CD54HC405 TI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 26

Technical content

Features

  • Low “On” Resistance -7 0Ω Typical (VCC - VEE = 4.5V) -4 0Ω Typical (VCC - VEE = 9V)
  • Low Crosstalk between Switches
  • Fast Switching and Propagation Speeds
  • “Break-Before-Make” Switching
  • Wide Operating Temperature Range . . -55 oC to 125oC
  • CD54HC/CD74HC Types - High Noise Immunity . . . N IL = 30%, NIH = 30% of VCC , VCC = 5V
  • CD54HCT/CD74HCT Types - Direct LSTTL Input Logic Compatibility . . . V IL = 0.8V Max, VIH = 2V Min

Description

These devices are digitally controlled analog switches which utilize silicon gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits. These analog multiplexers/demultiplexers control analog voltages that may vary across the voltage supply range (i.e. V CC to VEE ). They are bidirectional switches thus allowing any analog input to be used as an output and vice-versa. The switches have low “on” resistance and low “off” leak- ages. In addition, all three devices have an enable control which, when high, disables all switches to their “off” state.

Ordering Information

TEMP. RANGE (oC) PACKAGE CD54HC4051F3A -55 to 125 16 Ld CERDIP CD54HC4052F3A -55 to 125 16 Ld CERDIP CD54HC4053F3A -55 to 125 16 Ld CERDIP CD54HCT4051F3A -55 to 125 16 Ld CERDIP CD74HC4051E -55 to 125 16 Ld PDIP CD74HC4051M -55 to 125 16 Ld SOIC CD74HC4051MT -55 to 125 16 Ld SOIC CD74HC4051M96 -55 to 125 16 Ld SOIC CD74HC4051NSR -55 to 125 16 Ld SOP CD74HC4051PWR -55 to 125 16 Ld TSSOP CD74HC4051PWT -55 to 125 16 Ld TSSOP CD74HC4052E -55 to 125 16 Ld PDIP CD74HC4052M -55 to 125 16 Ld SOIC CD74HC4052MT -55 to 125 16 Ld SOIC CD74HC4052M96 -55 to 125 16 Ld SOIC CD74HC4052NSR -55 to 125 16 Ld SOP CD74HC4052PW -55 to 125 16 Ld TSSOP CD74HC4052PWR -55 to 125 16 Ld TSSOP CD74HC4052PWT -55 to 125 16 Ld TSSOP CD74HC4053E -55 to 125 16 Ld PDIP CD74HC4053M -55 to 125 16 Ld SOIC CD74HC4053MT -55 to 125 16 Ld SOIC CD74HC4053M96 -55 to 125 16 Ld SOIC CD74HC4053NSR -55 to 125 16 Ld SOP CD74HC4053PW -55 to 125 16 Ld TSSOP CD74HC4053PWR -55 to 125 16 Ld TSSOP CD74HC4053PWT -55 to 125 16 Ld TSSOP CD74HCT4051E -55 to 125 16 Ld PDIP CD74HCT4051M -55 to 125 16 Ld SOIC CD74HCT4051MT -55 to 125 16 Ld SOIC CD74HCT4051M96 -55 to 125 16 Ld SOIC CD74HCT4052E -55 to 125 16 Ld PDIP CD74HCT4052M -55 to 125 16 Ld SOIC CD74HCT4052MT -55 to 125 16 Ld SOIC CD74HCT4052M96 -55 to 125 16 Ld SOIC CD74HCT4053E -55 to 125 16 Ld PDIP CD74HCT4053M -55 to 125 16 Ld SOIC CD74HCT4053MT -55 to 125 16 Ld SOIC CD74HCT4053M96 -55 to 125 16 Ld SOIC CD74HCT4053PWR -55 to 125 16 Ld TSSOP CD74HCT4053PWT -55 to 125 16 Ld TSSOP NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. TEMP. RANGE (oC) PACKAGE CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated CD54/74HC4051, CD54/74HCT4051, CD54/74HC4052, CD74HCT4052, CD54/74HC4053, CD74HCT4053 High-Speed CMOS Logic Analog Multiplexers/Demultiplexers [ /Title (CD54 H C405 C D74 H C405 C D74 H CT40 51, C D74 H C405 November 1997 - Revised July 2004

