CLA VISHAY | Alldatasheet
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CLA, CLB www.vishay.com Vishay Electro-Films Revision: 30-May-2022 1 Document Number: 61009 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Wire Bondable Thin Film Resistor Arrays Product may not be to scale The CLA and CLB resistor arra ys are the hybrid equivalent to the eight resistor common connection and isolated networks available in sips or dips. The resistors are spaced on 0.010" centers resulting in minimal space requirements. These chips are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The CLA and CLBs are 100 % electrically tested and visually inspected to MIL-STD-883.
FEATURES
- Wire bondable
- Up to 12 equal value resistors
- For case see Part Dimensions table
- Resistance range: 20 Ω to 1 MΩ
- Excellent TCR tracking
- Resistor material: tantalum nitride, self-passivating
- Oxidized silicon substrate for good power dissipation
- Custom values and pad geometries available
- Moisture resistant
- Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
The CLA and CLB thin film resistor arrays are designed for hybrid packages requiring up to twelve resistors of the same resistance value and tolerance, as well as excellent TCR tracking. For such hybrids, they afford great savings in cost and space. TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER VALUE UNIT Total Resistance Range 20 to 1M Ω Standard Tolerances ± 0.1, ± 0.5 % TCR ± 25, ± 50, ± 100 ppm/°CSTANDARD ELECTRICAL SPECIFICATIONS PARAMETER VALUE UNIT TCR Tracking Spread ± 5 ppm/°C Noise, MIL-STD-202, Method 308 100 Ω to 250 kΩ < 100 Ω or > 251 kΩ -35 typ. -20 typ. dB Moisture Resistance, MIL-STD-202, Method 106 ± 0.5 max. ΔR/R % Stability, 1000 h, +125 °C, 25 mW Absolute Ratio ± 0.25 max. ΔR/R ± 0.05 max. ΔR/R Operating Temperature Range -55 to +125 °C Thermal Shock, MIL-STD-202 Method 107, Test Condition F ± 0.1 max. ΔR/R % High Temperature Exposure, ± 150 °C, 100 h ± 0.2 max. ΔR/R % Dielectric Voltage Breakdown 200 V Insulation Resistance 10 12 min. Ω Operating Voltage 100 V DC Power Rating at +70 °C (Derated to Zero at 175 °C) 0.050 per resistor W 5 x Rated Power Short-Time Overload, +25 °C, 5 s ± 0.1 % max. ΔR/R % Tightest Standard Tolerance Available 0.5 % 0.1 % 20 /g58 300 /g58 300 k/g58500 k/g581 M/g58 ± 25 ppm/°C ± 50 ppm/°C ± 100 ppm/°C
CLA, CLB www.vishay.com Vishay Electro-Films Revision: 30-May-2022 2 Document Number: 61009 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DIMENSIONS in inches CLA 8 Cell CLB 8 Cell 0.090 0.060 0.054 0.007 0.004 0.004 0.090 0.060 0.054 0.0775 0.004 0.004 0.007 DIMENSIONS in inches # OF RES. 03 04 06 08 12 MECHANICAL SPECIFICATIONS PARAMETER Chip Size See Dimensions table above Chip Thickness 0.010" ± 0.002" (0.254 mm ± 0.05 mm) Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2 Resistor Material Tantalum nitride, self-passivating Bonding Pads 0.004" x 0.007" (0.10 mm x 0.178 mm) Number of Top Pads CLA - 16 CLB - 9 Pad Material 10 kÅ minimum aluminum Backing None, lapped semiconductor silicon GLOBAL PART NUMBER INFORMATION Global Part Number: CLA0830000FFKANHWS Global Part Number Description: CLA 8 Res 3K 1 %, 100 ppm/°C, Al terminations, no back metal, class H WS MODEL TYPE RESISTORS RES. RES. MULTIPLIER CODE TOL. CODE RATIO TOL. TCR (ppm/°C) TERM. BACK METAL VISUAL CLASS PACKAGING CODE CL A = isolated B = bussed First 4 digits are significant figures of resistance B = 0.01 A = 0.1 0 = 1 1 = 10 2 = 100 3 = 1000 B = 0.1 % C = 0.25 % D = 0.5 % F = 1.0 % G = 2.0 % J = 5.0 % K = 10.0 % B = 0.1 % F = 1.0 % N = none E = ± 25 C = ± 50 K = ± 100 M = ± 250 G = Au A = Al G = Au N = none H = class H K = class K WS = waffle pack, 100 min., 1 mult. 0830 00 F 0ACL FK A N H W S
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