CDBU001A COMCHIP | Alldatasheet

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Technical content

Features

Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 0603 ( 1608 ) Standard package, molded plastic Terminals: Solder plated, solderable per MIL-STD-750, method 2026 Polarity: Indicated by cathode band Mounting position: Any Weight: 0.003 gram (approximately) 0.0 71( 1.8 0) 0.0 63( 1.6 0) 0.0 39( 1.0 0) 0.0 31( 0.8 0) 0.0 33( 0.8 5) 0.0 27( 0.7 0) Dimensions in inches and (millimeter) 0603(1608)

RATING AND CHARACTERISTIC CURVES (CDBU001A) Forward current (mA ) Fig. 1 - Forw ard cha racte ristic s For war d vol tag e (V) Reverse voltage (V) Fig. 2 - Rev erse ch aract eristi cs Reverse current ( A ) Fig. 4 - Curre nt derating curve Ambient temperature ( C ) 100 0 25 50 75 100 125 150 Mounting on glass epoxy PCBs Average forward current ( % ) Fig. 3 - Cap acita nce bet ween termina ls chara cteris tics Rev ers e vol tag e (V) Capacitance between terminals (pF) SMD Schottky Barrier DiodeSMD Schottky Barrier Diode 75 C 25 C 125 C 300 5 10 15 20 25 35 -25 C 75 C 25 C 125 C 100u 10u 100n 0 10 20 30 40 50 1000 100 f = 1 MHz Ta = 25 C SMD Diodes Specialist COMCHIP Page 2 REV:A QW-A1003