CDBQC00340-HF COMCHIP | Alldatasheet
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Technical content
Features
- Designed for mounting on small surface. - Extremely thin package. - Low stored charge. - Majority carrier conduction. Comchip Technology CO., LTD. QW-G1133 Io = 30 mA VR = 40 Volts RoHS Device Halogen Free SMD Schottky Barrier Diode Company reserves the right to improve product design , functions and reliability without notice. Circuit Diagram High-Reliability and High-Performance Dimensions in inches and (millimeter) 0402C/SOD-923F Maximum Rating (at TA=25°C unless otherwise noted) Typ VRRMRepetitive peak reverse voltage SymbolParameter Conditions Min Max Unit V45 VRReverse voltage V40 IFSMForward current, surge peak 8.3 ms single half sine-wave superimposed on rate load(JEDEC method) 500 PD mW 200 +125 -40 Power dissipation Suction temperature Tj °C+125 Junction temperature TSTG mA IOAverage forward current mA30 Symbol TypParameter Conditions Min Max Unit Electrical Characteristics (at TA=25°C unless otherwise noted) IR µA Forward voltage IF = 1mA DC VF V0.37 1.5CTCapacitance between terminals pFf = 1MHz and 1 VDC reverse voltage Reverse current VR = 40V 1.00 Mechanical data - Mounting position: Any. - Weight: 0.001 grams (approx.). - Polarity: Color band denotes cathode end. - Terminals: Gold plated, solderable per MIL-STD-750, method 2026. - Case: 0402C/SOD-923F standard package, molded plastic. 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.022(0.55) 0.018(0.45) 0.001(0.02) Max. 0.022(0.55) 0.018(0.45) 0.026(0.65) BSC. 0.012(0.30) 0.008(0.20)
Rating and Characteristic Curves (CDBQC00340-HF) -25°C25°C75°C125°C 25°C 75°C 125°C -25°C Capacitance Between Terminals, (PF) Reverse Voltage, (V) Forward Current, (A) Forward Voltage, (V) Fig.1 - Forward Characteristics Reverse Current, (A) Reverse Voltage, (V) Fig.2 - Reverse Characteristics Ambient Temperature, (°C) Average Forward Current, (%) Fig.4 - Current Derating CurveFig.3 - Capacitance Between Terminals Characteristics Mounting on glass epoxy PCBs f = 1 MHz Ta = 25°C SMD Schottky Barrier Diode Page 2 REV:A Comchip Technology CO., LTD. QW-G1133 Company reserves the right to improve product design , functions and reliability without notice. 0 25 25 750 100 125 150 120 100 0 5 10 15 20 25 30 0.1 0 5 10 15 20 25 30 35 40 10n 100n 10µ 100µ 10µ 100µ 10m 100m
SMD Schottky Barrier Diode Page 3 REV:A Comchip Technology CO., LTD. QW-G1133 Company reserves the right to improve product design , functions and reliability without notice. Reel Taping Specification Trailer Device Leader 400mm (min)160mm (min) Direction of Feed o 120 DD1D2 Index hole A B C d E F P T W 0402C (SOD-923F) SYMBOL (mm) (inch) E F P P0 P1 T W W1 - 0.05 12.00 + 0.50 - 0.00 - 0.002 0.472 + 0.020 - 0.000 0402C (SOD-923F) SYMBOL (mm) (inch) A B C d D D1 D2 - 0.00
SMD Schottky Barrier Diode Page 4 REV:A Comchip Technology CO., LTD. QW-G1133 Company reserves the right to improve product design , functions and reliability without notice. Standard Packaging Case Type 5,000 REEL ( pcs ) Reel Size (inch) REEL PACK 0402C/SOD-923F Suggested P.C.B. PAD Layout SIZE (inch) 0.028 (mm) 0.70 0.40 0.60 0.016 0.024 0402C/SOD-923F 1.10 0.043 E 0.30 0.012 A B C D A C B E D