CD4001BM

CD4025B TI | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 23

Technical content

Data sheet acquired from Harris Semiconductor SCHS015C – Revised August 2003 The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright © 2003, Texas Instruments Incorporated

www.ti.com 29-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 7704403CA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7704403CA CD4002BF3A CD4001BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4001BE CD4001BE.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4001BE CD4001BEE4 Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4001BE CD4001BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4001BF CD4001BF.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4001BF CD4001BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4001BF3A CD4001BF3A.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4001BF3A CD4001BM Active Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BM.A Active Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BM96.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BM96E4 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BM96G4 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001BM CD4001BMT Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4001BM CD4001BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001B CD4001BNSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001B CD4001BNSRG4 Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4001B CD4001BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM001B CD4001BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM001B CD4001BPWR.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM001B CD4002BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4002BE CD4002BE.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4002BE CD4002BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4002BF CD4002BF.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4002BF CD4002BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7704403CA CD4002BF3A CD4002BF3A.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7704403CA CD4002BF3A Addendum-Page 1

www.ti.com 29-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) CD4002BM Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4002BM CD4002BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002BM CD4002BM96.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002BM CD4002BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002B CD4002BNSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4002B CD4002BPW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -55 to 125 CM002B CD4002BPWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM002B CD4002BPWR.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM002B CD4025BE Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4025BE CD4025BE.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4025BE CD4025BEE4 Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -55 to 125 CD4025BE CD4025BF Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4025BF CD4025BF.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4025BF CD4025BF3A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4025BF3A CD4025BF3A.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 CD4025BF3A CD4025BM Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4025BM CD4025BM96 Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM CD4025BM96.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM CD4025BMT Obsolete Production SOIC (D) | 14 - - Call TI Call TI -55 to 125 CD4025BM CD4025BNSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B CD4025BNSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B CD4025BPW Active Production TSSOP (PW) | 14 90 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B CD4025BPW.A Active Production TSSOP (PW) | 14 90 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B CD4025BPWE4 Active Production TSSOP (PW) | 14 90 | TUBE Yes NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B JM38510/05252BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05252BCA JM38510/05252BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05252BCA JM38510/05254BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05254BCA JM38510/05254BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05254BCA Addendum-Page 2

www.ti.com 29-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) M38510/05252BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05252BCA M38510/05254BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 05254BCA (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4001B, CD4001B-MIL, CD4002B, CD4002B-MIL, CD4025B, CD4025B-MIL :

• Catalog : CD4001B , CD4002B , CD4025B Addendum-Page 3

www.ti.com 29-May-2025

• Military : CD4001B-MIL , CD4002B-MIL , CD4025B-MIL NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4001BM96 SOIC D 14 2500 356.0 356.0 35.0 CD4001BNSR SOP NS 14 2000 356.0 356.0 35.0 CD4001BPWR TSSOP PW 14 2000 356.0 356.0 35.0 CD4002BM96 SOIC D 14 2500 356.0 356.0 35.0 CD4002BNSR SOP NS 14 2000 356.0 356.0 35.0 CD4002BPWR TSSOP PW 14 2000 356.0 356.0 35.0 CD4025BM96 SOIC D 14 2500 356.0 356.0 35.0 CD4025BNSR SOP NS 14 2000 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) CD4001BE N PDIP 14 25 506 13.97 11230 4.32 CD4001BE.A N PDIP 14 25 506 13.97 11230 4.32 CD4001BEE4 N PDIP 14 25 506 13.97 11230 4.32 CD4001BM D SOIC 14 50 506.6 8 3940 4.32 CD4001BM.A D SOIC 14 50 506.6 8 3940 4.32 CD4002BE N PDIP 14 25 506 13.97 11230 4.32 CD4002BE N PDIP 14 25 506 13.97 11230 4.32 CD4002BE.A N PDIP 14 25 506 13.97 11230 4.32 CD4002BE.A N PDIP 14 25 506 13.97 11230 4.32 CD4025BE N PDIP 14 25 506 13.97 11230 4.32 CD4025BE N PDIP 14 25 506 13.97 11230 4.32 CD4025BE.A N PDIP 14 25 506 13.97 11230 4.32 CD4025BE.A N PDIP 14 25 506 13.97 11230 4.32 CD4025BEE4 N PDIP 14 25 506 13.97 11230 4.32 CD4025BEE4 N PDIP 14 25 506 13.97 11230 4.32 CD4025BPW PW TSSOP 14 90 530 10.2 3600 3.5 CD4025BPW.A PW TSSOP 14 90 530 10.2 3600 3.5 CD4025BPWE4 PW TSSOP 14 90 530 10.2 3600 3.5 Pack Materials-Page 3

www.ti.com PACKAGE OUTLINE C 12X 0.65 3.9 14X 0.30 0.17 6.6

6.2 TYP

1.2 MAX

0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -12 ) B 4.5 4.3 NOTE 4 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 7 8 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 7 8

www.ti.com PACKAGE OUTLINE C TYP6.2 5.8

1.75 MAX

12X 1.27 14X 0.51 0.31 7.62 TYP0.25 0.13 0 - 8 0.25 0.10 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 8.75 8.55 B NOTE 4 4.0 3.8 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side. 5. Reference JEDEC registration MS-012, variation AB. 1 14

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.800

www.ti.com EXAMPLE BOARD LAYOUT (5.4)

0.07 MAX

0.07 MIN

14X (1.55) 14X (0.6) 12X (1.27) (R0.05) TYP 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 7 8 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.4) 12X (1.27) 14X (0.6) 14X (1.55) 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 7 8 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X

www.ti.com PACKAGE OUTLINE C 14X .008-.014 [0.2-0.36]TYP -150 AT GAGE PLANE -.314 .308 -7.97 7.83 [ ] 14X -.026 .014 -1.65 1.15 [ ] .2 MAX TYP [5.08] .13 MIN TYP [3.3] TYP-.060 .015 -1.52 0.38 [ ] 4X .005 MIN [0.13] 12X .100 [2.54] .015 GAGE PLANE [0.38] A -.785 .754 -19.9419.15 [ ] B -.283 .245 -7.19 6.22 [ ] CDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGE 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. 7 8 PIN 1 ID (OPTIONAL) SCALE 0.900 SEATING PLANE .010 [0.25] C A B

www.ti.com EXAMPLE BOARD LAYOUT ALL AROUND [0.05] MAX .002 .002 MAX [0.05] ALL AROUND SOLDER MASK OPENING METAL (.063) [1.6] (R.002 ) TYP [0.05] 14X ( .039) [1] ( .063) [1.6] 12X (.100 ) [2.54] (.300 ) TYP [7.62] CDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGE 4214771/A 05/2017 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X SEE DETAIL A SEE DETAIL B SYMM SYMM 7 8 DETAIL A SCALE: 15X SOLDER MASK OPENING METAL DETAIL B 13X, SCALE: 15X

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