CDBFR0230L COMCHIP | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
Low forward voltage. Designed for mounting on small surface. Extremely thin / leadless package. Majority carrier conduction. Mechanical data Case: 1005(2512) standard package molded plastic. Terminals: Gold plated, solderable per MIL-STD-750,method 2026. Polarity: Indicated by cathode band. Mounting position: Any Weight: 0.006 gram(approx.). 0.102(2.60) 0.095(2.40) 0.051(1.30) 0.043(1.10) 0.035(0.90) 0.027(0.70) Dimensions in inches and (millimeter) 1005(2512) 0.020(0.50) Typ. 0.040(1.00) Typ. (RoHs Device)
RATING AND CHARACTERISTIC CURVES (CDBFU0230L) SMD Schottky Barrier DiodeSMD Schottky Barrier Diode REV:A SMD Diodes Specialist Page 2QW-A1067 0.2 0.40 100 0.5 0.8 10n 10u 100n 0 10 20 25 30 100 0 25 50 75 100 125 1000 0.60.30.1 0.7 0 1510 20 100 5 25 30 100u 155 Capacitance between terminals (PF) Reverse voltage (V) Forward current (mA ) Forward voltage (V) Fig. 1 - Forward characteristics Reverse voltage (V) Fig. 2 - Reverse characteristics O Ambient temperature ( C) Fig.4 - Current derating curveFig.3 - Capacitance between terminals characteristics Reverse current ( A )Average forward current(%)f = 1 MHz Ta = 25 C O -25 CO CO 7C5 O C O 25 C O 75 C O -25 C