CC3551E TI | Alldatasheet
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Technical content
CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU
1 Features
- Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration
- High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption
- Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code execution performance
- Over 1MB embedded SRAM including 128KB TCM for Wi-Fi, BLE, networking, and application data
- Support for additional external PSRAM Peripherals
- Up to 38 I/Os with flexible multiplexing options
- 8 x general-purpose timers and pulse-width modulation (PWM)
- 2 x universal asynchronous receiver-transmitter (UART)
- 2 x Serial Peripheral Interface (SPI)
- 2 x inter-integrated circuit (I2C)
- Inter-IC sound (I2S)
- Pulse density modulation (PDM)
- Secure digital and multimedia card (SD/MMC)
- Secure digital input output (SDIO) 2.0
- Controller area network (CAN) 2.0
- 8-channel, 12-bit analog-to-digital converter (ADC) System Services
- Direct memory access (DMA)
- One-time-programmable memory (OTP)
- Real-time clock (RTC) and watchdog timer (WDT) Radio
- Wi-Fi 6 (802.11ax) – 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP) – Compatible with IEEE 802.11 b/g/n/ax
- Orthogonal frequency-division multiple access (OFDMA)
- Target wake time (TWT)
- Trigger frames
- Basic service set (BSS) color – Integrated PA for a complete WLAN system with up to 20dBm output power at 1 DSSS – Role support: STA, softAP with up to four stations, Wi-Fi direct, multi-role AP + STA – Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise – Wi-Fi TX Power: – • 20dBm at 1 DSSS
- 16dBm at 54 OFDM – Wi-Fi RX Sensitivity:
- –98.6dBm at 1 DSSS
- –77.2dBm at 54 OFDM
- Bluetooth® low energy – Bluetooth low energy 5.4 certified stack – Supports long-range and high-speed PHYs (up to 2Mbps) Security Features
- ARM TrustZone
- Hardware security module supporting all of the following: – ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG – Secure key storage
- Initial secure programming
- Secure boot
- Software IP and cloning protection
- Debug security through JTAG and debug port lock
- OTP with the ability to program root-of-trust public key
- Secure over-the-air (OTA) updates
- Anti-rollback protection Clock Source
- 40.0MHz crystal or external clock
- Internal 32.768kHz low-frequency oscillator, external XTAL, or slow clock options Power Management
- Support for 3.3V or 1.8V I/Os
- Supplies: VPA: 3.3V, VMAIN: 1.8V, VIO: 1.8/3.3V Key Benefits
- Complete software development kit with open- source TCP/IP and TLS stacks
- Operating temperature: –40°C to +105°C
- Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee®)
- Antenna selection capability Package
- Easy to design with 56-pin, 7mm × 7mm quad flat no leaded (QFN) package ADVANCE INFORMATION CC3551E SWRS338 – SEPTEMBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
2 Applications
- Building Automation – Thermostat – HVAC motor control – Wireless security camera – Video Doorbell – Garage door system
- Appliances – Refrigerator and freezer – Oven – Washer and dryer – Residential water heater – Air conditioner indoor unit – Coffee machine – Vacuum robot – Robotic lawn mower
- Grid Infrastructure – Electricity meter – String Inverter – Micro Inverter – Battery energy storage systems – EV charging infrastructure
- Medical – Infusion pump – Electronic hospital bed and bed control – Multiparameter patient monitor – CPAP machine – Telehealth systems – Ultrasound scanner – Ultrasound smart probe – Electric toothbrush
- Retail automation and payment
- Connected peripherals and printers
- Factory automation and control
- Asset tracking
3 Description
The SimpleLink™ Wi-Fi system-on-chip CC35xx family is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC35xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 wireless microcontrollers (MCUs). The CC3550E and CC3551E are the first dual-band devices in this pin-to-pin compatible family.
