CEXPRESS-AL ADLINK | Alldatasheet

Document overview

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Technical content

Features

  • Intel Atom E3900 series (formerly Apollo Lake) and Pentium /Celeron SOC, supporting full virtualization (VT-d/VT-x)
  • Supports IEEE 1588 Precision Time Protocol (PTP)
  • Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz
  • Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays
  • Up to Five PCIe x1 Gen2 (by PCIe bridge IC, build option)
  • Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0 (build option)
  • Extreme Rugged operating temperature: -40°C to +85°C (build option for E3900 series SKUs) Specifications
  • Core System CPU Intel Atom® E3900 series (formerly Apollo Lake)/Pentium®/Celeron® SoC on 14nm process Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) Note: Pentium®/Celeron® support by project basis Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG Notes: Availability of features may vary between processor SKUs. Pentium®/Celeron® supported by project basis. Memory Dual channel 1867/1600 MHz non-ECC DDR3L memory up to 8GB in dual SODIMM socket (maximum by 2pcs 4GB or 1pcs 8GB SO-DIMM) Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option) Expansion Busses

3 PCI Express x1 Gen2 (AB): Lanes 0/1/2 by default

Note: 5 PCI Express x1 Gen2 (AB): Lanes 0/1/2/3/4 through PCIe bridge IC by request. LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs MIPI60 header for ICE debug of CPU/chipset (build option)

  • Audio Chipset Intel® HD Audio integrated in SoC Audio Codec On carrier Express-BASE6 (ALC886 standard support)
  • Ethernet Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range) Intel® Ethernet Controller I211 (standard operating temperature range) Supports IEEE 1588 and GbE0_SDP (I210 only)
  • Video GPU Feature Support Intel® Gen9 LP Graphics Core, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP/VGA outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI VGA Build option support through DP-to-VGA IC (in place of DDI2) LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lanes support (build option, in place of LVDS) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
  • I/O Interfaces USB: 3x USB 3.0 (USB ports 0-2) and 5x USB 2.0 (USB ports 3-7) USB OTG support on USB 2.0 port 0 with Yocto Linux SATA: Two ports SATA 6Gb/s (SATA0,1) Serial: 2 UART ports eMMC: eMMC 5.0 (8/16/32GB, build option) GPIO/SD: 4 GPO and 4 GPI SD signal muxed with GPIO, controlled by BIOS setting Note: eMMC/SD boot device support dependent on OS.
  • Super I/O Supported on carrier if needed (standard support for W83627DHG-P)
  • TPM (build option) Chipset Infineon Type TPM 2.0
  • Power Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT=12V±5% Wide Input: ATX = 4.75-20 V / 5Vsb ±5% or AT=4.75-20V (Standard Temp. only) Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving
  • Mechanical and Environmental Form Factor: PICMG COM.0: Rev 3.0 Type 6 Dimension: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (build option with E3900 series only) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
  • Operating Systems Standard Support Windows 10 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit Extended Support (BSP) VxWorks Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Intel Atom® Intel® Pentium® Intel® Celeron® “Apollo Lake” CD SODIMM 1867/1600 MHz 2-8 GB DDR3L non-ECC DDI1 (4 lanes) DP/HDMI HD Audio 2x SATA 6Gb/s (port 0/1) 8x USB 2.0/1.0 (ports 0-7) (OTG on port 0, OS dependent) MIPI60 60-pin (build option) DDI2 (4 lanes) DP/HDMI 3x USB 3.0 upgrade (ports 0/1/2) single/dual channel 18/24-bit LVDS eDP LM73 SEMA BMC SMBus GP I2C SPI 0 BIOS LPC bus SPI SPI 1 BIOS DDC I2C SPI_CS# SODIMM 1867/1600 MHz 2-8 GB DDR3L non-ECC eDP x4 lanes (build option) LVDS eDP to LVDS 4x GPI, 4x GPO (SD) GPIO SD PCIe x1 (port0) PCIe x1 (port1) PCIe x1 (port2) PCIe Bridge (build option) PCIe x1 (port3) PCIe x1 (port4) GbE TPM 2.0 (build option) I2C MUX VGA DP to VGA (build option) Note: max. capacity is 8GB (2x 4GB or 1x 8GB) UART0 UART1 LPC to UART GbE0_SDP (for I210) eMMC 5.0 8/16/32GB (build option)

3 PCI x1 (0/1/2) default

(other config. by request)

www.adlinktech.com All products and company names listed are trademarks or trade names of their respective companies. Updated Dec. 13, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.

Ordering Information

  • cExpress-AL-E3950 Compact COM Express Type6 with Intel Apollo Lake-I Atom E3950 (4C)
  • cExpress-AL-E3940 Compact COM Express Type6 with Intel Apollo Lake-I Atom E3940 (4C)
  • cExpress-AL-E3930 Compact COM Express Type6 with Intel Apollo Lake-I Atom E3930 (2C)
  • cExpress-AL-N4200 Compact COM Express Type6 with Intel Apollo Lake Pentium N4200 (4C)
  • cExpress-AL-N3350 Compact COM Express Type6 with Intel Apollo Lake Celeron N3350 (2C) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Please contact local sales. Accessories Heat Spreaders
  • HTS-cAL-B-I Heatspreader for cExpress-AL Atom with threaded standoffs for bottom mounting
  • HTS-cAL-BT-I Heatspreader for cExpress-AL Atom with through hole standoffs for top mounting
  • HTS-cAL-B Heatspreader for cExpress-AL Pentium /Celeron with threaded standoffs for bottom mounting
  • HTS-cAL-BT Heatspreader for cExpress-AL Pentium /Celeron with through hole standoffs for top mounting Passive Heatsinks
  • THS-cAL-B-I Low profile heatsink for cExpress-AL Atom with threaded standoffs for bottom mounting
  • THS-cAL-BT-I Low profile heatsink for cExpress-AL Atom with through hole standoffs for top mounting
  • THS-cAL-B Low profile heatsink for cExpress-AL Pentium /Celeron with threaded standoffs for bottom mounting
  • THS-cAL-BT Low profile heatsink for cExpress-AL Pentium /Celeron with through hole standoffs for top mounting
  • THSH-cAL-B-I High profile heatsink for cExpress-AL Atom with threaded standoffs for bottom mounting
  • THSH-cAL-B High profile heatsink for cExpress-AL Pentium /Celeron with threaded standoffs for bottom mounting Active Heatsink
  • THSF-cAL-B-I High profile heatsink with fan for cExpress-AL Atom with threaded standoffs for bottom mounting
  • THSF-cAL-B High profile heatsink with fan for cExpress-AL Pentium Celeron with threaded standoffs for bottom mounting Starter Kit
  • COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6