CDBH3-00340-G COMCHIP | Alldatasheet

Document overview

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Technical content

Features

-Designed for mounting on small surface. -High speed switching application, circuit protection. -Low turn-on voltage Mechanical data -Case: SOT-523, molded plastic. -Terminals: Solder plated, solderable per MIL- STD-750, method 208. -Approx. weight: 0.002 grams. Equivalent circuit: 1 2 SOT-523 0.067(1.70) 0.059(1.50) 0.033(0.85) 0.030(0.75) 0.043(1.10) 0.035(0.90) 1 2 0.008(0.20) 0.004(0.10) 0.069(1.75) 0.057(1.45) 0.004(0.10)min. 0.004(0.10)max. 0.031(0.80) 0.024(0.60) 0.012(0.30) 0.006(0.15) Dimensions in inched and (millimeters) QW-BA009 Page 1 Rev.A SymbolParameter Conditions Min Max Unit Repetitive peak reverse voltage Reverse voltage Average forward current Forward current, surge peak Power dissipation Storage temperature Max. junction temperature 8.3ms single half sine-wave superimposed on rated load (JEDEC method) VRRM VR IO IFSM PD TSTG TJ V -40 150 +125 +125 V V mA mA mW O C O C Typ. V 200 SymbolParameter Conditions Min Max Unit Forward voltage Reverse current Capacitance between terminals IF=1mA VR=10V f=1MHz, VR=1V VF IR CT V 0.37 V μA pF Typ. V 1.5 Maximum Ratings (at Ta=25°C unless otherwise noted) Electrical Characteristics (at Ta=25°C unless otherwise noted)

Small Signal Schottky Diodes QW-BA009 Page 2 Rev.A RATING AND CHARACTERISTIC CURVES (CDBH3-00340C-G) Fig.1 - Forward Characteristics Forward Voltage (V) Forward Current (A) 10μ 100μ 10m 100m O 125 C O 75 C O 25 C O -25 C Fig.2 - Reverse Characteristics Reverse Voltage (V) Reverse Current (A) 0 5 10 15 25 30 35 40 10n 100n 10μ 100μ O 125 C O 75 C O 25 C O -25 C Fig.3 - Capacitance Between Terminals Characteristics Reverse Voltage (V) Capacitance Between Terminals (pF) 0 5 10 15 20 25 30 0.1 f=1MHzO TA=25 C Fig.4 - Power Derating Curve Ambient Temperature (°C) IO Current (%) 0 25 50 75 100 125 150 120 100 Mounting on glass epoxy PCBs