CD54HC4051, CD54HCT4051 (CERDIP) CD74HC4051 (PDIP, SOIC, SOP, TSSOP) CD74HCT4051 (PDIP, SOIC) TOP VIEW CD54HC4052 (CERDIP) CD74HC4052 (PDIP, SOIC, SOP, TSSOP) CD74HCT4052 (PDIP, SOIC) TOP VIEW CD54HC4053 (CERDIP) CD74HC4053 (PDIP, SOIC, SOP, TSSOP) CD74HCT4053 (PDIP, SOIC, TSSOP) TOP VIEW A E GND VEE VCC CHANNEL IN/OUT CHANNEL IN/OUT CHANNEL IN/OUT COM OUT/IN ADDRESS SELECT B N E GND VEE VCC A N A2 CHANNEL IN/OUT CHANNEL IN/OUT CHANNEL IN/OUT COM OUT/IN CHANNEL IN/OUT COM OUT/IN C N E GND VEE VCC A N B N CHANNEL IN/OUT IN/OUT COM OUT/IN CHANNEL IN/OUT COM OUT/IN COM OUT/IN ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Functional Diagram of HC/HCT4051 TG TG TG TG TG TG TG A COMMON OUT/IN BINARY TO

1 OF 8

A 7 A 6 A 5 A 4 A 3 A 2 A 1 A 0 CHANNEL IN/OUT TG TRUTH TABLE HC/HCT4051 INPUT STATES “ON” CHANNELSENABLE S 2 S1 S0 L LLL A 0 LL L H A 1 LL H L A 2 LL H H A 3 LH L L A 4 LH L H A 5 LH H L A 6 L HHH A 7 H X X X None X = Don’t care ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Functional Diagram of ’HC4052, CD74HCT4052 TG TG TG TG TG TG TG TG

13 COMMON A

1 OF 4

3 COMMON B

’HC4052, CD74HCT4052 INPUT STATES “ON” CHANNELSENABLE S 1 S0 L L L A0, B0 L L H A1, B1 L H L A2. B2 L H H A3, B3 H X X None X = Don’t care ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Functional Diagram of ’HC4053, CD74HCT4053 TG TG TG TG TG TG GND V EE VCC C COMMON OUT/IN4 B COMMON OUT/IN A COMMON OUT/IN LOGIC LEVEL CONVERSION BINARY TO

1 OF 2

’HC4053, CD74HCT4053 INPUT STATES “ON” CHANNELSENABLE S 0 S1 S2 L L L L C0, B0, A0 L H L L C0, B0, A1 L L H L C0, B1, A0 L H H L C0, B1, A1 L L L H C1, B0, A0 L H L H C1, B0, A1 L L H H C1, B1, A0 L H H H C1, B1, A1 H X X X None X = Don’t care ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

  1. The package thermal impedance is calculated in accordance with JESD 51-7.

of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

  1. All voltages referenced to GND unless otherwise specified..
  2. In certain applications, the external load resistor current may include both VCC and signal line components. To avoid drawing VCC current

terminal 3 on the HC/HCT4051; terminals 3 and 13 on the HC/HCT4052; terminals 4, 14 and 15 on the HC/HCT4053. FIGURE 1. FIGURE 2.

TEST CONDITIONS AMBIENT TEMPERATURE, T A UNITS VIS (V) VI (V) VEE (V) VCC (V) 25oC -40 oC - 85oC -55 oC - 125oC MIN TYP MAX MIN MAX MIN MAX HC TYPES High Level Input Voltage, V IH 4.5 3.15 - - 3.15 - 3.15 0 V Low Level Input Voltage, VIL On Resistance, rON IO = 1mA, (Figure 11) VCC or VEE VIL or VIH 0 4.5 - 70 160 - 200 - 240 Ω 0 6 - 60 140 - 175 - 210 Ω -4.5 4.5 - 40 120 - 150 - 180 Ω VCC to VEE 0 4.5 - 90 180 - 225 - 270 Ω 0 6 - 80 160 - 200 - 240 Ω -4.5 4.5 - 45 130 - 162 - 195 Ω Maximum On Resistance Between any Two Channels,∆r ON Switch On/Off Leakage Current, IIZ For Switch Off: When V IS=V CC , VOS = VEE ; When V IS=V EE , VOS = VCC For Switch On: All Applicable Combinations of V IS and VOS Voltage Levels VIL or VIH 1 and 2 Channels 0 6 - - ±0.1 - ±1- ±1 µA 4 Channels 0 6 - - ±0.1 - ±1- ±1 µA 8 Channels 0 6 - - ±0.2 - ±2- ±2 µA Control Input Leakage Current, IIL VCC or GND Quiescent Device Current, ICC IO = 0 When V IS=V EE , VOS = VCC VCC or GND 0 6 - - 8 - 80 - 160 µA When V IS=V CC , VOS = VEE -5 5 - - 16 - 160 - 320 µA ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

