CEXPRESS-WL

CEXPRESS-WL ADLINK | Alldatasheet

Document overview

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Technical content

Features

• 8th Gen quad/dual-core Intel Core™ Processors
• Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
• Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays
• Up to eight PCIe lanes, GbE
• Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0
• Supports Smart Embedded Management Agent (SEMA) functions
• Extreme Rugged operating temperature: -40°C to +85°C (optional) Specifications
• Core System CPU 8th Gen Intel® Core™ and Celeron® Processors - Mobile 14nm process (formerly “Whiskey Lake-U”) Core™ i7-8665UE, 1.7 (4.4 Turbo) GHz, 8MB, 15W (25W-12.5W cTDP), 4C/GT2 Core™ i5-8365UE, 1.6 (4.1 Turbo) GHz, 6MB, 15W (25W-12.5W cTDP), 4C/GT2 Core™ i3-8145UE, 2.2 (3.9 Turbo) GHz, 4MB, 15W (25W-12.5W cTDP), 2C/GT2 Celeron ® 4305UE, 2.0GHz, 2MB, 15W, 2C/GT1 Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX-NI. Note: Availability of features may vary between processor SKUs. Memory Dual channel 2133/2400 MHz non-ECC DDR4 memory up to 64GB in two SODIMM sockets Embedded BIOS AMI EFI with CMOS backup in 32 or 16MB SPI BIOS with Intel® AMT 11.0 support (AMT support available on Core™ i7/i5 only) Cache 8MB for Core™ i7, 6MB for Core™ i5, 4MB for Core™ i3, 2MB for Celeron® Expansion Busses
• 6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4)
• 2 PCI Express x1 Gen3 (CD): Lanes 6/7
• 1 PCI Express x1 Gen3 (CD): Lane 16 (muxed with SATA port 3, by build option) Note: Maximum of 5 PCIe devices supported
• LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
• Video GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs
• Hardware encode/transcode of HD content (including HEVC)
• DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
• OpenGL 4.5, 4.4/4.3 and ES 2.0 support
• OpenCL 2.1, 2.0/1.2 support Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI VGA Support by build option through DP-to-VGA IC (in place of DDI2, max. resolution 1920x1200 @60Hz) LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode) eDP Optional 4 lane support, in place of LVDS (max. resolution 4096x2304 @60Hz, 24bpp)
• Audio Chipset Intel® HD Audio integrated in SoC Audio Codec On carrier Express-BASE6 (ALC886 standard support)
• Ethernet Intel® MAC/PHY Intel® I219-LM/V (LM supports AMT 12.x) Interface 10/100/1000 Mbit/s Ethernet connection

• Multi I/O and Storage SATA: 3x SATA 6Gb/s (SATA 0,1,2), SATA port 3 muxed with PCIe lane 16 (SATA port 3 is default) Serial: 2x UART ports with console redirection, from a LPC to UART IC (opt. HSUART from SOC by build option) eMMC: eMMC 5.0 (8/16/32GB by build option) GPIO/SD: 4x GPO and 4x GPI from BMC (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design
• Super I/O Supported on carrier if needed (standard support for W83627DHG-P)
• TPM Chipset: Infineon Type: TPM 2.0
• Power Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% Wide Input: ATX: 5-20 V / 5Vsb ±5%; or AT: 5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving
• Mechanical and Environmental Form Factor: PICMG COM.0: Rev 3.0 Type 6 Dimension: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (optional, selected SKUs) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
• Operating Systems Standard Support Windows 10 64-bit, Yocto project based Linux 64-bit, Ubuntu L TS 64-bit (TBD), CentOS 64-bit (TBD) Extended Support (BSP) Yocto project based Linux 64-bit

8th Gen Intel® Core™ Intel®Celeron® SoC (formerly “Whiskey Lake-U”) CD SODIMM 4-32 GB DDR4 non-ECC (bottom side) DDI1 (4 lanes) DP/HDMI 6x PCIe x1 Gen3 (port 0-5, supports x2, x4) HD Audio 2x SATA 6Gb/s (port 0-1) 8x USB 2.0/1.0 (ports 0-7) DDI2 (4 lanes) DP/HDMI 4x USB 3.1 Gen2 upgrade (port 0-3) Single/dual channel 18/24-bit LVDS eDP Thermal Sensor GP I2C SPI 0 BIOS SPI SPI 1 BIOS DDC I2C SPI_CS# SODIMM 4-32 GB DDR4 non-ECC (top side) eDP 4 lanes (build option) SMBus SMBus LPC to UART VGA DP to VGA (build option) I2C LVDS eDP to LVDS 1x PCIe x1 Gen3 (port 16) (build option, in place of SATA2) eMMC 8-64GB New SEMA BMC Switch GPIO GPIO SD SD 2x PCIe x1 Gen3 (port 6-7, x1 only) TPM 2.0 1x SATA 6Gb/s (port 2) Muxed with PCIe port 16 HSUART UART0 UART1 LPC bus (eSPI as build option)

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Sep. 04, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.

Ordering Information

• cExpress-WL-i7-8665UE Compact COM Express Type 6 module with 8th Gen Intel Core™ i7-8665UE at 1.7GHz/4.4GHz, quad-core with GT2 level graphics
• cExpress-WL-i5-8365UE Compact COM Express Type 6 module with 8th Gen Intel Core™ i5-8365UE at 1.6GHz/4.1GHz, quad-core with GT2 level graphics
• cExpress-WL-i3-8145UE Compact COM Express Type 6 module with 8th Gen Intel Core™ i3-8145UE at 2.2GHz/3.9GHz, dual-core with GT2 level graphics
• cExpress-WL-4305UE Compact COM Express Type 6 module with 8th Gen Intel Celeron 4305UE at 2.0GHz, dual-core with GT1 level graphics *For processor SKUs not listed, please contact your ADLINK representative for availability. Accessories Heat Spreaders
• HTS-cWL-B Heatspreader for cExpress-WL with threaded standoffs for bottom mounting
• HTS-cWL-BT Heatspreader for cExpress-WL with through hole standoffs for top mounting Passive Heatsinks
• THS-cWL-B Low profile heatsink for cExpress-WL with threaded standoffs for bottom mounting
• THS-cWL-BT Low profile heatsink for cExpress-WL with through hole standoffs for top mounting
• THSH-cWL-B High profile heatsink for cExpress-WL with threaded standoffs for bottom mounting Active Heatsink
• THSF-cWL-B High profile heatsink with Fan for cExpress-WL with threaded standoffs for bottom mounting Starter Kit
• COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6