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High Surge Voltage SMD Film Capacitors – CL Series GENERAL DESCRIPTION Film chip capacitor using a naked and stacked construction with metallized Polyethylene Naphtalate film (PEN) Usage of a multitrack technology results to an equivalent serial construc- tion which gives better high voltage surge handling capability. ADVANTAGES

  • Surge Voltage up to 1500V (10/700 μs)
  • Self healing
  • Safe open failure mode
  • Low ESR
  • Surface Mount (IR/Vapor reflow) solution

APPLICATIONS

This new version of our High Voltage SMD range has been developed to withstand high line surges common in telecom application. These capacitors meet the telecom lightning strike protection standards. PERFORMANCE CHARACTERISTICS Climatic Category 55/125/56 Capacitance Range 6.8nF to 33nF Tolerance on CR ±5%, ±10% Nominal Voltages 630Vdc Test Voltage 1500V (10/700μ sec.) Soldering methods IR or vapor phase reflow (not suitable for wave soldering) Tangent of Loss Angle at 1kHz (DF) < 100 x 10-4 Insulation resistance minimum: IR for C ≤ 0.33μF IR > 1000 MΩ at 20°C for 1 min.charge at 100VDC Temperature range -55°C to 125°C with voltage derating of 1.25%/ºC between 105ºC and 125ºC Outer Layer Termination Plating : 100% matte Sn Ni Barrier Under Termination Silver Epoxy Resin Brass Active Layers : PEN dielectric

High Surge Voltage SMD Film Capacitors – CL Series CAPACITANCE VALUES (CR) AND NOMINAL VOLTAGES (VR) VOLTAGE Vdc: 630V Capacitance Chip Dimensions Reel Range Ordering *Tolerances Tape Dimensions Reel Dimensions Packaging Unit Pkg (CR) Code (page 6) Code L W H max T W P1 K0 A W1 W2 max Bulk Reel VOLTAGE Vdc: 1000V millimeters (inches) *Dedicated for HID lamp applications For other Values: upon request Replace the + by the tolerance code: J = 5% or K = 10% Replace the -- by the packaging suffix: -- = bulk BC = tape & reel W L H T

High Surge Voltage SMD Film Capacitors – CL Series MOUNTING AND SOLDERING RECOMMENDATIONS RECOMMENDED SOLDER PASTE THICKNESS For optimum solderability, the recommended soldering paste thickness: 2824: 150 to 200μm 2840: 200 to 300μm In case of hand soldering, the temperature of the soldering iron should not be above 250°C. Special care must be taken to avoid touching the capacitor body with the iron tip. RECOMMENDED CLEANING To clean flux from the PC board assembly, the recommended products are: ethanol, isopropyl alcohol, and deionized water wash. The cleaning products to avoid are: Toluene, Xylene, Trichloroethylene, Terpene Cleaner EC-7, surface active agent. In case of using another solvent, please contact us. OTHER CAUTIONS Flame retardancy: the dielectric film is not a flame retardant material. Environment: contact us when chips are used in humid or gas atmosphere and /or when using resin. Recommended handling: do not use edged tools, so not to damage the capacitors. TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121 Stress Type Ref. Spec. Test Conditions Analysis Results Temperature cycling JESD22-A104 -55°C +85(+10/-0)°C air 5 SEM x 1000 Pass to 10mn soak 3 cycles/hour Ambient Temperature / 30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass Humidity Storage High Temperature / 70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass Humidity Storage Size Code Case Size A B C PAD DIMENSIONS:millimeters (inches) A CB *Reflow soldering referring to JEDEC Standard with some limitations *JEDEC J-Std 020C SOLDERING PROFILE The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT suitable for wave soldering. All temperature refer to topside of the package, measured on the package body surface. Profile Feature 2824 to 2840 Ramp-Up (Ts max to Tp) 3°C / second max Preheat - Temperature Min (T s min) 150°C - Temperature Min (Ts max) 200°C - Time (ts min to ts max) 180 sec. max Time maintained above - Temperature (T L) 217°C - Time (tL) 75 sec. max Peak temperature (Tp) 255°C Time within 5°C of peak 10 sec.temperature (tp) Ramp-Down 6°C / sec. 03 0 Time (seconds) Temperature (ºC) 60 90 120 150 180 210 240 Ramp down Ramp up 270 300 330 Tp Tp - 5ºC Ts min Ts max TL tS tp tL

High Surge Voltage SMD Film Capacitors – CL Series – RoHS MATERIALS CONTROLLED BY ROHS (PPM BY WEIGHT): Mass / unit (g) Lead Mercury Cadmium Hexavalent PBB PBDEChromium CB range 000 0 00 RoHS Limit (ppm) 1000 1000 100 1000 1000 1000 Pass/Fail Pass Pass Pass Pass Pass Pass This product has been tested and found to be compliant with all requirements, provisions, and exemptions of EU Directive 2002/9 5/EC of the European Parliament and Council of January 27, 2003. On the Restriction of use of certain Hazardous Substances (RoHS) in electrical and electronic equi pment and EU Directive 2000/53/EC regarding ELV or End of Life Vehicle. ROHS / ELV STATUS External Plating 100% Matte Sn as standard LEAD-FREE STATUS / MOISTURE SENSITIVITY RANKING Pb Free Reflow Solder compliant, MSL = 3. Reflow soldering referring to Jedec Standard with some limitations. Additional JESD-97 data to be phased in MSL e3 termination. PRODUCT LABELING: (For informational purposes only to be phased in on reel and container.) PRODUCT TRACEABILITY: Full internal material traceability by reference to unique lot number marked on reel and external package. RoHS Compliant:Pb Free: