CD4148WTP DGNJDZ | Alldatasheet

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Technical content

FEATURES

/square6 Silicon epitaxial planar diode /square6 SMD chip pattern, available in various dimension included 1206 & 0805 /square6 Leadfree and RoHS compliance components /square6 For small signal switching and operating ambient temperature less than 55oC and voltage withstand less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage location. CD4148WTN is suitable for those application MECHANICAL CHARACTERISTICS /square6 Size: 0603 /square6 Weight: approx. 4mg /square6 Marking: Cathode terminal DIMENSIONS Dimension/mm 0603 L 1.55±0.1 W 0.80±0.1 T 0.65±0.1 C 0.35±0.1 THERMAL CHARACTERISTICS1) Parameter at Tamb=25 oC1) Symbol Value Unit 200 mW Forward Power Dissipation Power derating above 25oC Ptot 1.6 mW/ oC Junction Temperature T j 150 oC Thermal Resistance Junction to Ambient air RθJA 375 o C/W Operating& Storage Temperature range Tstg -55 to 150 oC 1) Valid provided that electrodes are kept at ambient temperature. CD4148WTP

MAXIMUM RATING1) Parameter at Tamb=25 oC1) Symbol Value Unit Repetitive Peak Reverse Voltage VRRM 75 V Average rectified current sin half wave rectification with resistive load IF(AV) 100 mA Repetitive Peak Forward Current at Tamb=25°C IFRM 200 mA Non-Repetitive Surge Forward Current at t<1s and Tj=25 oC 400 mA at t≦8.3ms and Tj=25 oC IFSM 800 mA 1) Valid provided that electrodes are kept at ambient temperature.

ELECTRICAL CHARACTERISTICS

Parameter at Tamb=25 oC1) Symbol Value Unit Forward Voltage at IF=10mA 1.0 MAX V at I F=100mA VF

1.25 MAX V

Leakage Current at VR=20V 0.025 MAX uA Leakage Current at VR=75V IR

5 MAX uA

Capacitance at VR=0V, f=1MHz C tot 4 MAX pF Reverse Recovery Time at IF =IR=10mA,RL= 100 Ω trr 4 MAX ns 1) Valid provided that electrodes are kept at ambient temperature. TYPICAL CHARACTERISTICS Figure 1. Forward Characteristic Figure 2. Power De-rating

Figure 3. Forward Current De-rating Figure 4. Reverse Voltage De-rating

APPLICATIONS

/square6 Function: suit for small signal switching application /square6 Typical Application circuit: /square6 Typical Product field: General application except high reverse voltage location /square6 Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2) Recommended Profile Condition Sn-Pb Soldering Leadfree Soldering Wave Soldering Ramp-up rate (from pre-heat stage) <3oC/s <3 oC/s △T<150oC Pre-heat Temperature & Time 100-150 oC 60-120s 150-200 oC 60-120s 100-150 oC 60-120s Soldering Temperature & Time 183 oC 60-150s 217 oC 60-150s 260±5oC 5±2s Peak Temperature 230±5 oC <260 oC 245±5oC <260 oC 260±5oC Time within 5oC of peak temperature 10-20s 20-30s - Ramp-down rate <6 oC/s <6 oC/s <6 oC/s Time 25oC to peak temperature <6min <8min - Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body

Recommended Soldering Profile Fig1: Reflow soldering profile for lead-free solder (SnAgCu) Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260 oC max for 10s, and the soldering cycles with max 3 times, referring to IEC-60068-2-58 t/s T/oC t/s T/oC

/square6 Recommended Soldering Footprint: ■ Reflow/Wave Soldering Dimension/ mm Product Size A B C D /square6 Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condition must be in an ambient temperature of <40 oC and ambient humidity of <75%RH, and free from chemical. ENVIRONMENTAL CHARACTERISTICS Hazardous Substance or Element/ppm Pb Cd Hg Cr 6+ PBB PBDE Product <1000 <100 <1000 <1000 <1000 <1000 Halogen Substance/ ppm F Cl Br I Total Product <900 <900 <900 <900 <1500 PACKING METHOD Quality/Reel Reel Size Tape Product 5,000pcs 7” Paper DISCLAIMERS These products are not designed for use in applications where any failure or malfunction may resulted in personal injury, death or severe property or environmental damage such as medical, military, aircraft, space or life support equipments.