High Level Input Voltage, VIH 4.5 to 5.5 2--2-2-V Low Level Input Voltage, VIL 4.5 to 5.5 On Resistance, rON IO = 1mA, (Figure 15) VCC or VEE VIL or VIH 0 4.5 - 70 160 - 200 - 240 Ω -4.5 4.5 - 40 120 - 150 - 180 Ω VCC to VEE 0 4.5 - 90 180 - 225 - 270 Ω -4.5 4.5 - 45 130 - 162 - 195 Ω Maximum On Resistance Between any Two Channels,∆r ON Switch On/Off Leakage Current, IIZ For Switch Off: When V IS=V CC , VOS = VEE ; When V IS=V EE , VOS = VCC For Switch On: All Applicable Combinations of V IS and VOS Voltage Levels VIL or VIH 1 and 2 Channels 0 6 - - ±0.1 - ±1- ±1 µA 4 Channels 0 6 - - ±0.1 - ±1- ±1 µA 8 Channels 0 6 - - ±0.2 - ±2- ±2 µA Control Input Leakage Current, IIL Quiescent Device Current, ICC IO = 0 When V IS=V EE , VOS = VCC VCC or GND 0 5.5 - - 8 - 80 - 160 µA When V IS=V CC , VOS = VEE -4.5 5.5 - - 16 - 160 - 320 µA Additional Quiescent Device Current Per Input Pin: 1 Unit Load ∆ICC (Note 5) V CC - 2.1 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTES: 4. Any voltage between VCC and GND. PARAMETER TEST CONDITIONS AMBIENT TEMPERATURE, T A UNITS VIS (V) VI (V) VEE (V) VCC (V) 25oC -40 oC - 85oC -55 oC - 125oC MIN TYP MAX MIN MAX MIN MAX HCT Input Loading Table TYPE INPUT UNIT LOADS (NOTE) 4051, 4053 All 0.5 4052 All 0.4 NOTE: Unit load is∆I CC limit specified in DC Specifications table, e.g., 360mA max. at 25oC. ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Switching SpecificationsVCC = 5V, TA = 25oC, Input tr, tr = 6ns PARAMETER C L (pF) TYPICAL UNITS 4051 4052 4053 HC HCT HC HCT HC HCT Propagation Delay Switch IN to OUT, tPHL , tPLH 1 5 444444 n s Switch Turn-Off (S orE), tPHZ ,tPLZ 15 19 19 21 21 18 18 ns Switch Turn-On (S orE), tPZH , tPZL 15 19 23 27 29 18 20 ns Power Dissipation Capacitance, CPD (Note 6) - 50 52 74 76 38 42 pF NOTE: 6. CPD is used to determine the dynamic power consumption, per package. PD = CPD VCC 2 fI +∑ (CL + CS) VCC 2 fO fO = output frequency fI = input frequency C L = output load capacitance C S = switch capacitance VCC = supply voltage Switching SpecificationsC L = 50pF , Input tr, tr = 6ns PARAMETER VEE (V) VCC (V) AMBIENT TEMPERATURE, T A UNITS 25oC -40 oC - 85oC -55 oC - 125oC HC HCT HC HCT HC HCT MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX Propagation Delay, Switch In to Out, tPLH , tPHL 0 4.5 - 12 - 12 - 15 - 15 - 18 - 18 ns -4.5 4.5 - 8 - 8 - 10 - 10 - 12 - 12 ns Maximum Switch Turn “Off” Delay from S or E to Switch Output t PHZ , tPLZ 4051 0 2 - 225 - - - 280 - - - 340 - - ns 0 4.5 - 45 - 45 - 56 - 56 - 68 - 68 ns -4.5 4.5 - 32 - 32 - 40 - 40 - 48 - 48 ns 4052 0 2 - 250 - - - 315 - - - 375 - - ns 0 4.5 - 50 - 50 - 63 - 63 - 75 - 75 ns -4.5 4.5 - 38 - 38 - 48 - 48 - 57 - 57 ns 4053 0 2 - 210 - - - 265 - - - 315 - - ns 0 4.5 - 42 - 44 - 53 - 55 - 63 - 66 ns -4.5 4.5 - 29 - 31 - 36 - 39 - 44 - 47 ns ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Turn “On” Delay from S or E to Switch Output t PZL , tPZH 4051 0 2 - 225 - - - 280 - - - 340 - - ns 0 4.5 - 45 - 55 - 56 - 69 - 68 - 83 ns -4.5 4.5 - 32 - 39 - 40 - 49 - 48 - 59 ns 4052 0 2 - 325 - - - 405 - - - 490 - - ns 0 4.5 - 65 - 70 - 81 - 68 - 98 - 105 ns -4.5 4.5 - 46 - 48 - 58 - 60 - 69 - 72 ns 4053 0 2 - 220 - - - 275 - - - 330 - - ns 0 4.5 - 44 - 48 - 55 - 60 - 66 - 72 ns -4.5 4.5 - 31 - 34 - 39 - 43 - 47 - 51 ns Input (Control) Capacitance, C I - - - 10 - 10 - 10 - 10 - 10 - 10 pF Analog Channel SpecificationsTypical Values at TA = 25oC PARAMETER TEST CONDITIONS HC/HCT TYPES VEE (V) VCC (V) HC/ HCT UNITS Switch Input Capacitance, CI All - - 5 pF Common Output Capacitance, CCOM 4051 - - 25 pF 4052 - - 12 pF 4053 - - 8 pF Minimum Switch Frequency Response at -3dB, f MAX (Figures 12, 14, 16) See Figure 3 (Notes 7, 8) 4051 -2.25 2.25

