C/W Operating Ambient Temperature Range TA −30 to 85 °C ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 2) VESD > 2500 > 150 V Moisture Sensitivity MSL Level 1 Storage Temperature Range Tstg −55 to 150 °C Junction Operating Temperature TJ −30 to 125 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. For the 9−Pin Micro Bump package, the RJA is highly dependent of the PCB heatsink area. RJA = 159°C/W with 50 mm2 PCB heatsink area. 2. This device series contains ESD protection and exceeds the following tests: Human Body Model, 100 pF discharge through a 1.5 k following specification JESD22/A114. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. Latchup as per JESD78 Class II: > 100 mA.

http://onsemi.com ELECTRICAL CHARACTERISTICS (Vin = 3.6 V, Vo = 1.5 V, TA = 25°C, Fsyn = 600 kHz 50% Duty Cycle square wave for PWM mode; TA = –30 to 85°C for Min/Max values, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VCC Pin Quiescent Current of Sync Mode, Iout = 0 mA Iq PWM − 175 − A Quiescent Current of PWM Mode, Iout = 0 mA Iq PWM − 185 − A Quiescent Current of Pulsed Mode, Iout = 0 mA Iq Pulsed − 14 − A Quiescent Current, SHD Low Iq Off − 0.1 0.5 A Input Voltage Range (Note 3) Vin 2.5 − 5.2 V Sync Pin Input Voltage Vsync −0.3 − Vcc + 0.3 V Frequency Operational Range Fsync 500 600 1000 kHz Minimum Synchronization Pulse Width Dcsync Min − 30 − % Maximum Synchronization Pulse Width Dcsync Max − 70 − % SYNC “H” Voltage Threshold Vsynch − 920 1200 mV SYNC “L” Voltage Threshold Vsyncl 400 830 − mV SYNC “H” Input Current, Vsync = 3.6 V Isynch − 2.2 − A SYNC “L” Input Current, Vsync = 0 V Isyncl −0.5 − − A Output Level Selection Pins Input Voltage Vcb −0.3 − Vcc + 0.3 V CB0, CB1 “H” Voltage Threshold Vcb h − 920 1200 mV CB0, CB1 “L” Voltage Threshold Vcb l 400 830 − mV CB0 “H” Input Current, CB = 3.6 V Icb0 h − 2.2 − A CB0 “L” Input Current, CB = 0 V Icb0 l −0.5 − − A CB1 “H” Input Current, CB = 3.6 V Icb1 h − 0.3 1.0 A CB1 “L” Input Current, CB = 0 V Icb1 l − −2.2 − A Shutdown Pin Input Voltage Vshd −0.3 − Vcc + 0.3 V SHD “H” Voltage Threshold Vshd h − 920 1200 mV SHD “L” Voltage Threshold Vshd l 400 830 − mV SHD “H” Input Current, SHD = 3.6 V Ishd h − 2.2 − A SHD “L” Input Current, SHD = 0 V Ishd l −0.5 − − A Feedback Pin Input Voltage Vfb −0.3 − Vcc + 0.3 V Input Current, Vfb = 1.5 V Ifb − 5.0 7.5 A Sync PWM Mode Characteristics Switching P−FET Current Limit I lim − 800 − mA Minimum On Time Ton min − 75 − nsec Rdson Switching P−FET and N_FET Rdson − 0.23 − Switching P−FET and N−FET Leakage Current Ileak − 0 1.0 A Output Overvoltage Threshold Vo − 5.0 − % 3. Recommended maximum input voltage is 5 V when the device frequency is synchronized with an external clock signal.

