CD4148WSN DGNJDZ | Alldatasheet
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Technical content
FEATURES
Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 Leadfree and RoHS compliance components MECHANICAL CHARACTERISTICS Size: 0805 Weight: approx. 6mg Marking: Cathode terminal DIMENSIONS Dimension/mm 0805 L 2.0±0.2 W 1.25±0.2 T 0.85±0.1 C 0.45±0.2 THERMAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Value Unit 200 mW Forward Power Dissipation Power derating above 25oC Ptot 1.6 mW/ oC Junction Temperature T j 150 oC Thermal Resistance Junction to Ambient air R θJA 375 o C/W Operating& Storage Temperature range T stg -55 to 150 oC 1) Valid provided that components are kept at ambient temperature. CD4148WSN
MAXIMUM RATING1) Parameter at Tamb=25oC1) Symbol Value Unit Repetitive Peak Reverse Voltage V RRM 100 V Average rectified current sin half wave rectification with resistive load IF(AV) 150 mA Repetitive Peak Forward Current at Tamb=25°C IFRM 300 mA N o n - R e p e t i t i v e S u r g e F o r w a r d C u r r e n t at t<1s and Tj=25oC 500 mA at t≦8.3ms and Tj=25oC IFSM 1000 mA 1) Valid provided that components are kept at ambient temperature. ELECTRICAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Value Unit Forward Voltage at IF=10mA 1.0 MAX V a t I F=100mA VF
1.25 MAX V
Leakage Current at VR=20V 0.025 MAX uA Leakage Current at VR=80V IR
0.5 MAX uA
Capacitance at VR=0V, f=1MHz C tot 4 MAX pF Reverse Recovery Time at IF =IR=10mA,RL=100Ω trr 4 MAX ns 1) Valid provided that components are kept at ambient temperature. TYPICAL CHARACTERISTICS F i g u r e 1 . F o r w a r d C h a r a c t e r i s t i c Figure 2. Power De-rating 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC Ptot-Admissible Power Dissipation/ mW
Figure 3. Forward Current De-r a t i n g Figure 4. Reverse Voltage De-rating
APPLICATIONS
Function: Fast switching, better performance on fast ac switching input and high reverse voltage application Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDE C J-STD-020D 4-1&5.2) Recommended Profile Condition Sn-Pb Soldering Leadfree Soldering Wave Soldering Ramp-up rate (from pre-heat stage) <3 oC/s <3 oC/s △T<150oC Pre-heat Temperature & Time 100-150 oC 60-120s 150-200 oC 60-120s 100-150 oC 60-120s Soldering Temperature & Time 183 oC 60-150s 217 oC 60-150s 260±5oC 5±2s Peak Temperature 230±5oC <260oC 245±5oC <260oC 260±5oC Time within 5oC of peak temperature 10-20s 20-30s - Ramp-down rate <6 oC/s <6 oC/s <6 oC/s Time 25oC to peak temperature <6min <8min - Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body Recommended Soldering Profile Fig1: Reflow soldering profile for lead-free solder (SnAgCu) t/s o C
Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260 oC max for 10s, and the soldering cycles with max 3 times, referring to IEC-60068-2-58 Recommended Soldering Footprint: ■ Reflow/Wave Soldering Dimension/ mm Product Size A B C D t/s o C
Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condit ion must be in an ambient temperature of <40 oC and ambient humidity of <75%RH, and free from chemical. ENVIRONMENTAL CHARACTERISTICS Hazardous Substance or Element/ppm Pb Cd Hg Cr 6+ PBB PBDEProduct <1000 <100 <1000 <1000 <1000 <1000 Halogen Substance/ ppm F Cl Br I Total Product <900 <900 <900 <900 <1500 PACKING METHOD Quality/Reel Reel Size Tape Product 5,000pcs 7” Paper DISCLAIMERS These products are not designed for use in applicatio ns where any failure or malfunction may resulted in personal injury, death or severe property or enviro nmental damage such as medical, military, aircraft, space or life support equipments.