CLP SAMTEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 1

Technical content

CLP - 1 NO. PINS PER ROW - 02 - PLATING OPTION - ROW OPTION - OTHER OPTIONS 02 thru 50 –F = Gold flash on contact, Matte Tin on tail = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = 10 µ" (0.25 µm) Gold (–D only) = Double Row –DH = Double Horizontal (Requires FTSH–04 lead style) –BE = Bottom Entry (Required for bottom entry applications) = Alignment Pin (Not available with –PA option) 20, 25, 30, 40 positions only) (–DH option and other sizes. Contact Samtec.) Polyimide film Pick & Place Pad (3 positions minimum) = Pick & Place Pad (5 positions min. –D only) (Not always necessary for auto placement. See Flex Processing.) –PA = Pick & Place Pad with Alignment Pin (–D only) (Not available with –A option) –TR = Tape & Reel –FR = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) SPECIFICATIONS CLP Mates: FTSH, FTS, FW Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Sn or Au over 50 µ" (1.27 µm) Ni Current Rating (CLP/FTSH):

3.4 A per pin

(2 pins powered) Voltage Rating:

280 VAC/395 VDC

Operating Temp Range: -55 °C to +125 °C Insertion Depth: Top Entry = (1.40 mm) .055" minimum Bottom Entry = (2.41 mm) .095" minimum plus board thickness DH Entry = Normal Force: 60 grams (0.59 N) average Max Cycles: 100 with 10 µ" (0.25 µm) Au PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: *(.004" stencil solution may be available; contact ipg@samtec.com) Note: Some lengths, styles and options are non-standard, non-returnable. EXTENDED LIFE PRODUC T

10 YEAR MFG

WITH 30 µ" GOLD HIGH MATING CYCLES If odd pins/row, alignment pins are on middle position on centerline of the part. If even pins/row, then alignment pins are between middle two positions. —P OPTION—PA OPTION Single row Other platings ALSO AVAILABLE MOQ Required PIN/ROW A 04-15 (3.56) .140 LOW-PROFILE DUAL WIPE SOCKET (1.27 mm) .050" PITCH • CLP SERIES Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. Gbps (3.43) .135 A (4.57) .180 (4.32) .170 (2.29) .090 —DH —D samtec.com?CLP F-221 (Rev 28JUN21)