145 MHz

-4.5 4.5

180 MHz

Switching SpecificationsC L = 50pF , Input tr, tr = 6ns (Continued) PARAMETER VEE (V) VCC (V) AMBIENT TEMPERATURE, T A UNITS 25oC -40 oC - 85oC -55 oC - 125oC HC HCT HC HCT HC HCT MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

Crosstalk Between any Two Switches (Note 10) See Figure 4 (Notes 8, 9) 4051 -2.25 2.25 N/A dB 4052 (TBE) dB 4053 (TBE) dB 4051 -4.5 4.5 N/A dB 4052 (TBE) dB 4053 (TBE) dB Sinewave Distortion See Figure 5 All -2.25 2.25 0.035 % All -4.5 4.5 0.018 % E or S to Switch Feedthrough Noise See Figure 6 (Notes 8, 9) 4051 -2.25 2.25 (TBE) mV 4052 mV 4053 mV 4051 -4.5 4.5 (TBE) mV 4052 mV 4053 mV Switch “OFF” Signal Feedthrough (Figures 13, 15, 17) See Figure 7 (Notes 8, 9) 4051 -2.25 2.25 -73 dB 4052 -65 dB 4053 -64 dB 4051 -4.5 4.5 -75 dB 4052 -67 dB 4053 -66 dB NOTES: 7. Adjust input voltage to obtain 0dBm at V OS for fIN = 1MHz. 8. VIS is centered at (VCC - VEE )/2. 9. Adjust input for 0dBm. 10. Not applicable for HC/HCT4051. Analog Channel SpecificationsTypical Values at TA = 25oC PARAMETER TEST CONDITIONS HC/HCT TYPES VEE (V) VCC (V) HC/ HCT UNITS ’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053

FIGURE 16. CHANNEL ON BANDWIDTH (HC/HCT4053) FIGURE 17. CHANNEL OFF FEEDTHROUGH (HC/HCT4053)

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-8775401EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 5962-8855601EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 5962-9065401MEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4051F ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4051F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4052F ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4052F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4053F ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC4053F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HCT4051F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD74HC4051E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4051EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4051M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4051PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4052EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4052M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 1

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) CD74HC4052ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4052SM OBSOLETE SSOP DB 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4053EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC4053M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 2

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) CD74HC4053PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4053PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4051EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4051M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4051MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4052EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4052M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4052MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4053EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT4053M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 3

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) CD74HCT4053ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4053PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 4

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2005, Texas Instruments Incorporated