CEM500 AXIOMTEK | Alldatasheet
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Technical content
EPIC Embedded SBCs >3.5" Capa Embedded SBCs >Nano-ITX Embedded SBCs >Pico-ITX Embedded SBCs >PC/104 Industrial Mother-boards Slot CPU Cards ARM Embedded Boards Accessories Appendix CEM500 NEW Features6th Generation Intel® Core™ i7/i5/i3 & Celeron® Processor COM Express Type 6 Module with Intel® QM170/HM170
- 6th generation Intel® Core™ i7/i5/i3 & Celeron® processor (Skylake-H)
- Intel® QM170/HM170 chipset
- 2 DDR4-2133 SO-DIMMs max. up to 32 GB
- Max. up to 24 lanes of PCIe
- 4 SATA-600
- 4 USB 3.0 and 8 USB 2.0
- Supports TPM function I/O Packing List System Quick installation guide, user’s manual/utility CD Display
Ordering Information
CEM500PG-i7-6820EQ COM Express type 6 module with Intel® Core™ i7-6820EQ 2.8 GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM CEM500PG-i5-6440EQ COM Express type 6 module with Intel® Core™ i5-6440EQ 2.7 GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM CEM500PG-i3-6100E COM Express type 6 module with Intel® Core™ i3-6100E 2.7GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM Optional CEB94011 ATX form factor type 6 evaluation board CPU 6th generation Intel® Core™ processor (Skylake) with i7-6820EQ (45W), i5-6440EQ (45W), i3-6100E (35W) System Memory 2 x DDR4-2133 SO-DIMMs support max. up to 32 GB Chipset Intel® QM170/HM170 BIOS AMI uEFI with Intel® Active Management Technology 11.0 supported SSD N/A Watchdog Timer 255 levels, 1~255 sec. Expansion Interface 1 x PCIe x16 v3.0 8 x PCIe x1 (7 x1 while internal MAC is connected) Battery Lithium N/A Power Input ATX: +12V, +5VSB; AT: +12V Size 125 x 95 mm Board Thickness 2.0 mm Temperature -40ºC ~ +85ºC (-40ºF ~ +185ºF), operation Operation Humidity 10% ~ 95% relative humidity, non-condensing MIO 1 x LPC interface 1 x SPI interface 1 x I C interface 2 x TX/RX serial interface SATA 4 x SATA-600 support RAID 0/1/5/10 Hardware Monitoring Yes Ethernet 1 port as 10/100/1000Mbps supports Wake-on-LAN, PXE Boot ROM with Intel® i219LM Audio HD link interface to baseboard for Codec USB 4 x USB 3.0 and 8 x USB 2.0 TPM ST for trusted platform SMBus Yes Digital I/O 4 channels IN & 4 channels OUT Smart Battery Yes Chipset Intel® Gen 9 Graphics Gfx APIs - DX11/12, OCL2.x, OGL 4.3/4.4 3 independent displays Display Interface 1 x LVDS; 18/24-bit single/dual channel (optional with eDP) 3 x DDI (DP/HDMI/DVI); 1 x DDI optional w/VGA DDR4 DDR4DDR4 USB 3.0 USBUSB TripleView Full Solid Cap Design AiRD Ext. Temp COM Express Interface Connector 2 x DDR4 SO-DIMM Intel® QM170/ HM170 6th Gen. Intel® Core™ Processor Rear view