CEXPRESS-BW ADLINK | Alldatasheet

Document overview

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Technical content

Features

  • Dual, quad-core Intel Pentium , Celeron N3000 Series and Atom™ X5-E8000 SoC
  • Up to 8 GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one eDP, (shared with DDI3) 3 independent displays (build option) LVDS in place of eDP
  • Three PCIe x1 (five PCIe x1 with bridge)
  • GbE, two SATA 6 Gb/s (build option onboard SSD), four USB 3.0/2.0, four USB 2.0
  • Smart Embedded Management Agent (SEMA ) functions Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times. New Specifications
  • Core System CPU Dual or quad-core Intel® Pentium®, Celeron® N3000 Series and Atom™ SoC, 14nm process (formerly “Braswell”) Intel® Pentium® N3710, 1.6/2.56 (Burst) GHz, 400/700 (Turbo), 6W (4C) Intel® Celeron® N3160, 1.6/2.24 (Burst) GHz, 320/640 (Turbo), 6W (4C) Intel® Celeron® N3060, 1.6/2.48 (Burst) GHz, 320/600 (Turbo), 6W (2C) Intel® Celeron® N3010, 1.04/2.24 (Burst) GHz, 320/600 (Turbo), 4W (2C) Intel® Atom™ X5-E8000, 1.04/2.0 (Burst) GHz, 320 (no Turbo), 5W (4C) Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 8GB in dual SODIMM socket Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS Cache 2MB for Pentium®, Celeron® and Atom™ Expansion Busses 3x PCIe x1: Lanes 0/1/2 (build option 5x PCIe x1 with bridge) LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU
  • Audio Chipset Intel® HD Audio integrated in SoC Audio Codec On Express-BASE6 carrier (ALC886 standard support)
  • Ethernet MAC/PHY: Intel® Ethernet Controller i211AT Interface: 10/100/1000 GbE connection
  • Video Supports 3 independent and simultaneous display combinations of DisplayPort/HDMI/ eDP monitors (optional LVDS in place of eDP) GPU Feature Support Encode/transcode of HD video content Supports 3D rendering, media compositing and video encoding Full hardware acceleration for decode of HEVC, H.264, SVC, VP8, VP9, MPEG4, AVS, H.263 Full hardware acceleration for encode of H.264, SVC, VP8, VP9, AVS, H.263 Supports content protection using PAVP2.0, HDCP 1.4/2.1 and Media Vault DRM DirectX 11.1 support OpenGL 4.2, ES 3.0 and OpenCL 1.2 support Note: Availability of features dependent on operating system. LVDS/eDP eDP support (shared with DDI3) Single/dual channel 18/24-bit LVDS (build option in place of eDP) Digital Display Interface DDI1 supporting DisplayPort/HDMI DDI2 supporting DisplayPort/HDMI DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP) Note: Only two simultaneous HDMI outputs supported.

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times. Specifications

  • I/O Interfaces (USB 4,5,6,7, port 4-7 from USB hub) SATA: 2x SATA 6Gb/s (SATA0, SATA1) Optional onboard SSD (8/16/32GB) in place of SATA1 port Serial: 2 UART ports COM 1/2 (COM 1 supports console redirection) GPIO/SD: 4 GPO and 4 GPI SD muxed with GPIO, switched by BIOS setting
  • Super I/O Supported on carrier if needed (standard support for W83627DHG-P)
  • TPM Chipset: Atmel AT97SC3204 Type: TPM 1.2
  • Power Standard Input: ATX: 12V±5%/5Vsb ±5%, or AT: 12V±5% Wide Input: ATX: 5-20 V/5Vsb ±5%, or AT: 5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving
  • Mechanical and Environmental Form Factor: PICMG COM.0 Rev 2.1 Type 6 Dimension: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0°C to 60°C Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
  • Operating Systems Standard Support Windows 10/8.1 64-bit, Windows7 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7 32/64-bit, Linux 32/64-bit, VxWorks 32-bit

(port 0,1) HD Audio 1x SATA 6Gb/s (port 0) 4x USB 2.0/1.0 (ports 0-3) PCIe x1 Gen2 UART0, UART1 LM73 GPIO PCA9535 SEMA BMC GP I2C SPI 0 BIOS LPC bus GPIO/SD SPI 1 BIOS DDC I2C SPI_CS# 4x USB 2.0/1.1 (ports 4-7) USB Hub 1x USB 2.0/1.1 1x PCIe x1 Gen2 (port 2) 3x PCIe x1 Gen2 (port 2,3,4) 1x SATA 6Gb/s (port 1) PCIe Switch (optional) TPM Atmel AT97SC3204 (optional) MUX Single/dual channel 18/24-bit LVDS eDP 4 lanes LVDS eDP-to-LVDS (optional) Intel® Pentium® Celeron® Atom™ (formerly “Braswell”) SD SODIMM 1-4 GB DDR3L non-ECC DDI1 (4 lanes) DP/HDMI XDP 60-pin DDI2 (4 lanes) DP/HDMI 4x USB 3.0 upgrade (port 0-3) SODIMM 1-4 GB DDR3L non-ECC DP Switch DDI3 (4 lanes) DP/HDMI (switch through BIOS) SPI SMBus

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Sept. 30, 2016. ©2016 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.

Ordering Information

  • cExpress-BW-N3710 COM Express Compact size Type 6 module with Intel Pentium N3710 at 1.6/2.56 (Burst) GHz
  • cExpress-BW-N3160 COM Express Compact size Type 6 module with Intel Celeron N3160 at 1.6/2.24 (Burst) GHz
  • cExpress-BW-N3060 COM Express Compact size Type 6 module with Intel Celeron N3060 at 1.6/2.48 (Burst) GHz
  • cExpress-BW-N3010 COM Express Compact size Type 6 module with Intel Celeron N3010 at 1.04/2.24 (Burst) GHz
  • cExpress-BW-x5-E8000 COM Express Compact size Type 6 module with Intel Atom™ x5-E8000 at 1.04/2.0 (Burst) GHz Accessories Heat Spreaders
  • HTS-cBW-B Heatspreader for cExpress-BW with threaded standoffs for bottom mounting
  • HTS-cBW-BT Heatspreader for cExpress-BW with through hole standoffs for top mounting Passive Heatsinks
  • THS-cBW-B Low profile heatsink for cExpress-BW with threaded standoffs for bottom mounting
  • THS-cBW-BT Low profile heatsink for cExpress-BW with through hole standoffs for top mounting
  • THSH-cBW-B High profile heatsink for cExpress-BW with threaded standoffs for bottom mounting Active Heatsink
  • THSF-cBW-B High profile heatsink with Fan for cExpress-BW with threaded standoffs for bottom mounting Starter Kit
  • COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit