CDC351DBR TI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 13

Technical content

www.ti.com GND Y10 VCC OE A VCC GND GND VCC GND GND VCC GND DB OR DW PACKAGE (TOP VIEW) CDC351. CDC351I 1-LINE TO 10-LINE CLOCK DRIVER WITH 3-STATE OUTPUTS SCAS441D–FEBRUARY 1994–REVISED OCTOBER 2003

FEATURES

  • Low Output Skew, Low Pulse Skew for Clock-Distribution and Clock-Generation

Applications

  • Operates at 3.3-V VCC
  • LVTTL-Compatible Inputs and Outputs
  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Distributes One Clock Input to Ten Outputs
  • Distributed VCC and Ground Pins Reduce Switching Noise
  • High-Drive Outputs (–32-mA IOH, 32-mA IOL)
  • State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation
  • Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages

DESCRIPTION

The CDC351 is a high-performance clock-driver circuit that distributes one input (A) to ten outputs (Y) with minimum skew for clock distribution. The output-enable (OE) input disables the outputs to a high-impedance state. The CDC351 operates at nominal 3.3-V VCC. The propagation delays are adjusted at the factory using the P0 and P1 pins. The factory adjustments ensure that the part-to-part skew is minimized and is kept within a specified window. Pins P0 and P1 are not intended for customer use and should be connected to GND. FUNCTION TABLE INPUTS OUTPUTS YnA OE L H Z H H Z L L L H L H AVAILABLE OPTIONS TA Shrink Small-Outline Package (DB) (1) Small-Outline Package (DW) (1) 0°C to 70°C CDC351DB CDC351DW – 40°C to 85°C CDC351IDB CDC351IDW (1) This package is available tape and reel. Order by adding an R to the orderable part number (e.g., CDC351DBR). EPIC-IIB is a trademark of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 1994–2003, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily in- cludetestingofallparameters.

www.ti.com EN A Y10 OE OE Y10 A P0 P1 CDC351. CDC351I 1-LINE TO 10-LINE CLOCK DRIVER WITH 3-STATE OUTPUTS SCAS441D–FEBRUARY 1994–REVISED OCTOBER 2003 LOGIC SYMBOL A Note A: This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. LOGIC DIAGRAM (POSITIVE LOGIC)

www.ti.com CDC351. CDC351I 1-LINE TO 10-LINE CLOCK DRIVER WITH 3-STATE OUTPUTS SCAS441D–FEBRUARY 1994–REVISED OCTOBER 2003 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range, VCC – 0.5 V to 4.6 V Input voltage range, VI (2) – 0.5 V to 7 V Voltage range applied to any output in the VO (2) – 0.5 V to 3.6 V high state or power-off state, Current into any output in the low state, IO 64 mA Input clamp current, IIK(VI < 0) – 18 mA Output clamp current, IOK (VI < 0) – 50 mA Package thermal impedance QJA (3): DB package 147°C/ W DW package 101°C/ W Storage temperature range, Tstg – 65°C to 150°C (1) Stresses beyond those listed under,, absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) The package thermal impedance is calculated in accordance with JESD51. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX UNIT VCC Supply voltage 3 3.6 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VI Input voltage 0 5.5 V IOH High-level output current – 32 mA IOL Low-level output current 32 mA fclock Input clock frequency 100 MHz Commercial 0 70 °C TA Operating free-air temperature Industrial – 40 85 °C (1) Unused pins (input or I/O) must be held high or low.

ELECTRICAL CHARACTERISTICS

over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIK VCC = 3 V, II = –18 mA –1.2 V VOH VCC = 3 V, IOH = –32 mA 2 V VOL VCC = 3 V, IOL = 32 mA 0.5 V II VCC = 3.6 V, VI = VCC or GND ±1 µA IO (1) VCC = 3.6 V, VO = 2.5 V –15 –150 mA IOZ VCC = 3.6 V, VO = 3 V or 0 ±10 µA Outputs high 0.3 ICC VCC = 3.6 V, IO = 0, VI = VCC or GND Outputs low 25 mA Outputs disabled 0.3 Ci VI = VCC or GND, VCC = 3.3 V, f = 10 MHz 4 pF Co VO = VCC or GND, VCC = 3.3 V, f = 10 MHz 6 pF (1) Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

www.ti.com CDC351. CDC351I 1-LINE TO 10-LINE CLOCK DRIVER WITH 3-STATE OUTPUTS SCAS441D–FEBRUARY 1994–REVISED OCTOBER 2003 SWITICHING CHARACTERISTICS CL = 50 pF (see Figure 1 and Figure 2) VCC = 3 V to 3.6 V, VCC = 3 V to 3.6 V,VCC = 3.3 V, TA = 25°CFROM TO TA = 0°C to 70°C TA = -40°C to 85°CPARAMETER UNIT(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX tPLH 3.2 3.7 4.2 A Y ns tPHL 3 3.5 4 OE Y ns OE Y ns tsk(o) A Y 0.3 0.5 0.5 0.6 ns tsk(p) A Y 0.2 0.8 0.8 0.9 ns tsk(pr) A Y 1 1 1.1 ns tr A Y 1.5 1.5 ns tf A Y 1.5 1.5 ns SWITCHING CHARACTERISTICS TEMPERATURE AND VCC COEFFICIENTS over recommended operating free-air temperature and VCC range (1) FROM TOPARAMETER MIN MAX UNIT(INPUT) (OUTPUT) Average temperature coefficient of low to high propagation§tPLH(T) A Y 65 (2) ps/10°Cdelay Average temperature coefficient of high to low propagation§tPHL(T) A Y 45 (2) ps/10°Cdelay §tPLH(VCC) Average VCC coefficient of low to high propagation delay A Y –140 (3) ps/ 100 mV §tPHL(VCC) Average VCC coefficient of high to low propagation delay A Y –120 (3) ps/ 100 mV (1) These data were extracted from characterization material and are not tested at the factory. (2) §tPLH(T) and §tPHL(T) are virtually independent of VCC. (3) §tPLH(VCC) and §tPHL(VCC) are virtually independent of temperature.

3 VData Input

A. CL includes probe and jig capacitance. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms

B. Pulse skew, tsk(p), is calculated as the greater of | tPLHn - tPHLn | (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10). Figure 2. Waveforms for Calculation of tsk(o), tsk(p), tsk(pr)

www.ti.com 28-Aug-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CDC351DB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351DBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI Replaced by CDC351DBR CDC351DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351IDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351IDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351IDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples CDC351IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples CDC351IDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

www.ti.com 28-Aug-2010 Addendum-Page 2 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CDC351DBR SSOP DB 24 2000 367.0 367.0 38.0 CDC351IDBR SSOP DB 24 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46C and todiscontinueany productorserviceperJESD48B. Buyersshould obtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.All semiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsalesuppliedatthetime oforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents whichmeet ISO/TS16949 requirements,mainlyforautomotiveuse.Components which have notbeen so designatedareneitherdesignednorintendedforautomotiveuse;and TIwillnotbe responsibleforany failureofsuch components tomeet such requirements. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP MobileProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2012,Texas InstrumentsIncorporated