- CC3550E: 2.4GHz and 5GHz Wi-Fi 6 wireless MCU
- CC3551E: 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 wireless MCU The CC355xE offers the latest standards from Wi-Fi and BLE while maintaining compatibility with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11 ac). These CC355xE are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC355xE is based on proven technology. These devices are an excellent choice to use in cost-sensitive embedded applications with RTOS software. CC355xE brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials. Table 3-1. Device Information PART NUMBER WI-FI 6 2.4GHz AND 5GHz SISO BLUETOOTH LOW ENERGY CC3550E ✔ CC3551E ✔ ✔ CC3551E SWRS338 – SEPTEMBER 2024 www.ti.com
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4 Functional Block Diagram
The figure below shows a functional block diagram of the CC355xE. CC355xE Wi-Fi and Bluetooth Low Energy wireless MCU Enhanced Security Device Identity Wi-Fi & BLE Core Wi-Fi MAC / Modem BLE MAC / Modem 2.4GHz / 5GHz Wi-Fi / BLE RF HSM (HW Security Module) AES (CTR, CCM, GCM) Security Manager Secure Boot Secure Debug Secure OTP SW IP Protection CRC Secure Key Storage ECC, RSASHA 2/3 TRNG Power Management Applications MCU Power Amp Pout = +20dBm Services Host Peripherals Battery Monitor RTC Watchdog DMA Temp Sensor 2 x UART 2 x SPI 2 x I2C Up to 38 IOs 8 x General Purpose Timer / PWM I2S PDM SD/MMC 12-bit ADC SDIO 2.0 3-wire PTA Coexistence Arm® Cortex™ M33 – 160MHz Arm® TrustZone FPU / DSP RAM (App), Cache Fast QSPI+XIP+OTFD SWD / JTAG IO Mux POR 1.8/3.3 V IOs Brownout LF XTAL LF OSC CC3551E only CAN 2.0 Figure 4-1. CC355xE High-Level System Diagram www.ti.com CC3551E SWRS338 – SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: CC3551E ADVANCE INFORMATION
5 Pin Diagram
VDDANA_IN1 GPIO35 RF_BG PA_LDO_OUT 1 5 6 HFXT_N 7 8 9 10 GPIO4 PA_LDO_IN1 DIG_LDO_OUT PA_LDO_IN2 NRESET VPP_IN VDD_MAIN_IN HFXT_P/EXT 11 12 13 14 30313233343536373839404142 NU VDDANA_IN2 GPIO34 GPIO33 GPIO30 GPIO29 VDD_DIG_IN GPIO32 GPIO31 GPIO18 GPIO19 GPIO17 XSPI_CLK XSPI_D0 GPIO26 GPIO27 GPIO28 XSPI_D3 VDD_SF XSPI_D2 XSPI_D1 XSPI_CS GPIO10 GPIO11 GPIO12 GPIO6 GPIO5 GPIO13 GPIO14 GPIO15 VIO1 GPIO16 LOGGER SWCLK SWDIO GPIO3 GPIO36 GPIO37 GPIO2 LFXT_N/GPIO1 SLOW_CLK_IN/LFXT_P/GPIO0 VIO2 RF_A Figure 5-1. CC355xE Pin Diagram CC3551E SWRS338 – SEPTEMBER 2024 www.ti.com
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6 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop systems are listed below.
6.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
6.2 Trademarks
SimpleLink™ is a trademark of Texas Instruments. TI E2E™ is a trademark of Texas Instruments. Bluetooth® is a registered trademark of Bluetooth SIG. Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or elsewhere. TrustZone® is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. is a registered trademark of Bluetooth SIG, Inc.. Zigbee® is a registered trademark of ZigBee Alliance. All trademarks are the property of their respective owners.
6.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
6.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com CC3551E SWRS338 – SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: CC3551E ADVANCE INFORMATION
7 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES September 2024 * Initial Release CC3551E SWRS338 – SEPTEMBER 2024 www.ti.com
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8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com CC3551E SWRS338 – SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: CC3551E ADVANCE INFORMATION
www.ti.com PACKAGE OUTLINE 7.16.9 7.16.9 1.00.80.050.00 2X 5.2 52X 0.4 2X 5.2 56X 0.650.45 5.30.1 56X 0.2250.125 450.250.15 (0.1) TYP (0.17)(0.175) VQFN - 1 mm max heightRSH0056GPLASTIC QUAD FLATPACK - NO LEAD 4229539/B 08/2023 0.08C PIN 1 INDEX AREA SEATING PLANE PIN 1 ID(45X 0.3) SYMMEXPOSEDTHERMAL PAD SYMM 1415 2829 424356 0.1CAB0.05CSEE DETAIL A SCALE 2.000 A35.000 DETAIL ATYPICAL AB C Figure 8-1. CC3551E SWRS338 – SEPTEMBER 2024 www.ti.com
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www.ti.com EXAMPLE BOARD LAYOUT 52X (0.4)(R0.05) TYP 0.05 MAXALL AROUND0.05 MINALL AROUND (6.65) (6.65) ( 5.3) (0.2) TYPVIA (1.28) TYP(1.12) TYP (1.28) TYP(1.12)TYP VQFN - 1 mm max heightRSH0056GPLASTIC QUAD FLATPACK - NO LEAD SYMM SYMM LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE: 12X SEE SOLDER MASKDETAIL1 1415 2829 424356 METAL EDGESOLDER MASKOPENINGEXPOSED METAL METAL UNDERSOLDER MASKSOLDER MASKOPENINGEXPOSEDMETALNON SOLDER MASKDEFINED(PREFERRED)SOLDER MASK DEFINEDSOLDER MASK DETAILS Figure 8-2. www.ti.com CC3551E SWRS338 – SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: CC3551E ADVANCE INFORMATION
www.ti.com EXAMPLE STENCIL DESIGN (6.65) (6.65)16X (1.08) 16X(1.08) (R0.05) TYP (0.64) TYP (0.64) TYP(1.28) TYP (1.28) TYP VQFN - 1 mm max heightRSH0056GPLASTIC QUAD FLATPACK - NO LEAD 4229539/B 08/2023NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLEBASED ON 0.100 MM THICK STENCILSCALE: 12X EXPOSED PAD 5766% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 1415 2829 424356 Figure 8-3. CC3551E SWRS338 – SEPTEMBER 2024 www.ti.com
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www.ti.com 18-Oct-2024 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples XCC3550ENJARSHR ACTIVE VQFN RSH 56 2500 TBD Call TI Call TI -40 to 105 Samples XCC3551ENJARSHR ACTIVE VQFN RSH 56 2500 TBD Call TI Call TI -40 to 105 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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