SN74CBT16245-Q1 TI1 | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

/C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0052/C0053/C0262/C0081/C0049 /C0049/C0054/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083 /C0083/C0087/C0073/C0084/C0067/C0072 SCDS170A − JULY 2004 − REVISED JANUARY 2008 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Qualified for Automotive Applications /C0068Member of Texas Instruments Widebus Family /C0068Standard ’16245-Type Pinout /C00685-Ω Switch Connection Between Two Ports /C0068TTL-Compatible Input Levels /C0068Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II /C0068ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information The SN74CBT16245 device provides 16 bits of high-speed TTL-compatible bus switching in a standard ’16245 device pinout. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device is organized as two 8-bit low-impedance switches with separate output-enable (OE ) inputs. When OE is low, the switch is on, and data can flow from the A port to the B port, or vice versa. When OE is high, the switch is open, and the high-impedance state exists between the two ports.

ORDERING INFORMATION

TA PACKAGE ‡ ORDERABLE PART NUMBER TOP-SIDE MARKING −40°C to 85°C SSOP − DL Tape and reel SN74CBT16245IDLRQ1 § CBT16245I −40°C to 85°C TSSOP − DGG Tape and reel CCBT16245IDGGRQ1 CBT16245I † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. § Product Preview Copyright  2008, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DGG OR DL PACKAGE (TOP VIEW) NC 1B1 1B2 GND 1B3 1B4 V CC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 V CC 2B5 2B6 GND 2B7 2B8 NC 1OE 1A1 1A2 GND 1A3 1A4 V CC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 V CC 2A5 2A6 GND 2A7 2A8 2OE NC − No internal connection Widebus is a trademark of Texas Instruments.

/C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0052/C0053/C0262/C0081/C0049 /C0049/C0054/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083 /C0083/C0087/C0073/C0084/C0067/C0072

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

(each 8-bit bus switch) INPUT OE FUNCTION L A port = B port H Disconnect logic diagram (positive logic) 2A1 2A8 1OE 1B1 1B8 2B1 2B8 1A1 1A8 2OE absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4 5.5 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature −40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

/C0083/C0078/C0055/C0052/C0067/C0066/C0084/C0049/C0054/C0050/C0052/C0053/C0262/C0081/C0049 /C0049/C0054/C0262/C0066/C0073/C0084 /C0070/C0069/C0084 /C0066/C0085/C0083 /C0083/C0087/C0073/C0084/C0067/C0072 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT VIK VCC = 4.5 V, II = −18 mA −1.2 V II VCC = 0, VI = 5.5 V 10 AII VCC = 5.5 V, VI = 5.5 V or GND ±1 µA ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3 µA ∆ICC ‡ Control inputsVCC = 5.5 V, One input at 3.4 V,Other inputs at VCC or GND 2.5 mA C i Control inputsVI = 3 V or 0 3.5 pF C io(OFF) VO = 3 V or 0, OE = VCC 4.5 pF VCC = 4 V, TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20 ron§ VI = 0 II = 64 mA 5 7 Ωron§ VCC = 4.5 V VI = 0 II = 30 mA 5 7 Ω VCC = 4.5 V VI = 2.4 V, II = 15 mA 8 12 † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. § Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 4 V VCC = 5 V ± 0.5 V UNITPARAMETER (INPUT) (OUTPUT) MIN MAX MIN MAX UNIT tpd¶ A or B B or A 0.35 0.25 ns ten OE A or B 6.1 1.2 5.6 ns tdis OE A or B 7.5 3.9 7.7 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) CCBT16245IDGGRQ1 ACTIVE TSSOP DGG 48 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74CBT16245-Q1 :

  • Catalog:SN74CBT16245 NOTE: Qualified Version Definitions:
  • Catalog - TI's standard catalog product PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Addendum-Page 1

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97

48 PINS SHOWN

0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

(TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for

applications

design. Customers are responsible for their products and components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee Solutions www.ti.com/lprf Video Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2008, Texas Instruments Incorporated