CD0805-S0180R BOURNS | Alldatasheet

Document overview

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Technical content

Features

■ Lead free as standard ■ RoHS compliant* ■ Leadless ■ High speed

Applications

■ Cellular phones ■ PDAs ■ Desktop PCs and notebooks ■ Digital cameras ■ MP3 players General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop inc reasingly smaller electronic components. Bourns offers small-signal high-speed Switching Diodes for switching digital signal applications, in compact chip package 0805 and 1206 size format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Switching Diodes offer a f orward current of 100 mA or 150 mA, a reverse voltage of 80 V or 75 V and also have a low leakage reverse current option. The diodes are lead- free with Cu/Ni/Au plated terminations and are compatible with lead-free manufacturing processes, conforming to many industry and governm ent regulations on lead-free components. Bourns ® Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes roll away much more difficult. Parameter Symbol CDxxxx-S0180 CDxxxx-S01575 CDxxxx-S0180R Unit Forward Voltage (Max.) V F 1.00 1.00 1.00 V(If = 100 mA) (I f = 50 mA) (I f = 100 mA) Capacitance Between Terminals (Max.) C T 3 pF(f = 100 MHz, Vr = 1 V DC) Reverse Recovery Time (Max.) t rr 4 nS(Vr = 6V, If = 10 mA, RL = 50 Ω) Reverse Current (Max.) I R 0.1 2.5 0.05 µA(Vr = 80 V) (V r = 75 V) (V r = 75 V) Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CDxxxx-S0180 CDxxxx-S01575 CDxxxx-S0180R Unit Repetitive Peak Reverse Voltage V RRM 90 100 90 V Reverse Voltage V R 80 75 80 V Average Forward Current I o 100 150 100 mA Forward Current, Surge Peak I surge 1* 4** 1* A Power Dissipation PD 300 350 300 mW Storage Temperature T STG -55 to +125 °C Junction Temperature T J -55 to +125 °C Absolute Ratings (@ TA = 25 °C Unless Otherwise Noted) * Condition: 8.3 ms single half sine-wave superimposed on rate load (JEDEC method). ** Condition: 1.0 µs single half sine-wave superimposed on rate load (JEDEC method). How To Order CD 0805 - S 01 80 R Common Code Chip Diode Package

  • 0805
  • 1206 Model S = High Speed Switching Average Forward Current (Io) Code 01 = 100 mA 015 = 150 mA (Code x 1000 mA = Average Forward Current) Reverse Voltage (VR) Code 80 = 80 V 75 = 75 V Reverse Current Suffix R = Low Leakage IR (CDxxxx-S0180R) *RoHS COMPLIANT CD0805-xxxx products are currently available, although not recom- mended for new designs. Use CD1005-xxxx products as an alternative.

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Switching Chip Diode Series - 0805 / 1206 Dimension 0805 1206 A 2.00 - 2.20 3.00 - 3.20 B 1.20 - 1.40 1.40 - 1.60 E 0.90 - 1.10 0.90 - 1.10 Product Dimensions Recommended Pad Layout Physical Specifications Typical Part Marking Method 2026 A B E C D A C B MM (INCHES)DIMENSIONS: Dimension 0805 1206 A (Max.) 2.10 3.00 (0.082) (0.118) B (Min.) 1.20 1.60 (0.047) (0.063) C (Min.) 1.20 1.40 (0.047) (0.055) MM (INCHES)DIMENSIONS:

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Switching Chip Diode Series - 0805 / 1206 Rating and Characteristic Curves: CDxxxx-S0180 Derating Curve Capacitance Between Terminals Forward Characteristics Reverse Characteristics 1000 100 Forward Current (mAmps) Forward Voltage (Volts) 125 °C 85 °C -25 °C 25 °C 0.1 100 Reverse Current (nA) 0 1 02 03 04 05 06 07 08 0 Reverse Voltage (Volts) 25 °C 85 °C 125 °C 120 100 0 25 50 75 100 125 150 I0 Current (%) Ambient Temperature (°C) Mounting on glass epoxy PCBs 5.0 4.0 3.0 2.0 1.0 0.0 0246 8 1 0 1 2 1 4 Capacitance Between Terminals (pF) Reverse Voltage (Volts) F = 100 MHz Ta = 25 ° C

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Switching Chip Diode Series - 0805 / 1206 Rating and Characteristic Curves: CDxxxx-S01575 Derating Curve Capacitance Between Terminals Forward Characteristics Reverse Characteristics 1000 100 Forward Current (mAmps) Forward Voltage (Volts) 125 °C 85 °C -25 °C 25 °C 0.1 Reverse Current (nA) 1.0 10.0 100.0 0 1 02 03 04 05 06 0 7 08 0 Reverse Voltage (Volts) 25 °C 85 °C 125 °C 120 100 0 25 50 75 100 125 150 I0 Current (%) Ambient Temperature (°C) Mounting on glass epoxy PCBs 5.0 4.0 3.0 2.0 1.0 0.0 0246 8 1 0 1 2 1 4 Capacitance Between Terminals (pF) Reverse Voltage (Volts) F = 100 MHz Ta = 25 °C

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Switching Chip Diode Series - 0805 / 1206 Rating and Characteristic Curves: CDxxxx-S0180R Derating Curve Capacitance Between Terminals Forward Characteristics Reverse Characteristics 1000 100 Forward Current (mAmps) Forward Voltage (Volts) 125 °C 85 °C -25 °C 25 °C 0.1 Reverse Current (nA) 1.0 10.0 100.0 02 04 0 6 0 8 0 Reverse Voltage (Volts) 25 °C 85 °C 125 °C 120 100 0 25 50 75 100 125 150 I0 Current (%) Ambient Temperature (°C) Mounting on glass epoxy PCBs 5.0 4.0 3.0 2.0 1.0 0.0 0246 8 1 0 1 2 1 4 Capacitance Between Terminals (pF) Reverse Voltage (Volts) F = 100 MHz Ta = 25 °C

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Switching Chip Diode Series - 0805 / 1206 Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). COPYRIGHT© 2003, BOURNS, INC. LITHO IN U.S.A. 10/03 e/IPA0303 P A F E T 120 ° D D1 C Index Hole W B 10 pitches (min.) Direction of Feed 10 pitches (min.) End Trailer Device Leader Start d Item Symbol 0805 1206 Carrier Width A 1.55 ± 0.10 1.70 ± 0.10 Carrier Length B 2.30 ± 0.10 3.40 ± 0.10 Carrier Depth C 1.25 ± 0.10 1.25 ± 0.10 Sprocket Hole d 1.55 ± 0.05 1.55 ± 0.10 Reel Outside Diameter D 178 178 (7.008) (7.008) Reel Inner Diameter D 1 Feed Hole Diameter D 2 Sprocket Hole Position E 1.75 ± 0.10 1.75 ± 0.10 Punch Hole Position F 3.50 ± 0.05 3.50 ± 0.05 Punch Hole Pitch P 4.00 ± 0.10 4.00 ± 0.10 Sprocket Hole Pitch P 0 Embossment Center P 1 Overall Tape Thickness T 0.25 ± 0.05 0.20 ± 0.05 Tape Width W 8.00 ± 0.20 8.00 ± 0.20 Reel Width W 1 Quantity per Reel -- 3,000 3,000 Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. MM (INCHES)DIMENSIONS: REV. 01/06