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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
Features
I RoHS compliant* I Protects 1 or 2 lines I Unidirectional & bidirectional configurations I ESD protection 30 kV max.
Applications
I RS-232, RS-422 & RS-423 data lines I Portable electronics I Wireless bus protection I Control & monitoring systems General Information Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Transient Voltage Suppressor Array diodes for surge and ESD protection applications, in compact chip package SOT23 size format. The Transient Voltage Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V. Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. Parameter Symbol Value Unit Operating Temperature TJ -55 to +150 °C Storage Temperature TSTG -55 to +150 °C Notes: 1. See Pulse Wave Form. 3. Only applies to unidirectional devices. Parameter Symbol CDSOT23- Unit Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- T03 T03C T05 T05C T08 T08C T12 T12C T15 T15C T24 T24C T36 T36C Maximum Clamping Voltage VC @ IP = 1 A Maximum Clamping Voltage @ 8/20 µs VC @ IPP 1 VF 10.9 V @ 43 A 13.5 V @ 42 A 16.9 V @ 34 A 25.9 V @ 21 A 30.0 V @ 17 A 49.0 V @ 12 A 76.8 V @ 9 A V Maximum Leakage Current @ VWM ID 125 20 10 2 1 1 1 µA Typical Cap Undirectional @ 0 V, 1 MHz Cj(SD) 500 350 250 150 100 88 80 pF Typical Cap Bidirectional @ 0 V, 1 MHz Cj(SD) 300 210 150 90 60 63 60 pF ESD Protection: IEC 61000-4-2 Conrtact - Min. Contact - Max. Air - Min. Air - Max. ESD ±30 ±15 ±30 kV Peak Pulse Power (tp = 8/20 µs)
2 PPP 500 W
Forward Voltage @ 100 mA, 300 µs – Square Wave 3 VF 1.5 V *RoHS COMPLIANT
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDSOT23-T03~T36C — TVS Diode Array Series A B C E D MILLIMETERS (INCHES)DIMENSIONS = Dimensions A 0.95 (0.037) B 0.95 (0.037) C 2.00 (0.079) D 0.85 (0.033) E 0.85 (0.033) This is a molded JEDEC SOT-23 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 0.6 g and has a flammability rating of UL 94V-0. Recommended Footprint How To Order CD S0T23 - T 03 C Common Code Chip Diode Package
- S0T23 = S0T23 Package Model T = Transient Voltage Supressor Working Peak Voltage 3 = 3 VRWM (Volts) Suffix C = Bidirectional Diode Product Dimensions 1 2 B CD H L 0 ° TO 8 °I GAUGE PLANE K J SEATING PLANE SEE DETAIL A DETAIL A G E F A Dimensions A 2.80 - 3.00 (0.110 - 0.118) B 0.95 (0.037) C 1.20 - 1.40 (0.047 - 0.055) D 2.10 - 2.49 (0.083 - 0.098) E 1.90 (0.075) F 0.30 - 0.50 (0.012 - 0.019) G 0.89 - 1.17 (0.035 - 0.046) H 0.05 - 0.015 (0.002 - 0.006) I 0.25 (0.010) J 0.46 - 0.64 (0.018 - 0.025) K 0.40 - 0.58 (0.016 - 0.023) L 0.08 - 0.20 (0.003 - 0.008) BSC BSC BSC MILLIMETERS (INCHES)DIMENSIONS =
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDSOT23-T03~T36C — TVS Diode Array Series Performance Graphs Peak Pulse Power vs Pulse Time Pulse Wave Form 100 120 030 252015105 I PP – Peak Pulse Current (% of I PP ) t – Time (µs) Test Waveform Parameters t t = 8 µs t d = 20 µs t t e t t d = t | I PP /2 Power Derating Curve 100 0 25 50 75 100 125 150 % of Rated Power T L – Lead Temperature (°C) Average Power Peak Pulse Power 8/20 µs Block Diagram Unidirectional Bidirectional The device block diagrams below include the pin names and basic electrical connections associated with each channel. 10,000 1,000 100 10.01 10 100 10,0001,000 P PP – Peak Pulse Power (W) t d – Pulse Duration (µs)
500 W, 8/20 µs Waveform
T 120 ° D D1 C 10 pitches (min.) Direction of Feed 10 pitches (min.) End Trailer Device Leader Start PA F EIndex Hole W B d Item Symbol SOT23 Carrier Width A 2.25 ± 0.10 (0.088 ± 0.004) Carrier Length B 2.34 ± 0.10 (0.092 ± 0.004) Carrier Depth C 1.22 ± 0.10 (0.048 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 50.0 (1.969) Min. Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 14.4 (0.567) Max. Quantity per Reel — 3,000 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDSOT23-T03~T36C — TVS Diode Array Series Packaging The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard. DIMENSIONS = MILLIMETERS (INCHES) REV. 01/14 Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com