CH960-HM370 DFI | Alldatasheet
Document overview
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Technical content
Block DiagramMechanical Drawing CH960-HM370 Features Mobile Intel® HM370 Chipset USB 3.0 4x Processor 2x Graphics CORES Memory Controller A / B 8th Generation Intel® Core™ i7 (6 CORE) DMI DDI Port 1 PCIe (2 x1/1 x2) C / D DDR4 2666MHz SODIMM Channel A DDR4 2666MHz SODIMMChannel B DDI Port 2 EEPROM SMBus LPC Bus 8-bit DIO WDT I2C Bus Serial Port 0,1 Fan PWM/ TACH_IN SLP/LID TCA6408A Embedded Controller IT8528E SPI Flash SPI Bus SATA 3.0 4x Intel GLAN I219LM MDI PCIe x1 PCIe (4 x1/1 x4) HDA USB 2.0 8x DDI Port 3 (optional) PCIe x16 (PEG) CH7517 VGA PCIe (2 x1/1 x2) eDP PTN3460 LVDS (optional) 8th/9th Generation Intel® Core™ i5/i3 (4 CORE) 8th/9th Gen Intel® Core TM Processor COM Express Basic
- Dual channel DDR4 2666MHz SODIMM up to 64GB
- Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
- eDP resolution supports up to 4096x2304 @ 60Hz
- Multiple expansion: 1 PCIe x16, 8 PCIe x1
- Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0 * Populated by default CPU Fan DDR4_2 SODIMM BGA 1440 Intel HM370 DDR4_1 SODIMM
3 Displays
PCIe L0~3 PCIe L4~5 PCIe L6~7 x4 x4 x2 x2 x2 x2 x1 x1 x1 x1 x1 x1 x1 x1 * 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 Wide Temperature -400C 850C SATA 3.0 USB 3.1 R Type6 2.1 0.00 0.00 87.00 117.00 121.00 41.53 91.00 87.00 117.00 76.00 52.07 33.40 53.59 4.00 19.43 58.67
Packing List Optional Items www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © April 1, 2020 DFI Inc. CH960-HM370 SYSTEM Processor 8th/9th Generation Intel® CoreTM Processors, BGA 1440 Intel Core™ i5-8400H, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W (HM370) Intel Core™ i3-8100H, 4 Cores, 6M Cache, 3.0GHz, 45W (HM370) Intel Core™ i3-9100HL, 4 Cores, 6M Cache, 1.6GHz (2.9GHz), 25W (HM370) Intel Celeron G5600E, 2 Cores, 4M Cache, 3.9GHz, 35W (HM370) Intel Celeron G4932E, 2 Cores, 2M Cache, 1.9GHz (1.9GHz), 25W (HM370) Chipset Intel® HM370 Chipset Memory Two 260-pin SODIMM up to 64GB Dual Channel DDR4 2666MHz BIOS AMI SPI 128Mbit GRAPHICS Controller Intel HD Graphics Feature OpenGL up to 4.5, DirectX 11, OpenCL 2.1 HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit) HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8 Display 1 x VGA/DDI (DDI available upon request) 1 x LVDS/eDP (eDP available upon request) 2 x DDI (HDMI/DVI/DP++) VGA: resolution up to 1920x1200 @ 60Hz LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz HDMI: resolution up to 4096x2160 @ 30 24bpp DVI: resolution up to 1920x1200 @ 60Hz DP++/eDP: resolution up to 4096x2304 @ 60Hz Triple Displays VGA + LVDS + DDI or VGA + DDI 1 + DDI 2 eDP + 2 DDI (available upon request) EXPANSION Interface 1 x PCIe x16 or 2 x PCIe x8 (Gen 3) 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3) 1 x LPC 1 x I C 1 x SMBus 2 x UART (TX/RX) AUDIO Interface HD Audio ETHERNET Controller 1 x Intel I219LM PCIe (10/100/1000Mbps) I/O USB 4 x USB 3.1 8 x USB 2.0 SATA 4 x SATA 3.0 (up to 6Gb/s) DIO 1 x 8-bit DIO (Default 4 inputs and 4 outputs) WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds POWER Type 12V, 5VSB, VCC_RTC (ATX mode) 12V, VCC_RTC (AT mode) Consumption Typical: 12V @ 0.85A (13.07Watt) Max.: 12V @ 5.75A (74.084Watt) OS SUPPORT Windows: Windows 10 IoT Enterprise 64-bit Linux ENVIRONMENT Temperature Operating: 0 to 60°C -40 to 85°C Storage: -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF 1,360,171 hrs @ 25°C; 892,642 hrs @ 45°C; 624,277 hrs @ 60°C excluding accessories Calculation Model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled MECHANICAL Dimensions COM Express® Basic 95mm (3.74") x 125mm (4.9") Compliance PICMG COM Express® R2.1, Type 6
- 1 CH960-HM370 board
- 1 Cooler (Height: 36.58mm) Wide Temp: A71-111100-010G Standard: A71-111100-000G
- COM332-B carrier board kit 770-CM3321-000G
- Heat spreader (Height: 11mm) A71-808316-000G
Ordering Information
Model Name P/N Processor Memory VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp. CH960-HM370BS-8400H 770-CH9601-400G i5-8400H 2 SODIMM VGA LVDS 1 4 8 ATX/AT Cooler 0 to 60 o C CH960-HM370BS-8100H 770-CH9601-600G i3-8100H 2 SODIMM VGA LVDS 1 4 8 ATX/AT Cooler 0 to 60 o C CH960-HM370BS-9100HL 770-CH9601-E00G i3-9100HL 2 SODIMM VGA LVDS 1 4 8 ATX/AT Cooler 0 to 60 o C CH960-HM370BS-G5600E 770-CH9601-F00G G5600E 2 SODIMM VGA LVDS 1 4 8 ATX/AT Cooler 0 to 60 o C CH960-HM370BS-G4932E 770-CH9601-H00G G4932E 2 SODIMM VGA LVDS 1 4 8 ATX/AT Cooler 0 to 60 o C