CL8800 MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

  • Minimal component count (base config: CL8800 + 6 resistors + diode bridge)
  • No magnetics, no capacitors
  • Up to 7.5W output (13W w/ heat sink)
  • >110Lm/W using efficient LEDs
  • 85% typical electrical efficiency
  • >0.95 power factor
  • <20% THD line current
  • Low conducted EMI w/o filters
  • 85% LED luminous utilization
  • Phase dimmer compatible with an RC network

Applications

  • Fluorescent tube retrofit
  • Incandescent & CFL bulb replacement
  • General LED lighting

Description

CL8800 is designed to drive a long string of inexpen- sive, low-current LEDs direct ly from the AC mains. A basic driver circuit consists of CL8800, six resistors, and a bridge rectifier. Two to four additional compo- nents are optional for various levels of transient protec- tion. No capacitors, EMI filters, or power factor correction circuits are needed. A string of series/parallel LEDs is tapped at six loca- tions. Six linear current regulators sink current at each tap and are sequentially turned on and off. Thereby tracking the input sine wave voltage. Voltage across each regulator is minimized when conducting, provid- ing high efficiency. Output current at each tap is individ- ually resistor-adjustable. Cross-regulation, as the CL8800 switches from one regulator to another, pro- vides smooth transitions. The current waveform can be tailored to optimize for input voltage range, line/load regulation, output power/current, efficiency, power fac- tor, THD, dimmer compatibility, and LED utilization. With the addition of an RC network, the driver is com- patible with phase dimming. Sequential Linear LED Driver

DS20005357A-page 2  2015 Microchip Technology Inc. Package Type Typical Application Circuit SET1 NC SET2 NC SET3 NC SET4 NC SET5 SET6 BIAS TAP1 TAP2 TAP3 TAP4 TAP5 TAP6 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND See Table 2-1 for pin information BIAS GND CL8800 SET1 SET2 SET3 SET4 SET5 SET6 AC Mains TAP1 TAP2 TAP3 TAP4 TAP5 TAP6 additional components for 230VAC 100 - 120VAC Transient Protection

 2015 Microchip Technology Inc. DS20005357A-page 3 CL8800

1.0 ELECTRICAL CHARACTERISTICS

Note: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Continuous operation of the device at the absolute rating level may affect device reli- ability. All voltages are referenced to device ground.

1.1 ELECTRICAL SPECIFICATIONS

TABLE 1-1: RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Units Conditions IOUT Output Current TAP1 60 mA TAP2 90 mA TAP3 115 mA TAP4 115 mA TAP5 115 mA TAP6 115 mA V OUT Output Voltage TAP1 400 V Non-conducting TAP2-6 300 V Non-conducting TAP1-6 varies 1 1 Voltage capability is determined by power dissipation (V * I). V Conducting VBIAS Applied BIAS voltage 440 V TABLE 1-2: ELECTRICAL CHARACTERISTICS 1 1 Over recommended operating conditions at 25°C, unless specified otherwise. Symbol Parameter Min Typ Max Units Conditions IBIAS BIAS pin input current 250 410 µA V BIAS = 340V ITAP(ON) Output current, on TAP1 60 mA V TAP1 = 30V, VSET1-6 = GND TAP2 90 mA V TAP2 = 17V, VSET1-6 = GND TAP3 115 mA V TAP3= 17V, VSET1-6 = GND TAP4 115 mA V TAP4 = 17V, VSET1-6 = GND TAP5 115 mA V TAP5 = 17V, VSET1-6 = GND TAP6 115 mA V TAP6 = 17V, VSET1-6 = GND ITAP(OFF) Output current, off 0 10 µA Tap 1-5, V BIAS = 312V VREG Regulation voltage at SET pins SET1-5 1.80 2.00 2.20 V SET6 1.89 2.10 2.31 V

DS20005357A-page 4  2015 Microchip Technology Inc. FIGURE 1-1: OUTPUT CURRENT THERMAL CHARACTERISTICS TABLE 1-3: THERMAL RESISTANCE Package θja 1 θjc 33-Lead QFN 24°C/W 2.5°C/W 1 1.0 oz Cu 4-layer board, 3x4” PCB with thermal pad and thermal via array. 2 Junction to exposed heat slug. 250 200 150 100 IOUT (mA) -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) Maximum Output Current Taps 4&5 Taps 3&6 Tap 2 Tap 1

 2015 Microchip Technology Inc. DS20005357A-page 5 CL8800

2.0 PIN DESCRIPTION

The locations of the pins are listed in Package Type. TABLE 2-1: PIN DESCRIPTION Pin # Function Description 1 - 8 GND Circuit common (use for heat sink ground plane pass through). 9S E T 1 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 10 NC No internal connection. 11 SET2 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 12 NC No internal connection. 13 SET3 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 14 NC No internal connection. 15 SET4 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 16 NC No internal connection. 17 SET5 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 18 SET6 Current sense for linear current regulators for each tap. Resistors on these pins sets the tap currents. 19 - 20 GND Circuit common (use for heat sink ground plane pass through). 21 GND Circuit common. Connect to bridge rectifier return (use for heat sink ground plane pass through). 22 - 26 GND Circuit common (use for heat sink ground plane pass through).

27 TAP6

Current regulator outputs. Connect to taps along the LED string.

28 TAP5

29 TAP4

30 TAP3

31 TAP2

32 TAP1

33 BIAS Provides bias for driver. Connect to rectified AC. Underside plate (GND) For heat sinking purposes, it should be soldered to a 4.0cm2 exposed copper area. It should also be electrically connected to circuit common (GND).

DS20005357A-page 6  2015 Microchip Technology Inc.

3.0 APPLICATION INFORMATION

3.1 Overview

Designing a driver to meet particular requirements may be a difficult task considering the 18 design variables: tap current (6), number of series-connected LEDs per segment (6), and the numbe r of parallel-connected LEDs per segment (6). Manually selecting values will provide light, but the chosen values may be far from optimal in regards to efficiency, LED utilization, and line regulation. Contact your nearest Microchip Field Applications Engineer for design assistance. In addition to configuring the driver, several circuits may be employed to increase reliability, performance, and cost. The following sections briefly describe these circuits.

3.2 Transient Protection

The driver circuits have no need for capacitors that could otherwise absorb transient energy, nor is there a need for EMI filters that would block transients. There- fore, the full burden of transie nt protection is borne by the protection circuit. The two-stage approach in the following schematics provide 2.5kV protection, both pulse and ring per EN 61000-4-5 and EN 61000-4-12, six hits each. FIGURE 3-1: 100 TO 120 VAC TRANSIENT PROTECTION FIGURE 3-2: 230VAC TRANSIENT PROTECTION

3.3 Zener Diode Substitution

Zener diodes may be substituted for LEDs in the bot- tom stages of the design. The last 1 or 2 stages of LEDs contribute little to the light output - they are mainly present to off-load the adjacent upstream regu- lator at high line voltages to minimize losses. The advantages of Zener substitution includes minimizing unlit LEDs at low line for be tter light uniformity, better line regulation at high line, fewer LEDs for lower cost and less PCB area, and fewer board-to-board connec- tions. Disadvantages include slightly-reduced effi- ciency at high line, and additional heat load on the driver board.

3.4 Phase Dimming

As with any light load, the LED lamp might not draw enough current to ensure proper dimmer operation. This is especially true for 230VAC dimmers. Triodes for Alternating Current (TRIAC) used in dimmers require a minimum latching current when triggered to place the TRIAC in the latched-on stat e. Once latched, a mini- mum holding current is required to maintain the TRIAC in the on state. Latching current is many times greater than the holding current, and is the main concern with dimmer compatibility. Higher latching current can be provided by a simple series RC network across the AC line. A short time con- stant provides a current spike at the turn-on edge. Less common is inadequate holding current. The mini- mum dimmer holding current is typically 10-20mA. Tap1 at 60mA (max) exceeds the minimum. FIGURE 3-3: PHASE DIMMING

3.5 Strobing

Twice per AC line cycle the line voltage crosses zero volts, during which time there is no light output. The circuit in Figure 3-4 can provide 5-10% valley fill. It has little effect on input current wave shape (THD, PF) and efficiency. This circuit is intended to prevent the output from reaching zero. It will not significantly reduce output rip- ple. 22Ω 150VAC 10mm AC Line 22Ω 33Ω 275VAC 10mm 440VDC 1.5kW AC Line Bridge RectifierAC Line Transient Protection 500Ω 100 - 200nF

 2015 Microchip Technology Inc. DS20005357A-page 7 CL8800

3.6 Power Boost

Higher output power can be achieved by off-loading a portion of the power dissipation from the CL8800 to external Field-Effect Transistors (FET). The circuit below drops most of the tap voltage across the FETs, thereby shifting the bulk of the dissipation to the FET. FIGURE 3-4: POWER BOOST FIGURE 3-5: VALLEY FILL CIRCUIT TAP6 TAP7 to LEDs to LEDs 200kΩ 15V BIAS CL8800 SET1 SET2 SET3 SET4 SET5 SET6 GND TAP1 TAP2 TAP3 TAP4 TAP5 TAP6 CF1 QF2 DN3135RF3 RF2 150kΩ RF1 10kΩ QF1 Optional flicker reduction circuit (valley fill) RS1 RS2 RS3 RS4 RS6 RS5

DS20005357A-page 8  2015 Microchip Technology Inc. FIGURE 3-6: SIMPLIFIED BLOCK DIAGRAM BIAS GND CL8800 SET1 SET2 SET3 SET4 SET5 SET6 TAP1 TAP2 TAP3 TAP4 TAP5 TAP6 in reg 1 0 in reg 1 0 in reg 1 0 in reg 1 0 in reg 1 0 1 0 22Ω 33Ω 275VAC 10mm 440VDC 1.5kW RSET1 RSET2 RSET3 RSET4 RSET5 RSET6 AC Mains additional components for 230VAC 100 - 120VAC Transient Protection

 2015 Microchip Technology Inc. DS20005357A-page 9 CL8800

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

Legend: XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part numbe r cannot be marked on one line, it will be carried over to the next line, t hus limiting the number of available characters for product code or customer-specific information. Package may or may not include the corporate logo. 33-lead QFN Example YYWWNNNYYWWNNN XXXXXXXXXXXXXXXX XXXXXXXXXXXXXX e3XXXXXXXXXXXX K63K63 CL8800CL8800 14493431449343

DS20005357A-page 10  2015 Microchip Technology Inc. Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

 2015 Microchip Technology Inc. DS20005357A-page 11 CL8800 APPENDIX A: REVISION HISTORY Revision A (January 2015)

  • Update file to new format

DS20005357A-page 12  2015 Microchip Technology Inc. PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: CL8800 = Sequential Linear LED Driver Package: K6(3) = QFN (6x6 mm body), 33-lead Environmental G = Lead (Pb)-free/ROHS-compliant package Media Type: (blank) = 490/Tray M935 = 3000/Reel Examples: a) CL8800K63-G: 33-lead QFN package, 490/Tray. b) CL8800K63-G-M935 33-lead QFN package, 3000/Reel PART NO. X Device X Environmental XX Package Options Media - - Type

 2015 Microchip Technology Inc. DS20005357A-page 13 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-63276-957-2 Note the following details of the code protection feature on Microchip devices:

  • Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
  • Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
  • There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
  • Microchip is willing to work with the customer who is concerned about the integrity of their code.
  • Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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