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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • High current multi-phase inductor
  • 50nH per phase coupled inductor
  • Ferrite core material
  • Patents pending
  • Halogen free, lead free and RoHS compliant

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant CL0904 Multi-Phase power inductors Pb HALOGEN HFFREE
  • For exclusive use with Maxim® Multi-phase controllers Environmental data Maxim® is a registered trademark of Maxim Integrated Devices, Inc. SMD Device

Multi-Phase power inductors www.eaton.com/electronics Dimensions- mm 1. Open Circuit Inductance (OCL) 2. Test Parameters: 1MHz, 0.1Vrms, 0.0Adc. 3. The rated current, Imax peak current, and rated inductance per phase is determined by Volterra’s testing and circuit design. Additional information can be provided by contacting Volterra. 4. Part Number Definition: CL0904-x-50TR-R - CL0904= Product code and size - “x” = number of phases - ”50” = inductance value per phase nH - “TR” = Tape and Reel packaging - “-R” suffix = RoHS compliant A This device is licensed for use only when incorporated within a voltage regulator employing power regulating devices manufactured by Maxim Integrated Devices. No license is granted expressly or by implication to use this device with power regulating devices manufactured by any company other than Maxim. Specifications Functional Test Rated I Magnetized DCR (mΩ) Inductance Rated I max Inductance Inductor ±10% per Phase per Phase Peak per Pin OCL Pin OCL (nH) @ Part Number4 Phases @20°C (nH) (Adc) 3 Phase (Adc)3 Number (nH) 1, 2 Number (nH) 1, 2 5Adc (25°C) CL0904-2-50TR-R 2 0.35 50 ± 20% 35 80 (1-2) 320±20% (3-4) 320±20% 245 DCR measured from point ‘a’ to point “b” Part Marking: CL0904= Product Code and Size -x ( -2, -3)= Number of phases -50= inductance value per phase TR= Tape and Reel wwllyy= Date Code R=Revision Level Soldering surfaces to be coplanar within 0.13 millimeters. CL0904-3 CL0904-2 Recommended Pad Layout Schematic 3.2 3.3 2.7 6.0 7.3 3.2 3.3 7.3 2.7 6.0 Pad layout and schematics- mm

3www.eaton.com/electronics Technical Data 4379 Effective June 2017 CL0904 Multi-Phase power inductors Packaging information- mm CL0904-3-50TR-R SECTION A-A User Direction of feed 20.25 1.751.5 dia2.0 dia 9.6 4.0 44.0 +/- 0.3 27.9 2.0 wwllyy R 4.1 CL094-2 CL094-3 SECTION A-A User Direction of feed 14.25 1.5 dia 1.752.0 dia 9.6 4.0 32.0 +/-0.3 16.0 20.6 2.0 CL0904-2-50TR-R wwllyy R 4.1 Pin #1 Pin #1 Supplied in tape and reel packaging, 1000 parts per 13” diameter reel.

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4379 BU-SB12068 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4379 Effective June 2017 CL0904 Multi-Phase power inductors Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.