http://onsemi.com ELECTRICAL CHARACTERISTICS (continued) (Vin = 3.6 V, Vo = 1.5 V, TA = 25°C, Fsyn = 600 kHz 50% Duty Cycle square wave for PWM mode; TA = –30 to 85°C for Min/Max values, unless otherwise noted. Characteristic Symbol Min Typ Max Unit Sync PWM Mode Characteristics (continued) Feedback Voltage Accuracy, Vout Set = 1.0 V CB0 = L, CB1 = L Vout 0.950 1.000 1.050 V Feedback Voltage Accuracy, Vout Set = 1.3 V CB0 = L, CB1 = H Vout 1.261 1.300 1.339 V Feedback Voltage Accuracy, Vout Set = 1.5 V CB0 = H, CB1 = H Vout 1.450 1.500 1.550 V Feedback Voltage Accuracy, Vout Set = 1.89 V CB0 = H CB1 = L Vout 1.833 1.890 1.947 V Load Transient Response 10 to 100 mA Load Step Vout − 35 − mV Line Transient Response, Iout = 100 mA 3.0 to 3.6 Vin Line Step Vout − 10 − mVpp PWM Mode with Internal Oscillator Characteristics Switching P−FET Current Limit I lim − 800 − mA Minimum On Time Ton min − 75 − nsec Internal Oscillator Frequency Fosc 700 900 1200 kHz Rdson Switching P−FET and N_FET Rdson − 0.23 − Switching P−FET and N−FET Leakage Current Ileak − 0 1.0 A Output Overvoltage Threshold Vo − 5.0 − % Feedback Voltage Accuracy, Vout Set = 1.0 V CB0 = L, CB1 = L Vout 0.950 1.000 1.050 V Feedback Voltage Accuracy, Vout Set = 1.3 V CB0 = L, CB1 = H Vout 1.261 1.300 1.339 V Feedback Voltage Accuracy, Vout Set = 1.5 V CB0 = H, CB1 = H Vout 1.450 1.500 1.550 V Feedback Voltage Accuracy, Vout Set = 1.89 V CB0 = H CB1 = L Vout 1.833 1.890 1.947 V Load Transient Response 10 to 100 mA Load Step Vout − 35 − mV Line Transient Response, Iout = 100 mA 3.0 to 3.6 Vin Line Step Vout − 10 − mVpp Pulsed Mode Characteristics On Time Ton − 660 − nsec Output Ripple Voltage, Iout = 100 A Vout − 22 − mV Feedback Voltage Accuracy, Vout Set = 1.0 V CB0 = L, CB1 = L Vout 0.930 1.000 1.070 V Feedback Voltage Accuracy, Vout Set = 1.3 V CB0 = L, CB1 = H Vout 1.241 1.300 1.359 V Feedback Voltage Accuracy, Vout Set = 1.5 V CB0 = H, CB1 = H Vout 1.430 1.500 1.570 V Feedback Voltage Accuracy, Vout Set = 1.89 V CB0 = H CB1 = L Vout 1.813 1.890 1.967 V

Figure 4. Efficiency vs. Output Current in PWM Figure 5. Efficiency vs. Input Voltage in PWM Figure 6. Efficiency vs. Output Current at

1.0 Vout

1.3 Vout

1.5 Vout

1.89 Vout

Figure 7. Efficiency vs. Frequency at Figure 8. Efficiency vs. Frequency at Figure 9. Efficiency vs. Output Current in

5.2 Vin

3.6 Vin

2.7 Vin

Figure 10. Input Current Comparison Figure 11. Output Voltage vs. Output Current Figure 12. Load Regulation in PWM Mode Figure 13. Output Voltage vs. Temperature Figure 14. Oscillator Frequency vs. Temperature Figure 15. Oscillator Frequency vs. Input

Figure 16. Output Voltage vs. Shutdown Pin Figure 17. Transition Level of CB Pins Figure 18. Light Load PWM Switching Waveform Figure 19. Heavy Load PWM Switching Waveform Figure 20. Pulsed Mode Switching Waveform Figure 21. Soft−Start

1 V/div

0.5 V/div

Figure 22. Line Transient Response for PWM Figure 23. Line Transient Response for PM Figure 24. Load Transient Response Figure 25. Output Voltage Transition from Figure 26. Transition between PWM and PM

