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Document overview
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- PDF pages: 13
Technical content
Features
- 5.0 to 220V operating range (VA-B)
- 20mA ±10% at 5.0 - 160V
- 0.01% / °C typical te mperature coefficient
- Packages Types: - TO-252 (D-PAK) -T O - 2 2 0
- Can be paralleled for higher current
Applications
- Industrial lamp indicators
- Signage
- Accent lighting
- Constant current source
- Constant current sink
Description
CL220 is a high voltage, temperature-compensated, 20mA constant current regulator. The device operates at up to 220V, and is accurate to ±10% over a 5 - 160V range. The device can be used as a two-terminal, con- stant-current source or a constant-current sink. A typical application for CL220 is to drive LEDs with a constant current of 20mA. Multiple CL220s can also be used in parallel to provide higher currents such as 40mA, 60mA, 80mA, and so on. The device is available in the TO-252 (D-PAK) and TO-220 packages. Simple, 220V , 20mA, Temperature-Compensated, Constant-Current, LED Driver IC
DS20005413A-page 2 2015 Microchip Technology Inc. Package Type Typical Application Circuit Functional Circuit Diagram Equivalent Block Diagram TO-252 (D-PAK) See Table 2-1 for pin information VA NC VB VA NC VB VB TO-220 VA VB Up to 220V + VLED(TOTAL) VA VB Functional Circuit Diagram CL220 ILED 20mA Control Circuit and Temperature Compensation 10nF VLED(TOTAL) VA VB Control Circuit and Temperature Compensation 20mA VA VB
2015 Microchip Technology Inc. DS20005413A-page 3 CL220
1.0 ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS† Note 1: Obtained by Characterization; Not 100% tested in production. Note 1: Obtained by Characterization; Not 100% tested in production.
2.0 PIN DESCRIPTION
The locations of the pins are shown in Package Type and Packaging Information. † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, for all specifications TJ = +25°C Symbol Parameter Min Typ Max Units Conditions VA-B Operating voltage 5.0 - 220 V ∆IA-B/∆TI A-B temperature coefficient - 0.01 - %/°C VA-B= 45V, Tj= -40°C to +100°C (Note 1) RA-B Dynamic resistance - 300 - k Ω IAB Output current 18 20 22 mA VAB= 4.0 - 160V 18 - 25 V AB= 160 - 220V (Fig. 4) -- 2 2 V AB= 0 - 4.0V IOS Turn-on overshoot current - 25 - mA V T= 45V (Fig. 5) (Note 1) tOS Overshoot duration - 1 - µs V T= 45V (Fig. 5) (Note 1) tDLY Turn-on delay - 10 - µs V T= 45V (Fig. 5) (Note 1) tRISE Turn-on rise time - 200 - ns V T= 45V (Fig. 5) (Note 1) TABLE 1-2: THERMAL RESISTANCE, JUNCTION TO AMBIENT Package θja Units Conditions Min Typ Max TO-252 (D-PAK) – 81 – °C/W Soldered to 2.0 cm2 copper area exposed to free air (Note 1)TO-220 – 29 – °C/W TABLE 2-1: PIN DESCRIPTION Pin # TO-252 Pin # TO-220 Function Description 1 1 VA Current flows into this pin 4 2, 4 VB Current flows out of this pin 3 3 NC No connection
DS20005413A-page 4 2015 Microchip Technology Inc.
3.0 APPLICATION INFORMATION
Figures 3-1- 3-6 show the characteristics and timing for CL220. FIGURE 3-1: Temperature Characteristics FIGURE 3-2: Output Characteristics 1.02 1.01 1.00 0.99 0.98-55 -35 -15 5 25 45 65 85 105 125 145 Junction Temperature (°C) Current, normalized to 25°C 45V 90V 0 5 10 15 20 60 100 140 180 220 IA-B (mA) VA-B (V) scale change
DS20005413A-page 6 2015 Microchip Technology Inc. FIGURE 3-6: CL220 for Higher Current
3.1 Functional Circuit and Block
FIGURE 3-7: Functional Circuit Diagram FIGURE 3-8: Block Diagram (Equivalent Functional Circuit) VB VA Up to 220V +VLED(TOTAL) VB VA ILED 60mA VB VA 10nF VLED(TOTAL) CL220 CL220 CL220 VA VB Control Circuit and Temperature Compensation 20mA VA VB
2015 Microchip Technology Inc. DS20005413A-page 7 CL220
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. TO-252 (D-PAK) Example YYWWNNN XXXXX XXXX 1522343 220K4 CL 3-lead TO-220 Example YYWWNNN XXXXXXX XXXXXXXXX e3 1522343 CL220N5
DS20005413A-page 8 2015 Microchip Technology Inc. Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2015 Microchip Technology Inc. DS20005413A-page 9 CL220 3-Lead TO-220 Package Outline (N5) Symbol A A1 A2 b b2 c D D1 D2 E E1 E2 e H1 L L1 Q ĭP Dimen- sion (inches) .100 BSC JEDEC Registration TO-220, Variation AB, Issue K, April 2002. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ 7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ Drawings not to scale. L Ae View B 12 3 D Q E ΦP Seating Plane A A Chamfer Optional E Thermal Pad Front View Side View View A - A bb2 1 2 3 View B c
DS20005413A-page 10 2015 Microchip Technology Inc. APPENDIX A: REVISION HISTORY Revision A (July 2015)
- Update file to new format
2015 Microchip Technology Inc. DS20005413A-page 11 CL220 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: CL220 = Simple, 220V, 20 mA, temperature-compen- sated, constant-current LED driver IC Package: K4 = TO-252 (D-PAK) N5 = TO-220 Environmental G = Lead (Pb)-free/ROHS-compliant package Media Type: (blank) = 2000/Reel for TO-252 = 50/Tube for TO-220 Examples: a) CL220K4-G TO-252 package, 2000/reel b) CL220N5-G TO-220 package, 50/Tube PART NO. X Device X Environmental XX Package Options Media - - Type
DS20005413A-page 12 2015 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC 32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP , Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-590-0 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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