CEM330 AXIOMTEK | Alldatasheet

Document overview

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Technical content

Features

  • Intel Atom® X7000 or Intel® Core™ i3/N-series processors (Amston Lake/Alder Lake-N)
  • Up to 16GB LPDDR5 memory onboard
  • Supports up to 4 PCI Express lanes
  • Up to 2 SATA 3.0
  • 2 USB 3.2 and 8 USB 2.0
  • eMMC and TPM 2.0 onboard COM Express Type 10 Mini Module with Intel Atom® X7000 or Intel® Core™ i3/N-series Processors DDR5 USB 3.2 Dual-View All Solid Caps Front view Rear view Memory COM Express connector Battery connector eMMC Low Power Wide Temp. Specifications Core System CPU Intel Atom® X7000 or Intel® Core™ i3 N-series processors System Memory LPDDR5-4800, up to 16GB Chipset SoC integrated BIOS AMI uEFI (Legacy free) Storage 32GB/64GB eMMC onboard Watchdog Timer 65536 levels, 0 to 65535 sec. Expansion Interface Up to 4 x PCle x1 Battery Lithium Yes Power Input ATX: +12V, +5VSB AT: +12V Extended voltage: +4.75V to +20V Display Chipset Intel® UHD Graphics Display Interface 1 x LVDS; 18/24-bit single channel (optional eDP 1.4b) 1 x DDI (with up to 4K supported)

www.axiomtek.com System on Modules

Ordering Information

(P/N: E38D330105) COM Express Type 10 Mini module with Intel Atom® X7433RE, LPDDR5 4GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature) Optional CEM330 X7835RE- 16G/64G COM Express Type 10 Mini module with Intel Atom® X7835RE, LPDDR5 16GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature) CEM330 X7433RE- 8G/64G COM Express Type 10 Mini module with Intel Atom® X7433RE, LPDDR5 8GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature) CEM330 X7211RE- 8G/32G COM Express Type 10 Mini module with Intel Atom® X7211RE, LPDDR5 8GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (industrial temperature) CEM330 X7425E- 16G/64G COM Express Type 10 Mini module with Intel Atom® X7425E, LPDDR5 16GB, 64GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (commercial temperature) CEM330 X7213E- 8G/32G COM Express Type 10 Mini module with Intel Atom® X7213E, LPDDR5 8GB, 32GB eMMC, DDI, LVDS, USB 3.2, and GbE LAN (commercial temperature) CEB94017 (P/N: E394017101) COM Express Type 10 development baseboard

712000012700 CEM330 heatspreader

5078D840200E Active cooler with fan (should be assembled with heat spreader) I/O SATA 2 x SATA 3.0 (optional) Hardware Monitoring Yes Ethernet 1 x 10/100/1000/2500 Mbps Ethernet with Intel® I226LM, supporting Wake-on-LAN Audio HD link interface to baseboard for Codec USB 2 x USB 3.2 Gen 2 8 x USB 2.0 Serial 1 x LPC 1 x SPI 2 x TX/RX TPM TPM 2.0 SMBus Yes Others 1 x I C GPIO 4-CH in/4-CH out Smart Battery Yes Mechanical and Environmental Dimensions 84 x 55 mm Board Thickness 2.0 mm Operating Temperature Extended temp SKU: -40°C to +85°C (-40°F to +185°F), operation with a system thermal solution Standard temp SKU: -20°C to +70°C (-4°F to +158°F) with standard thermal solution Relative Humidity 10% to 95% relative humidity, non-condensing Vibration Endurance 3.5 Grms Specifications

  • All specifications and photos are subject to change without notice. © 2026 Axiomtek Co., Ltd. All rights reserved. Updated Jan. 23, 2026. Packing List Quick installation guide Block Diagram eSPI CS0 EC IT5571 GPIO Intel® Amston Lake SoC COM Express Type 10 connector Rev. 3.1 Serial port x 2 (only TX/RX) TPM 2.0 eMMC 5.1 SPI 32/64GB Channel 0 LPDDR5 x32 (8G/16G) Channel 1 PCIe x1 PCIe x1 PCIe x1 x 4 or PCIe x4 x 1 SATA 3.0 x 1 SATA 3.0 x 1(option) PCIe x1 PCIe x1 SATA 3.0 x 2 SMBus I2C HDA USB 2.0 x 8 USB 3.2 Gen 2 x 2 SPI BIOS SPI PCIe x1 eSPI to LPC F85227 (option) CH7513eDP LVDS DDI0 Intel® I226LM (option) eSPI CS1