2 V/div

http://onsemi.com DETAILED OPERATING DESCRIPTION Overview The NCP1511 is a monolithic micro−power high frequency PWM step−down DC−DC converter specifically optimized for applications requiring high efficiency and a small PCB footprint such as portable battery powered products. It integrates synchronous rectification to improve efficiency as well as eliminate the external Schottky diode. High switching frequency allows for a low profile inductor and capacitors to be used. Four digital selectable output voltages (1.0, 1.3, 1.5 and 1.89 V) can be generated from the input supply that can range from 2.7−5.2 V . All loop compensation is integrated as well further reducing the external component count as well. The DC−DC converter has two operating modes (normal PWM, pulsed switching), which are intended to allow for optimum efficiency under either light (up to 30 mA) or heavy loads. The user determines the operating mode by controlling the SYNC input. In addition the SYNC input can be used to synchronize the PWM to an external system clock signal in the range of 500−1000 kHz. PWM Operating Mode The NCP1511 can be set to current mode PWM operation by connecting SYNC pin to VCC . In this mode, the output voltage is regulated by modulating the on−time pulse width of the main switch Q1 at a fixed frequency of 1.0 MHz. The switching of the PMOS Q1 is controlled by a flip−flop driven by the internal oscillator and a comparator that compares the error signal from an error amplifier with the sum of the sensed current signal and compensation ramp. At the beginning of each cycle, the main switch Q1 is turned ON by the rising edge of the internal oscillator clock. The inductor current ramps up until the sum of the current sense signal and compensation ramp becomes higher than the error voltage amplifier. Once this has occurred, the PWM comparator resets the flip−flop, Q1 is turned OFF and the synchronous switch Q2 is turned ON. Q2 replaces the external Schottky diode to reduce the conduction loss and improve the efficiency. To avoid overall power loss, a certain amount of dead time is introduced to ensure Q1 is completely turned OFF before Q2 is being turned ON. In continuous conduction mode (CCM), Q1 is turned ON after Q2 is completely turned OFF to start a new clock cycle. In discontinuous conduction mode (DCM), the zero crossing comparator (ZLC) will turn off Q2 when the inductor current drops to zero. Overvoltage Protection The overvoltage protection circuit is present in PWM mode to prevent the output voltage from going too high under light load or fast load transient conditions. The output overvoltage threshold is 5% above nominal set value. If the output voltage rises above 5% of the nominal value, the OVP comparator is activated and switch Q1 is turned OFF. Switching will continue when the output voltage falls below the threshold of OVP comparator. Pulsed Mode (PM) Under light load conditions (< 30 mA), the NCP1511 can be configured to enter a low current pulsed mode operation to reduce power consumption. This is accomplished by applying a logic LOW to the SYNC pin. The output regulation is implemented by pulse frequency modulation. If the output voltage drops below the threshold of PM comparator (typically Vnom−2%), a new cycle will be initiated by the PM comparator to turn on the switch Q1. Q1 remains ON until the peak inductor current reaches 200 mA (nom). Then ILIM comparator goes high to switch off Q1. After a short dead time delay, switch rectifier Q2 is turn ON. The zero crossing comparator will detect when the inductor current drops to zero and send the signal to turn off Q2. The output voltage continues to decrease through discharging the output capacitor. When the output voltage falls below the threshold of the PM comparator again, a new cycle starts immediately. Cycle−by−Cycle Current Limit From the block diagram, an ILIM comparator is used to realize cycle−by−cycle current limit protection. The comparator compares the LX pin voltage with the reference voltage from the SENFET, which is biased by a constant current. If the inductor current reaches the limit, the ILIM comparator detects the LX voltage falling below the reference voltage from the SENFET and releases the signal to turn off the switch Q1. The cycle−by−cycle current limit is set at 800 mA (nom) in PWM and 200 mA in PM. Frequency Synchronization and Operating Mode Selection The SYNC pin can also be used for frequency synchronization by connecting it with an external clock signal. It operates in PWM mode when synchronized to an external clock. The switching cycle initiates by the rising edge of the clock. The 500 kHz to 1000 kHz synchronization clock signal should be between 0.4 V and 1.2 V . Gating on and off the clock, the SYNC pin can also be used to select between PM and PWM modes. It allows efficient dynamical power management by adjusting the converter operation to the specific system requirement. Set SYNC pin low to select PM mode at light load conditions (up to 30 mA) and set SYNC pin high or connect with external clock to select PWM mode at heavy load condition to achieve optimum efficiency. Table 1 shows the mode selection with three different SYNC pin states.

