CDBMH120-G COMCHIP | Alldatasheet

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Technical content

Features

-Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. -Low profile surface mounted application in order to optimize board space. -Low power loss, high efficiency. -High current capability, low forward voltage drop. -High surge capability. -Guardring for overvoltage protection. -Ultra high-speed switching. -Silicon epitaxial planar chip, metal silicon junction. -Lead-free parts meet environmental standards of MIL-STD-19500 /228 Mechanical data Case: SOD-123T/ Mini SMA. Molded plastic.- -Terminals: Plated terminals, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band.- -Weight: 0.018 gram(approx.). Mounting Position: Any- -Heat Sink bottom. Maximum Ratings (at TA=25°C unless otherwise noted)

REV:A Comchip Technology CO., LTD. Rating and Characteristic Curves (CDBMH120-G Thru. CDBMH1150-G) Fig.2 - Typical Forward Characteristics Instantaneous Forward Current (A) Forward Voltage, (V) 0.1 Fig.5 - Typical Reverse Characteristics Reverse Leakage Current (mA) Percent of Rated Peak Reverse Voltage, (%) 0 120 200 Fig.4 - Typical Junction Capacitance Junction Capacitance (pF) Reverse Voltage, (V) 150 350 0.01 1 0.01 100 1.5 100 Fig.1- Typical Current Derating Curve Average Forward Current, (A) 0.1 0.01 100 0.1 0.3 0.9 1.1 200 300 40 80 160 O TJ=75 C O TJ=25 C 0.5 0.1 10 100 250 Fig.3 - Maximum Non-repetitive Forward Surge Current Peak Forward Surge Current, (A) Number of Cycles at 60Hz 3300 1 10 100 O TJ=25 C 8.3ms single half sine wave, JEDEC method SMD Schottky Barrier Rectifiers f=1MHz Applied 4VDC reverse voltage TJ=25°C Pulse Width 300US 1% Duty Cycle 0.7 1.3 Ambient Temperature, (°C) 0.6 0.8 0 100 175 0.2 1.2 0.4 25 50 75 150125 1.0 CDBMH120-G~CDBMH140-G CDBMH150-G~CDBMH1150-G CDBMH180-G~CDBMH1150-G CDBMH150-G~CDBMH160-GCDBMH120-G~CDBMH140-G

REV:A Comchip Technology CO., LTD. SMD Schottky Barrier Rectifiers QW-BB038 B C d D D2D1 Mini-SMA/SOD-123T SYMBOL A (mm) (inch) 2.440 MIN. 4.00 ± 0.10 178 ± 2.00 SYMBOL (mm) E F P P0 P1 W W1 1.75 ± 0.10 0.069 ± 0.004 3.50 ± 0.10 0.138 ± 0.004 Mini-SMA/SOD-123T 1.90 ± 0.10 0.075 ± 0.04 3.90 ± 0.10 0.153 ± 0.04 1.68 ± 0.10 0.066 ± 0.04 0.23 ± 0.10 0.009 ± 0.004 T Reel Taping Specification o 120 Trailer Device Leader 10 pitches (min)10 pitches (min) D1 D2 Direction of Feed Index hole d E F B W P A T C D

E C E D CDBMH120-G XX Page 4 REV:A Comchip Technology CO., LTD. SMD Schottky Barrier Rectifiers QW-BB038 CDBMH140-G CDBMH160-G CDBMH180-G SIZE (inch) 0.040 (mm) 1.00 1.00 1.70 0.040 0.067 0.50 0.020 E 1.50 0.060 B C D A Mini-SMA/SOD-123T CDBMH150-G 15 CDBMH130-G 13 G B F I H A 1.10 0.90 0.044 0.035 0.85 0.033 I 0.60 0.024 F G H CDBMH1100-G 10 xx / xxx = Product type marking code Pinning information Pin Simplified outline Symbol 1 2 PIN 1 Cathode PIN 2 Anode 21 CDBMH1150-G 115 Standard Packaging Case Type 2,500 REEL ( pcs ) Reel Size (inch) REEL PACK Mini-SMA /SOD-123T