CD4148WP SHUNYE | Alldatasheet

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Technical content

FEATURES

Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 0805 & 0603 Leadfree and RoHS compliance components MECHANICAL CHARACTERISTICS Size: 1206 Weight: approx. 10mg Marking: Cathode terminal DIMENSIONS Dimension/mm 1206 L 3.2±0.2 W 1.5±0.2 T 0.85±0.1 C 0.55±0.2 THERMAL CHARACTERISTICS Parameter at T amb =25 o C Symbol Value Unit 400 mW Forward Power Dissipation Power derating above 25 o C P tot 3.2 mW/ o C Junction Temperature T j 150 o C Thermal Resistance Junction to Ambient air R θJA 375 o C/W Operating& Storage Temperature range T stg -55 to 150 o C 1) Valid provided that electrodes are kept at ambient temperature. SMALL SIGNAL SWITCHING DIODE www.shunyegroup.com.cn

=25 o C Symbol Value Unit Repetitive Peak Reverse Voltage V RRM 75 V Average rectified current sin half wave rectification with resistive load I F(AV) 150 mA Repetitive Peak Forward Current at T amb =25°C I FRM 300 mA N o n - R e p e t i t i v e S u r g e F o r w a r d C u r r e n t at t<1s and T j =25 o C 500 mA at t≦8.3ms and T j =25 o C I FSM 1000 mA 1) Valid provided that electrodes are kept at ambient temperature.

ELECTRICAL CHARACTERISTICS

=25 o C Symbol Value Unit Forward Voltage at I F =10mA 1.0 MAX V a t I F =100mA V F 1.25 MAX V Leakage Current at V R =20V 0.025 MAX uA Leakage Current at V R =75V I R MAX uA Capacitance at V R =0V, f=1MHz C tot MAX pF Reverse Recovery Time at I F R =10mA,R L 100Ω t rr MAX ns 1) Valid provided that electrodes are kept at ambient temperature. TYPICAL CHARACTERISTICS F i g u r e 1 . F o r w a r d C h a r a c t e r i s t i c Figure 2. Power De-rating 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC Ptot-Admissible Power Dissipation/ mW www.shunyegroup.com.cn

Figure 3. Forward Current De-r a t i n g Figure 4. Reverse Voltage De-rating

APPLICATIONS

„ Function: Fast switching, suit for small signal switching application „ Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDE C J-STD-020D 4-1&5.2) Recommended Profile Condition Sn-Pb Soldering Leadfree Soldering Wave Soldering Ramp-up rate (from pre-heat stage) <3 o C/s <3 o C/s T<150 △ o C Pre-heat Temperature & Time 100-150 o C 60-120s 150-200 o C 60-120s 100-150 o C 60-120s Soldering Temperature & Time 183 o C 60-150s 217 o C 60-150s 260±5 o C 5±2s Peak Temperature 230±5 o C <260 o C 245±5 o C <260 o C 260±5 o C Time within 5 o C of peak temperature 10-20s 20-30s - Ramp-down rate <6 o C/s <6 o C/s <6 o C/s Time 25 o C to peak temperature <6min <8min - Manual Soldering: Approx. 350 o C for 3s, avoid solder iron tip direct touch the components body Recommended Soldering Profile Fig1: Reflow soldering profile for lead-free solder (SnAgCu) t/s o C www.shunyegroup.com.cn

Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260 o C max for 10s, and the soldering cycles with max 3 times, referring to IEC-60068-2-58 „ Recommended Soldering Footprint: Reflow/Wave Soldering Dimension/ mm Product Size A B C D 1206 t/s o C www.shunyegroup.com.cn

„ Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condit ion must be in an ambient temperature of <40 o C and ambient humidity of <75%RH, and free from chemical. ENVIRONMENTAL CHARACTERISTICS Hazardous Substance or Element/ppm Pb Cd Hg Cr PBB PBDE Product <1000 <100 <1000 <1000 <1000 <1000 Halogen Substance/ ppm F Cl Br I Total Product <900 <900 <900 <900 <1500 PACKING METHOD Quality/Reel Reel Size Tape Product 5,000pcs 7” Paper www.shunyegroup.com.cn