Table 1. Operating Mode Selection operating life of the handset battery between charges. has a pull down resistor and the CB1 has a pullup resistor. Table 2. Truth Table for CB0 and CB1 with the when the device is initially powered up or enabled. reference voltage until it reaches the full reference voltage. consumption will be 0.1 A (typical value). soft−start to normal operation.

http://onsemi.com APPLICATIONS INFORMATION Component Selection Input Capacitor Selection In PWM operating mode, the input current is pulsating with large switching noise. Using an input bypass capacitor reduces the peak current transients drawn from the input supply source, thereby reducing switching noise significantly. The capacitance needed for the input bypass capacitor depends on the source impedance of the input supply. The RMS capacitor current is calculated as: IRMS IO D D /C0512/C0504 (eq. 1) where: D = duty cycle, which equals Vout/Vin, and D’ = 1 − D. The maximum RMS current occurs at 50% duty cycle with maximum output current, which is IO,max /2. A low profile ceramic capacitor of 10 F should be used for most of the cases. For effective bypass results, the input capacitor should be placed as close as possible to the VCC pin. Inductor Value Selection Selecting the proper inductor value is based on the desired ripple current. The relationship between the inductance and the inductor ripple current is given by the equation below. iL Vout Lfs

1 Vout

(eq. 2) The DC current of the inductor should be at least equal to the maximum load current plus half the ripple current to prevent core saturation. For NCP1511, the compensation is internally fixed and a fixed 6.8 H inductor is needed for most of the applications. For better efficiency, choose a low DC resistance inductor. Output Capacitor Selection Selecting the proper output capacitor is based on the desired output ripple voltage. Ceramic capacitors with low ESR values will have the lowest output ripple voltage and are strongly recommended. The output ripple voltage is given by: Vc iL ESR 1 4fsC out (eq. 3) The RMS output capacitor current is given by: IRMS (C out) VO (1 D ) 23/C0504 L fs (eq. 4) Where fs is the switching frequency and ESR is the effective series resistance of the output capacitor. A low ESR, 22 F ceramic capacitor is recommended for NCP1511 in most of applications. For example, with TDK C2012X5R0J226 output capacitor, the output ripple is less than 10 mV at 300 mA. Design Example As a design example, assume that the NCP1511 is used in a single lithium−ion battery application. The input voltage, Vin, is 3.0 V to 4.2 V . Output condition is Vout at

1.5 V with a typical load current of 120 mA and a maximum

of 300 mA. For NCP1511, the inductor has a predetermined value, 6.8 H. The inductor ESR will factor into the overall efficiency of the converter. The inductor needs to be selected by the required peak current. Equation 5 is the basic equation for an inductor and describes the voltage across the inductor. The inductance value determines the slope of the current of the inductor. VL L diL dt (eq. 5) Equation 5 is rearranged to solve for the change in current for the on−time of the converter in Continuous Conduction Mode. (eq. 6) iL, pk−pk (Vin Vout) L DT s (Vin Vout) L Vin Vout fs iL, max IO, max iL, pk−pk Utilizing Equations 6, the peak−to−peak inductor current is calculated using the following worst−case conditions. Vin, max 4.2 V, Vout 1.5 V, fs 1 MHz−20%, L 6.8H−10%, iL, pk−pk 197 mA, iL, max 399 mA Therefore, the inductor must have a maximum current exceeding 405 mA. Since the compensation is fixed internally in the IC, the input and output capacitors as well as the inductor have a predetermined value too: C in = 10 F and Cout = 22 F. Low ESR capacitors are needed for best performance. Therefore, ceramic capacitors are recommended.

Figure 29. Bottom Layer Table 3. Bill of Materials *Output current calculated from VCC = 4.2 Vmax , 1.5 Vout and Freq = 700 kHz (1.0 MHz − 20 %).

http://onsemi.com PACKAGE DIMENSIONS

9 PIN MICRO BUMP

CASE 499AC−01 ISSUE B DIM MIN MAX MILLIMETERS A 0.540 0.660 A1 0.210 0.270 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E D −A− −B−0.10 C A −C− 0.05 C 0.10 C 4 X SEATING PLANE e e 0.05 C 0.03 C A B

9 X b

C B A 123 D 1.550 BSC E 0.330 0.390 b 0.290 0.340 e 0.500 BSC D1 1.000 BSC E1 1.000 BSC

1.550 BSC

inchesSCALE 20:1 0.265 0.01 0.50 0.0197 0.50 0.0197 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*

http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 NCP1511/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone : 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.